Arlon laminates for PCB

Arlon laminates for PCB

Introduction to Arlon Laminates

Arlon is a leading global manufacturer of high performance laminate and prepreg materials used in the production of printed circuit boards (PCBs). Founded in 1959 and headquartered in Rancho Cucamonga, California, Arlon specializes in thermoset resin technology and innovative solutions for the electronics industry.

Some key things to know about Arlon laminates:

  • Offers a diverse range of laminate and prepreg products for PCB fabrication, including epoxy, polyimide, ceramic-filled, and high-temperature materials.
  • Manufacturer of one of the most well-known brands of PCB materials - Arlon? 85N, 45N, 35N.
  • Supplies laminates and prepregs in sheets, rolls, and machined parts for various PCB applications.
  • Has manufacturing facilities in California and Belgium.
  • Known for quality, consistency and technical expertise in high-performance PCB materials.
  • Used in advanced electronics, aerospace, defense, telecom, industrial and other technology sectors.

This article provides an in-depth look at Arlon laminates for PCBs, their properties, applications, and how they are used in PCB fabrication.

Arlon Laminate Materials for PCBs


Arlon offers a wide selection of laminate and prepreg materials optimized for different PCB applications and requirements:

Epoxy Laminates

  • Arlon 85N - Standard FR-4 material, low cost, suitable for consumer electronics. Good electricals and thermal performance.
  • Arlon 45N - Enhanced property FR-4, higher Tg, low Dk. Use where higher reliability needed.
  • Arlon 35N - High performance FR-4 with Tg >170°C. For industrial controls, instrumentation.
  • Arlon 25N - Very high Tg (>180°C) epoxy system. For high temp applications.
  • Arlon DiClad Series - B-stage reinforced epoxy laminates. Low CTE for improved reliability.

Polyimide Laminates

  • Arlon TP - Kapton-based thermoplastic polyimide for flex PCBs. UL94 V-0.
  • Arlon VT - LCP-based, UL94 V-0 rated. Extremely low CTE, ductile polyimide.
  • Arlon PI - High temp polyimide laminates. Lead-free and RoHS compliant.

Ceramic Filled PTFE Composites

  • Arlon CR - Ceramic filled PTFE composites. High frequency, low loss materials.

High Temperature Laminates

  • Arlon HT - Bismaleimide triazine (BT) resin system. For 270°C+ applications.

Key Properties of Arlon Laminates

Arlon laminates offer a balanced set of electrical, mechanical, thermal and chemical properties that make them suitable for different PCB applications:

Electrical Properties

  • Dielectric constant (Dk) - affects signal propagation, impedance control and crosstalk.
  • Dissipation factor (Df) - determines dielectric losses in AC circuits.
  • Volume resistivity - leakage current and insulation resistance.

Mechanical Properties

  • Tensile strength - resist mechanical stresses during handling and assembly.
  • Flexural strength - ability to withstand bending forces.
  • Coefficient of thermal expansion (CTE) - thermal dimensional stability.

Thermal Properties

  • Glass transition temperature (Tg) - maximum long-term operating temp.
  • Decomposition temperature (Td) - onset of chemical breakdown.
  • Thermal conductivity - ability to conduct heat.

Chemical Properties

  • Water absorption - determines moisture uptake and reliability.
  • Copper peel strength - adhesion to copper foil.
  • Chemical resistance - compatibility with PCB fabrication processes.

Arlon laminates offer a good balance of these properties and provide the electrical, thermal, and mechanical integrity needed for most PCB applications. The properties can be tuned based on material composition and reinforcement to meet specific design requirements.

Applications of Arlon Laminates in PCBs


Arlon laminates are used in the production of PCBs across a diverse range of end applications:

Consumer Electronics

Low-cost, FR-4 grade laminates like Arlon 85N are widely used for TVs, smartphones, tablets, PCs, and other consumer devices.

Industrial Controls

Enhanced FR-4 laminates provide the higher reliability needed for PLCs, process controls, instrumentation, etc.

Automotive Electronics

High Tg Arlon laminates meet under-hood thermal requirements and CAF resistance.

Aerospace and Defense

Arlon's polyimide and ceramic-PTFE materials meet mil-spec performance for avionics and other aero applications.

Telecom/Datacom

Arlon VT (Vectra) used extensively in 5G, networking switches, servers due to electricals, CTE, and thermal management.

High Temperature

Arlon HT (bismaleimide triazine) used for down-hole, well-logging, geophysical services over 270°C.

High Frequency/RF

Low loss, tight dielectric constant control of Arlon CR laminates ideal for RF/microwave boards.

High Reliability

For medical, test and measurement equipment. Arlon VT, PI, 25N enhance MTBF.

This table summarizes some of Arlon's key laminate grades and their target applications:

MaterialKey PropertiesApplicationsArlon 85NStandard FR-4, low costConsumer electronicsArlon 45NEnhanced FR-4, higher TgIndustrial controlsArlon 35NHigh perf. FR-4, Tg > 170°CInstrumentationArlon VTLow CTE, V-0, ductileTelecom, datacomArlon PIHigh temp polyimideAerospace, defenseArlon CRPTFE composite, low lossHigh frequency RF

How Arlon Laminates are Used in PCB Fabrication


Arlon laminates and prepregs are used through the PCB fabrication process as follows:

Laminate Sheets

Laminate sheets consist of glass fabric impregnated with epoxy, polyimide or other resin. SHEETS are available in standard thicknesses (0.002" to 0.125+") and panel sizes. They are typically directly bonded with copper foil.

Prepreg Materials

Prepregs are B-stage (partially cured) resin-impregnated fabrics. They flow under heat and pressure to bond layers in multilayer PCBs. Standard thicknesses are 0.001-0.006", rolls or sheets.

Inner Layers

Completed inner layers have etched copper patterns on both sides. They are made from laminate sheets directly bonded to copper.

Layup

Multiple sheets of prepreg and inner layers are stacked up in the book sequence of a multilayer PCB. Alignment and lamination follow.

Multilayer Lamination

The prepreg layup goes through high temperature and pressure in a laminating press to fully cure the resin and form a solid multilayer board.

Outer Layers

Outer copper layers are processed with imaging, etching, and plating to complete the conductive patterns on the external surfaces.

Finishing

Routing, drilling, edge plating, solder mask/silkscreen printing, electrical testing, and other finishes complete the PCB fabrication.

The combination of Arlon laminates, prepregs, and fabrication processes enables production of multilayer PCBs to meet the electrical, thermal, and mechanical performance requirements for a range of demanding applications.

Benefits of Using Arlon Laminates in PCBs

There are several benefits that Arlon laminates provide when used in PCB design and manufacturing:

  • Material diversity - Arlon offers a wide range of resin systems (FR-4, polyimide, hydrocarbon, ceramic-filled, etc.) to meet different application needs.
  • Consistent quality - Manufacturing controls ensure uniformity and repeatability for stable, reliable PCB performance.
  • Expert technical support - Arlon's application engineers help optimize material selection and fabrication for each application.
  • Supply chain reliability - Global manufacturing and distribution ensures steady supply of materials.
  • Compliance with standards - Arlon laminates meet industry standards for quality and safety - UL, IPC, ISO 9001, RoHS, REACH, etc.
  • High performance - Arlon's materials enable advanced PCBs meeting tighter electrical, thermal, mechanical specifications.
  • Increased reliability - Materials like Arlon VT polyimide improve PCB reliability with lower CTE and increased thermal endurance.

By utilizing Arlon laminates, PCB designers and fabricators can benefit from these advantages and produce boards capable of meeting the increasing performance demands of advanced electronics.

Typical Properties of Key Arlon Laminates


Here is a comparison of properties for some of Arlon's commonly used laminates for PCBs:

PropertyArlon 85NArlon 45NArlon 35NArlon VT (Vectra)Dielectric Constant (Dk)4.34.24.13.3Dissipation Factor (Df)0.0200.0150.0140.0030Tensile Modulus (psi)1.7 million1.6 million1.2 million540,000Tensile Strength (ksi)25303020CTE - X,Y (ppm/°C)1612117Glass Transition Temp (Tg - °C)140170180217Decomposition Temp (Td - °C)340340340400

FAQ

Q: What types of resin systems are used in Arlon laminates?

A: Arlon uses a variety of resin systems including epoxy, polyimide, bismaleimide triazine (BT), hydrocarbon, PTFE composites, and thermoplastic polyimide. This allows material properties to be tailored for different PCB applications.

Q: Can Arlon laminates be used for high frequency and RF boards?

A: Yes, Arlon's ceramic-filled PTFE composites like CR1000 and CR7900 provide excellent high frequency performance with tight dielectric constant control, low loss, and low coefficient of thermal expansion.

Q: Are Arlon laminates available in different thicknesses?

A: Yes, Arlon offers laminate sheets ranging from 0.002 inches up to 0.125 inches thick. Prepregs are available in thicknesses from 0.001 to 0.006 inches. This supports fabrication of multilayer boards with varied dielectric/conductor spacing.

Q: What types of certification do Arlon laminates have?

A: Arlon laminates are certified to various industry standards including UL, IPC, and military (mil) specifications. Many products meet UL 94 V-0 flammability rating. Arlon also meets quality standards such as ISO 9001.

Q: How are Arlon laminates supplied to PCB fabricators?

A: Arlon laminates and prepregs are available in sheet or roll formats. They can also supply machined panels and kits with all materials required for a specific multilayer stackup configuration to streamline fabrication.

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