ASIC FIB

ASIC design and development go through multiple design reviews from early stage until tapeout.

During tapeout schematic vs. layout should be compared and any discrepancy should be carefully resolved.

Still, there are miscommunications and simple overlook occur.

These errors cause functionality at most and sometime performance issues only.

Functionality issues are the one where the circuit does not function at all.

Whereas performance issues are the one where the circuit functions yet do not meet all some performance metrics.

Functionality issues prevent any evaluation of the circuit.

Given ASIC tapeout expenses and timeline to fix any functional issue, there could be alternative option, FIB.

Focused Ion Beam, FIB allows to alter some changes to top layer of silicon for debugging and testing.?

The easiest changes are to the metal layer connectivity.

ORTENGA?helps businesses to identify required technical features to realize their business goals.

Partner ORTENGA?in your next product concept, design, and development to realize that business goal.

ORTENGA has seasoned engineering from Autonomous Automotive, SATCOM, radar, Smart City, WiFi, and Mobile Terrestrial Radio Communications industries in Antenna, ASIC, HW, FW, and SW engineering disciplines.

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