Awakening to the Reality: The Urgent Need for Components Incoming Inspection in Electronics
Typical defects found on electronic components

Awakening to the Reality: The Urgent Need for Components Incoming Inspection in Electronics

Dear Engineer,

As trailblazers at the forefront of innovation, we pride ourselves on our commitment to pushing boundaries and embracing technological advancements. Yet, amidst our progress, there exists a glaring gap in quality assurance practices within the electronics industry—a gap that has persisted unnoticed for far too long.

Let's address the elephant in the room: the absence of technological incoming inspection for electronic components. Despite widespread assumptions, the reality is starkly different. While high-end components may undergo functional tests and built-in tests (BIT), the vast majority lack any form of inspection. We place unwavering trust in our component sources, often overlooking critical factors such as age, handling stress, fraud, and statistical defect rates.

Consider this sobering statistic: the fraudulent industry associated with counterfeit electronic components is valued at a staggering $70 billion. When components are sourced from jobbers, limited sample testing by specialized labs is common. However, this approach offers insight into only a small subset of components, leaving a notable gap in comprehensive incoming inspection. The infiltration of counterfeit components into our supply chain poses significant risks to product integrity and customer safety—risks that cannot be ignored.

Moreover, the industry-standard defects rate as outlined by IPC-A-610 and IPC-J-STD-001 stands at 100-200 ppm, indicating that approximately 5% of boards contain defective components on average. With such substantial risks at stake, the absence of incoming inspection is a precarious oversight.

Even if you believe your operations are safeguarded by highly sophisticated pick-and-place or AOI machines, the truth is that these machines primarily focus on process efficiency rather than component quality and authenticity.

But amidst these challenges, a beacon of hope shines bright: Cybord.

Cybord's groundbreaking approach to quality assurance is revolutionizing the way we inspect electronic components. By leveraging onboard cameras from pick-and-place and Automated Optical Inspection (AOI) machines, Cybord conducts comprehensive visual inspections of every component mounted on PCBs.

Powered by advanced AI algorithms trained on billions of examples, Cybord's system delivers rapid, reliable, and real-time defect detection. Gone are the days of blind trust; Cybord ensures compliance with industry standards, safeguarding against counterfeit components, contamination, corrosion, foreign object debris, peeling, and structural defects.

?What truly sets Cybord apart is its proactive approach to quality assurance. Unlike traditional methods reliant on post-mortem analysis, Cybord's system identifies and addresses defects in real time, minimizing the risk of downstream failures and quality issues.

Cybord is a software that seamlessly integrates into existing production lines, offering minimal disruption and effortless installation. With no hardware requirements, manufacturers can achieve 100% visual inspection without sacrificing efficiency or productivity.

The future of quality assurance is here, and it's time to embrace change. Let's leave behind outdated practices and blind trust, and together, let's shape a future where quality and authenticity are non-negotiables.

Join us on this transformative journey. Together, we can revolutionize the electronics industry—one component at a time.

Louis Y. Ungar

Test Engineering, DFT and Management Consultant / Instructor and President at A.T.E. Solutions, Inc. and BestTest Group

1 年

I reposted this with the following message: Passive components are not tested or measured before they are soldered onto circuit boards. Once on the circuit boards, they are only tested for catastrophic defects, such as shorts, opens or for parametric values with expensive in-circuit ATEs. We should be open to new ideas on how to detect faults produced by out of spec passive components.

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