Better Preparation of Molybdenum Targets for TFT-LCD

In order to prepare molybdenum targets that meet the requirements of TFT-LCD conductive films, the following measures can be taken:

1. Select high-purity (99.99%) molybdenum powder as raw material.

2. During the cold isostatic pressing process, ensure that the molybdenum powder particles are evenly dispersed and the particle size distribution is a single-peak normal distribution, especially d(0.5) should be less than 10μm. Use the "swing powder loading method" or "pier powder loading method" and press at a pressure greater than 200MPa to reduce porosity.

3. During sintering, use 400MPa pressure to press the slab, and use low-temperature sintering to promote rapid densification while maintaining a fine grain structure. For slabs under different pressures, adjust the appropriate sintering heating rate, such as 3K/min for 100MPa pressed slabs, and 1K/min for 400MPa pressed slabs.

4. By forging and rolling the slab, a molybdenum target with a more uniform and fine structure can be obtained. This treatment method helps to form specific textures, such as {100}<011> rotated cubic texture and {111}<112>, {111}<110> surface textures.

5. Control the deformation of the molybdenum target to 80%, and perform appropriate annealing treatment on this basis (for example, at 1373K and 1473K), so that a sputtered film with low roughness (<21nm) and good thickness uniformity can be obtained.