Bridging The IP Divide
Mike BARTLEY
SVP at Tessolve Semiconductors Part-time Consultant for Alpinum Consulting and Training
A lot has changed since the emergence of the IP-based methodology and it is currently going through a major update. The adoption of an IP-based model has enabled designs to keep filling the available chip area while allowing design time to shrink. But there is a divide between IP providers and IP user. This article from semiengineering describes the tools and standards that can be used to bridge the IP divide.
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Find out how T&VS has helped IP vendors and IP users to document verification intent and enabled reuse from block to chip to the system, and from simulation to silicon.