BGA Soldering Quality Detection Techniques by X-Ray Imaging

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nina yan

nina yan

Experienced PCB/PCBA/Turnkey BoxBuild Expert | Whatsapp Number +86 158 0730 1005 Email : [email protected]

发布日期: 2022年5月19日

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BGA Soldering Quality Detection Techniques by X-Ray Imaging

by Licky Li March 18, 2022

Introduction: BGA is a typical high-density packaging technology. Its characteristics are that the chip pins are distributed under the package in t...

Posted in BGA, PCB, PCB design, PCB fabrication, PCB Layer stack-up, PCB layout, PCB manufacturing

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