Bench-Top Reactive Ion Etching System
RIE is an anisotropic plasma etching system that is designed to deliver optimum performance at low cost with high degree of process repeatability. It can handle wafers up to the size of 100mm (or 4 inches) in diameter. Depending on how it is configured, the system can be used for etching of oxides, nitrides, polymers, silicon, and III-V compounds. The system can accommodate a wide range of process gases. Standard are 3 mass flow controllers for precise control of gas flow rates with 1 more slot available for future expansion.
RIE is a plasma etching technique used to etch fine patterns onto semiconductor materials, typically in the production of integrated circuits (ICs). It combines both chemical and physical processes, using reactive ions to etch away specific areas of a material, creating ultra-precise patterns. This capability is vital for the production of high-density, high-performance semiconductors found in everything from smartphones to advanced AI processors.
KEY BENEFITS? ?
???Self-contained benchtop unit requiring minimal space? ? ?
??13.56 MHz 300W RF generator with automatic?matching network delivering excellent repeatability? ? ?
??8.4-inch touchscreen for ease of operation?? ? ?
? Automatic pressure control with throttle valve available? ? ?
? Multiple choices of etching processes:? ? ? ? ?
o Chemical etching (isotropic, fast rate)? ? ? ?
??o Reactive ion etching (anisotropic, medium rate)? ? ? ? ??
o Physical etching (anisotropic, slow rate)
GAS SUPPLY UNIT? ? ?
??Three (3) Mass Flow Controllers? ? ? ? ?
领英推荐
o?Argon (Ar)? ? ? ? ?
o?Tetrafluoromethane? (CF4)? ? ? ?? ? ? ? ?
o?Oxygen (O2)? ? ?
? One Open Mounting Bay for Additional MFC? ? ?
? ?” Pneumatic Gas Valves? ? ?
? 4 Channel, GMC1200, MFC Controller
For personalized support, reach out to our expert:
Mr. Rajendra kumar Singh (DGM)
?? Call: +91 9717004203
?? Email: [email protected]
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