TechBlick, the leading platform for emerging technologies, is hosting?a live, virtual event on all the technology and applications aspects of digital and 3D additive manufacturing electronics.?The event takes place on 29 & 30 March on the TechBlick?platform (www.TechBlick.com)
It is a unique curated event covering the full spectrum of manufacturing technologies, frontier innovations, and existing and emerging applications from around the world. The event uniquely brings together material suppliers, technology developers, equipment manufacturers, and OEMs.?
On the technology front it will cover all the key technologies of the present and future including inkjet, microdispensing, direct wiring, direct plating, aerosol, jetting and spraying, aerosol, electrohydrodynamic printing, laser induced forward transfer, etc. The technology will be covered for both flat 2D, 2.5, and even free form 3D printing on complex 3D objects.?
The agenda will cover printing of all manners of functional materials including conductive materials, ceramics, quantum dots, OLEDs, high--frequency insulators, PEDOT, organic semiconductor, solder resist, high viscosity pastes, and many more. On the application side we seek to cover most key existing and emerging applications including photovoltaics, mmWave devices, OLEDs, QD-OLED, QLEDs, photodetectors and LEDs, quantum dots, antennas, functional 3D devices, circuits, PCBs, EMI shielding, semiconductor packaging, microLEDs, batteries, and beyond.?
Khasha Ghaffarzadeh, CEO of TechBlick said?"This conference focuses also on advancing the art, addressing long-standing technical limitations and pushing forward manufacturing technologies".?
This event is part of our curated online and onsite conference and exhibition series covering all aspects of printed, flexible, hybrid, textile, wearable, stretchable, and soft electronics.?
Our next onsite event will be in Berlin on 17-18 October 2023 where we expect +600 attendees and 72 exhibitors. You can see some preliminary information here. This is the event where the global printed electronics industry meets and where all the key ideas take shape.?
AGENDA
- AM Syenta "Electrochemical Printing of Multi-Material Electronics"
- FUJI CORPORATION "Digital manufacturing of 3D electronics with low temperature SMT"
- TCL Corporate Research "The Development of IJP-QLED Display towards its Commercialization"
- XTPL S.A. "High-resolution printing of functional materials for advanced high-density 3D interconnections"
Networking & Speed Dating
- Cicor Group "(TBC) Embedded sensors in plastic parts including the subsequent connection using Aerosol Jet Printing"
- Fraunhofer ENAS "Robot-guided inkjet printing for the production of printed electronics on arbitrary 3D components"
- Quantica "(TBC) Jetting of High Viscosity Functional Multi-Materials"
- HighLine Technology "(TBC) Multi-head ultra-fine dispensing of high-viscosity pastes for PV and other applications"
- J.A.M.E.S GmbH "Accelerating the development of AME"
- IMTEK - University of Freiburg "StarJet technology - Direct molten metal printing for printed, flexible, and 3D electronics applications"
- Neotech AMT "Real and Emerging Applications of 3D Printed Electronics"
- Essemtec AG "Novel automatic repair of populated PCBs in a cost-effective and adaptive way"
Meet The Speakers & Exhibition
- Exaddon "Microscale Metal 3d Printing"
- University of Texas "(TBC) Selective micro-scale sintering for next-generation semiconductor bumps"
- Fraunhofer IKTS "Additively printed hybrid ceramic components for microsystem applications"
- Dracula Technologies "Inkjet-Printed Flexible and Free Design OPV Modules for Indoor Application"
Networking & Speed Dating
- Electroninks "Metal Complex inks for semiconductor packaging applications"
- NRCC "(TBC) Direct printing of functional 3D objects using vat"
- NASA "Additive Manufacturing of Electronics for Space Applications"
- North Carolina State University "Direct EHD Printing of VIA Interconnects towards Multi-Layer Flexible and Stretchable Electronics"
- Ntrium "Introduction to Mass-producible Component Level EMI Shielding Technology"
- Elephantech "Inkjet-Printed PCBs, a paradigm shift to a needs-driven approach to decarbonization"
- Nanyang Technological University "Digital manufacturing for mass customization of printed electronics using aerosol jet printing technology"
- Fraunhofer IAP "High Resolution EHDJET Printing of PEDOT:PSS for Display Applications"
Networking & Meet The Speakers
- Grenoble INP-Pagora "Rapid prototyping of 3D electronics using direct ink writing and 6-axis robots"
- Lithoz "(TBC) 3D ceramics for 3D printed electronic applications"
- Domicro "Inkjet Printing For Applications With Small Feature Sizes"
- Centre de Transfert de Technologies Ceramiques "Digital printing for ceramic based electronics"
Networking & Meet The Speakers
- Notion Systems "Replacing subtractive with additive processes in electronics production - making an impact with inkjet"
- Karlsruhe Institute of Technology (KIT) "The Aerosol-on-Demand jet-printing principle:a novel concept for 3D-printed electronics"
- Humboldt-Universit?t zu Berlin "Combinatorically Inkjet-Printed Metal Halide Perovskite Optoelectronic Devices"
- University Paris Cité "Perspectives and Pitfalls of Inkjet-Printed Electronics: A Chemist's Point of View"
Networking & Meet The Speakers
- ImageXpert "(TBC) Machine vision to automate industrial production of micron-sized electronics with inkjet printing"
- Aix-Marseille Université "Laser-induced forward transfer: Improved versatility for printed electronics applications"
- SAULE Technologies "Update on the technology progress of printed perovskite PV"
- Celanese Micromax Microcircuit and Component Materials "Designing Ink-Jet and Nozzle Dispensable conductive/dielectric Inks for electronic applications"
Networking & Meet The Speakers
- ETSMTL "Inkjet-Printed Materials and Flexible Hybrid Electronic (FHE) Devices"
- University of Montreal "Drop-on-demand laser-assisted bioprinting of cells and hydrogels"
- Trinity College Dublin "2D materials and MXenes for digital printed electronics"
- University of Michigan "Integrating Area-Selective Atomic Layer Deposition with Electrohydrodynamic Jet Printing to Enable Additivve Nanomanufacturing"
- Seoul National University "(TBC) Maskless patterning AgNWs"
- FTMC "Selective Surface Activation Induced by Laser (SSAIL) – technology of electric circuit formation on various 3D dielectric surfaces"
