APEC, Wide Bandgap and Thermal Management

APEC, Wide Bandgap and Thermal Management

A Look Ahead to APEC 2022

By Maurizio Di Paolo Emilio

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The?Applied Power Electronics Conference (APEC)?focuses on the technological aspects of power electronics. This conference involves all designers as well as business people who want to understand the advances in the power electronics market.

OEMs of equipment using dc-dc power supplies and converters, as well as designers of electric motors, motor drives,?GaN and SiC,?electric vehicles?and many other topics will be the focus of APEC from March 20 to 24. Let’s have a look at the main news about the companies that will be attending the event.

Aspencore plans to attend in person, and I’ll be there to meet a lot of people and talk electronics with them. It’s not to be missed!

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An Approach to Thermal Management of High-Power PCBs?

By Stefano Lovati

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The entire power-electronic sector, including?RF applications?and systems involving high-speed signals, is evolving toward solutions that offer increasingly complex functionalities in ever-smaller spaces. Designers face increasingly demanding challenges to meet system size, weight, and power requirements, which include effective thermal management, starting with the design of the printed-circuit board.?

High-integration–density active power devices, such as?MOSFET transistors, can dissipate a significant amount of heat and therefore require PCBs that can transfer heat from the hottest components to ground planes or heat-dissipating surfaces, operating as efficiently and effectively as possible. Thermal stress is one of the main causes of malfunctioning of power devices, as it leads to a degradation of performance or even a possible malfunction or failure of the system. The rapid growth of the power density of devices and the constant increase in frequencies are the main reasons that cause excessive heating of electronic components. The increasingly widespread use of semiconductors with reduced power losses and better thermal conductivity, such as wide-bandgap materials, is not in itself sufficient to eliminate the need for effective thermal management.?

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Keeping Cool and Calm in Tight Environments — The GaN Way?

By Dhaval Dalal?and?Rajesh Ghosh

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The landscape for power adapters used to power everyday electronic devices ranging from phones to laptops has changed considerably since the introduction of USB-PD specifications and through its evolution. While?USB-PD?ensures wide-ranging compatibility, the power adapter design becomes somewhat more challenging: now, the power adapter has to support a wide range of output voltages (as opposed to a single output voltage for captive use adapters). Meanwhile, the end user’s desire for lighter, smaller adapters continues. Gallium nitride power switches have been introduced in recent years to address these dual requirements.?

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