April 2024 Industry Index Analysis Report - Overall Heat Levels Flat, Sensing/Isolation/Interface Materials Becoming Hot

In April, the market heat generally maintained the level of March, general-purpose materials are still in the de-stocking stage, prices did not boost. Major IC companies generally sluggish financial results in the first quarter, reflecting the industrial adjustment is still continuing. New energy vehicle penetration out of the rapid expansion of the period, coupled with domestic substitution to intensify the intensity of competition, car core manufacturers in the demand and price are ushered in the test.

Industry dynamics, April 2, Wenye announced the completion of the acquisition of 3.8 billion U.S. dollars of Future Electronics; reported rumors of Samsung upward SSD product offer up to 25%; industry rumors UMC to obtain the RF major Qorvo foundry orders, will be indirectly supplied to the iPhone 168, Microchip announced that it will be 40 nm production capacity from TSMC Kumamoto plant; reported rumors TSMC will be in the U.S. Construction of the third plant; Infineon announced that it jumped to the first place in the share of automotive MCU, data statistics from TechInsights. 9, the news came out that Micron intends to raise the offer in the second quarter, the range of more than 20%. 10, Chipotle Consulting reported that the earthquake on the impact of the Q2 memory shipments of less than 1%; SEMI report statistics in 2023, the amount of global semiconductor equipment shipments fell slightly by 1.3% to 106.3 billion U.S. dollars, mainland China's equipment investment growth of nearly 30%; report rumors Western Digital confirmed HDD and SSD is in the price hike. 11 and 15, Microchip announced Neuroix AI Labs and VSI, pointing to FPGA and automotive field. 12, Renesas announced that it will restart the Kofu factory in Japan to increase the production of power devices. 16, report Samsung will increase NAND flash production by 30% in Q2, but overall it is still limited to 50% start rate or less.17 On the 17th, reports circulated that Tesla initiated global layoffs; Micron announced that it was the first in the industry to launch 232-layer QLC flash memory.18 On the 18th, MegaChips announced the launch of the GD32L235 series of low-power MCUs.19 On the 19th, SK Hynix announced that it will collaborate with TSMC on the development of HBM4 memory. 22nd, STMicroelectronics announced to expand SiC wafer supply contract with Roma's SiCrystal; hard disk maker Seagate announced price increase. 23rd, Samsung announced to start mass production of the ninth-generation V-NAND, bit density increase of 50%; Intel announced that the 18A process will be adopted by the U.S. Department of Defense to produce advanced chips. Armor Man announced sampling of new UFS 4.0 flash memory. 24th, Volkswagen reportedly initiated mass layoffs; news broke that Samsung and AMD signed an HBM3E 12H memory supply agreement. 25th, TSMC announced a new 1.6nm-class process, with mass production expected in 2026. 25th, Micron confirmed it had received $6.4bn in direct subsidies from the U.S. Chip Act and related tax credits. 26th. Sealing and testing plant Epistar Electronics announced the sale of its Suzhou Jinglong Technology all the shares. 29, the report rumors SK Hynix to consider building a new DRAM factory; the Italian government announced that the completion of the year tens of billions of euros in semiconductor investment; report rumors of a number of local IC manufacturers to confirm the price hike, including the Shenzhen Chuangxin micro, Zhejiang Asia core micro, Wuxi Huazhong core micro, Nanjing Zhilingxin, etc., the Department of response to the rising cost of copper and other metals. On the 30th, it was reported that TSMC in the second phase of the park 1.4 nm plant expansion extension; UMC announced that 3DIC program has been adopted by customers, the first product for the RF front-end module.

MCU heat generally return, industrial sensing class more hot spots appear

In April, the mainstream controller materials still occupy half of the proportion of hot search TOP 10, but its search volume compared to last month failed to break through, and the price is even reduced, reflecting that the market is still in a state of de-stocking, pending the influx of high-volume demand.4 hot materials in April, ADI's RS-485/422 isolation transceiver ADM2587EBRWZ than the previous month's search volume has been significantly increased, and the material in this year's search volume has shown a monthly growth trend; TI's switching regulator TPS5450DDAR in April search volume doubled, and industrial sensing class more hot. Material in this year's search volume has shown month by month growth trend; TI's switching regulator TPS5450DDAR in April search volume doubled growth, beyond the previous months; ST's accelerometer LIS3DHTR in April to create a higher search volume than in March, but also significantly exceeded the previous level. However, in terms of price, none of the above mentioned non-materials have significantly boosted, reflecting that the current demand level is not enough to drive prices. Elsewhere, TI's discontinued Darlington tube ULN2803ADWR is still at the top of the list; AMS's low dropout regulator AMS1117-3.3 also has strong heat, but with large price fluctuations.

Demand for Industrial Materials Concentrated, Domestic Materials Emerged

In April, inventory fluctuations in the TOP 10 can be seen in a number of demand growth points, covering analog, controller, audio DSP, isolation materials, etc., are presented in the search volume growth, inventory decline in the form of the index, and these hotspots contain a number of domestic brands of materials, reflecting the development of domestic substitution is worth paying attention to. In addition, SK Hynix a DDR4 memory due to demand growth trend into the list, and the original factory's recent price increase trend is consistent. Other aspects, Infineon, ON Semiconductor two general-purpose materials show out of the inventory situation, demand pressure, and the original factory earnings report is not vibrant corroborated.

IC Demand and Supply

In April, the market generally maintained the same level as last month, STM materials, general-purpose analog materials, low-voltage MOSFETs and other categories of prices did not significantly boost, reflecting that in the case of sufficient spot, demand has not yet recovered, the inventory is still to be completely digested. Part of the isolation, optocoupler and interface materials heat growth, and domestic manufacturing upgrading is closely related to the April also emerged as part of the hot search for domestic materials, reflecting the deepening of the process of domestic substitution. In addition, in early April after the earthquake in China and Taiwan, memory and NAND flash memory emergence of the demand for goods, contributing to the price to continue to maintain the upward trend. Storage manufacturers also intend to continue to maintain price increases, improve revenue for the vigorous development of HBM products.