Apply Wire bonding PBGA or Flip Chip PBGA?

The IC should be packaged using wire bonding or Flip Chip technologies? Before we use and will evaluate involved like cost, price, signal speed, performance, and longevity.

As per discussion from the engineer's team, We found the obvious issues are cost, performance, and package size. They are core drivers in selecting either wire bonding or flip chip interconnecting methods. As we know, For instance, cellular and portable consumer electronic products often demand the use of flip chip packaging to achieve their small form factor and high-speed needs. While in the other cases, we verified it's more excellent and has more advantages with the existing material costs, flexibility, and equipment or tools to use wire bonding for typically with I/Os in the range of 156-654.

Many advantages are dependent on the specific applications for which the device is intended. And all positive and negative being one point that is cost. Along with technologies improve smaller and smaller. We knew that the important industry driver today is the cost and its driving decisions.

Such as package materials, Surface Mount Technology assembly area, testing, PCB yield, reliability, and performance.

Conclusion: Both wire-bonding and flip-chip will continue to coexist as growing technologies into the foreseeable future. Choose the better suitable one after your evaluation.