BGA package

The full name of BGA is Ball Grid Array (PCB with ball grid array structure), which is a packaging method in which an integrated circuit adopts an organic carrier board. It has: 1. Less package area; 2. Increased function and increased number of pins; 3. Self-centering during soldering on PCB, easy to tin; 4. High reliability; 5. Good electrical performance and low overall cost Features. PCB boards with BGA generally have many small holes. Most of the customer's BGA via holes are designed to have a finished hole diameter of 8~12 mil. The distance between the surface of the BGA and the hole is 31.5 mil as an example, which is generally not less than 10.5 mil. The via hole under BGA needs to be plugged, the BGA pad is not allowed to be ink, and the BGA pad is not drilled.

BGA Packaging

The I/O terminals of the BGA package are distributed under the package in the form of circular or columnar solder joints in an array. The advantage of BGA technology is that although the number of I/O pins has increased, the pin spacing has not decreased but increased. The assembly yield is improved; although its power consumption increases, BGA can be soldered by the controlled collapse chip method, which can improve its electrical and thermal performance; the thickness and weight are reduced compared with the previous packaging technology; the parasitic parameters are reduced, The signal transmission delay is small, and the frequency of use is greatly improved; the assembly can be coplanar welding, and the reliability is high.

When it comes to BGA packaging, we have to mention Kingmax's patented TinyBGA technology. TinyBGA is called Tiny Ball Grid Array (small ball grid array package) in English, and it belongs to a branch of BGA packaging technology. It was successfully developed by Kingmax in August 1998. The ratio of chip area to package area is not less than 1:1.14, which can increase the memory capacity by 2 to 3 times when the memory volume remains unchanged. Compared with TSOP packaged products , which has a smaller volume, better heat dissipation performance and electrical performance.

The memory packaged with BGA technology can increase the memory capacity by two to three times without changing the memory volume. Compared with TSOP, BGA has a smaller volume, better heat dissipation performance and electrical performance. BGA packaging technology has greatly improved the storage capacity per square inch. Under the same capacity, the memory products using BGA packaging technology are only one-third the size of TSOP packaging; in addition, compared with traditional TSOP packaging, BGA packaging way to have a faster and more efficient way of dissipating heat.

BGA package type

1. PBGA

(Plasric BGA) The carrier is an ordinary printed circuit board substrate, generally a multi-layer board composed of 2~4 layers of organic materials. The chip is connected to the upper surface of the carrier by wire bonding, and the surface of the plastic molding carrier is connected with a eutectic. Solder ball array. For example, the Pemtium II, III, and IV processors in the Intel series CPU all use this packaging method. There is also CDPBGA (Carity Down PBGA), which refers to the chip area (also known as the cavity area) with a square depression in the center of the package.

Advantages: The cost of packaging is relatively low; compared with QFP, it is not susceptible to mechanical damage; it is suitable for large-scale electronic assembly; the font is the same as the PCB substrate, and the thermal expansion coefficient is almost the same. The reliability impact is also less.

Disadvantages: easy to absorb moisture.

2. CBGA

The (CeramicBGA) carrier is a multi-layer ceramic, and the connection between the chip and the ceramic carrier can be in two forms: wire bonding; flip-chip technology. For example, the PemtiumI, II, and PemtiumI Pro processors in the Intel series CPU all use this packaging method.

Advantages: excellent electrical and thermal properties; both good sealing; compared with QFP, it is less susceptible to mechanical damage; suitable for electronic assemblies with I/O numbers greater than 250.

Disadvantages: Compared with PCB, the thermal expansion coefficient is different. When the package size is large, it will lead to the failure of thermal cycle function.

3. FCBGA

(FilpChipBGA) adopts rigid multilayer substrate

4. CCGA

CCGA is another form of CBGA when the size is larger than 32*32mm, the difference is that solder posts are used instead of solder balls. Solder pillars are attached to the ceramic bottom using eutectic solder connections or direct casting.

The advantages and disadvantages are roughly the same as CCGA, the difference is that the solder pillars can withstand the stress caused by different CTEs and can be used in large-size packages.

5. TBGA

The carrier adopts double metal layer tape, and the chip connection is realized by flip-chip technology.

Advantages: Lighter and smaller package can be achieved; suitable for more I/O packages; good electrical properties; suitable for mass electronic assembly; high reliability of solder joints.

Disadvantages: easy to absorb moisture; high cost of packaging.

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