Barriers of Semiconductor Wafer Industry

The technical parameters of semiconductor wafers are high, and the technological links need to be accumulated for a long time.

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Technical certification:

? The core technology of semiconductor includes monocrystalline silicon, slicing technology, grinding technology, polishing technology, extension technology, etc., with a high degree of technical specialization. The monocrystalline silicon technology is the core technology, which determines the key technical indicators such as the size, resistivity, purity, oxygen content, dislocation, crystal defects, etc. In the process of crystal growth, attention should be paid to temperature control and drawing rate. The wafer grinding and polishing process determines the wafer thickness, surface smoothness, surface cleanliness, surface granularity, warpage and other indicators. The emphasis of epitaxial technology is to ensure the uniformity of epitaxial layer thickness and resistivity.

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Client certification:

? Chip manufacturers are cautious about introducing new suppliers, and the certification cycle is long. Semiconductor silicon wafer is an important raw material for chip manufacturing enterprises to produce semiconductor products. Chip manufacturers are very cautious in introducing new suppliers. In order to ensure the stability and consistency of product quality, they need to go through a long certification cycle. Usually, the chip manufacturers will ask the suppliers to provide some silicon chips for trial production. After the internal certification is passed, the chip manufacturing enterprise sends the products to the downstream customers and gets the approval of the customers. Then, the silicon wafer supplier is certified and the purchase contract is formally signed.

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And capital scale: The semiconductor silicon wafer industry is a capital-intensive industry, which needs to reach a certain sales scale to make a profit. To form a large-scale production of semiconductor silicon wafers, a large amount of investment is needed. At the same time, due to the large investment in fixed assets in the early stage of semiconductor silicon wafer enterprises, they need to form a certain sales scale in order to make profits. The early stage operation pressure is high, and the gross profit margin may be negative.

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Semiconductor enterprises need compound talents. The R&D and production process of semiconductor wafer is complicated, involving the cross fields of solid state physics, quantum mechanics, thermodynamics and chemistry. Therefore, compound talents with comprehensive professional knowledge and rich production experience are needed.

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Ultrasonic spraying system can use advanced spraying technology to accurately control the flow rate, coating speed and deposition amount. Low-speed spray molding defines atomization spray as an accurate and controllable pattern, so as to avoid overspray when producing a very thin and uniform coating.