Applications for 2.5D Technologies

Let's take a look at the program of the workshop "Thin Film Technology | Future Applications of 2.5 D Materials" - Discover the possibilities of 2.5D structuring and the technologies, materials and applications already in use.

Plan your participation now - Click here to register.

In his lecture "Capturing CO2 from air with thin film technology", Dr. Hans De Neve will present a technology developed by Carbyon for extracting CO2 from the air, which is based on a thin film of K2CO3 on an activated carbon carrier. Carbyon is thus making an important contribution to climate protection.

The presentation "Spatial ALD of electrocatalyst layers for PEM electrolysis" by Dr. Paul Poodt , SparkNano is dedicated to the production of PEM electrolyzers for the generation of green hydrogen from water. As a result of Spatial ALD technology, the use of limited raw materials such as Ir or Pt can be significantly reduced in this sector. He will also present opportunities for technology up-scaling.

In his lecture "2.5D and 3D Integration Technologies for Advanced Electronics Packaging", kai zoschke from the Fraunhofer IZM will present the ongoing miniaturization and simultaneous functional expansion of electronic products and technological solutions for this. In particular, he will focus on silicon interposers and active integrated circuits with TSVs, which can be manufactured with the help of wafer level packaging - high-density 2.5D or 3D system integration concepts will be shown and explained in detail using application examples.

Let us take you into new fields of application and inspire you to new ideas! The program is available for download on our website - CLICK HERE.

Supported by: Henri Fledderus , Solliance Solar Research ; Auke Jisk Kronemeijer , TNO / Holst Centre , Ando Kuypers , TNO