BGA Soldering Quality Detection Techniques by X-Ray Imaging

BGA Soldering Quality Detection Techniques by X-Ray Imaging

Jeff He Jeff He

Jeff He

Experienced PCB/PCBA/Turnkey BoxBuild Expert | click FOLLOW to get more insightful manufacturing tips . WhatsApp number: +86 15807301005 Email: [email protected]

发布日期: 2022年3月22日
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BGA Soldering Quality Detection Techniques by X-Ray Imaging

by Licky Li?March 18, 2022

Introduction: BGA is a typical high-density packaging technology. Its characteristics are that the chip pins are distributed under the package in t...

Posted in?BGA,?PCB,?PCB design,?PCB fabrication,?PCB Layer stack-up,?PCB layout,?PCB manufacturing

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