The Advantage Comparisons between CC2640R2L and EFR32BG22

The CC2640R2L was recently launched by TI (Texas Instruments), it is a 2.4 GHz wireless microcontroller (MCU) supporting Bluetooth? 5.1 features: LE Coded PHYs (Long Range), LE 2-Mbit PHY (High Speed), Advertising Extensions, Multiple Advertisement Sets, as well as backwards compatibility and support for key features from the Bluetooth? 5.0 and earlier Low Energy specifications. CC2640R2L and EFR32BG22 both use a single-core software development kit (SDK) and a rich toolset to share a common and easy-to-use development environment. TI’s low-power wireless microcontroller CC2640R2L can send and receive radio frequency signals with a larger range.

The Bluetooth module RF-BM-4044B2 launched by RF-star Technology based on the CC2640R2F chip has achieved a good response in the market. CC2640R2L, as a low-cost version of CC2640R2F, is lower in price.

Judging from the Bluetooth protocol supported by the chip, CC2640R2L supports BLE 5.1 protocol. It can use AOA/AOD for indoor positioning, which is very suitable for improving the performance of Internet of Things (IoT) applications. EFR32BG22 supports BLE 5.2 protocol, and it supports LE Audio function.

What is the difference between the CC2640R2L and EFR32BG22?

In terms of cores, CC2640R2F is a 48 MHz ARM? Cortex?-M3 core, and CC2640R2L has 275 KB non-volatile memory, including 128 KB in-system programmable Flash, up to 28 KB system SRAM, of which 20 KB is ultra-low leakage SRAM.

EFR32BG22 is a 38.4 MHz ARM Cortex-M33 core. It includes 352 KB Flash, 32 KB RAM and is available in a QFN32 package. From the terms of cores, the performance of EFR32BG22 is much higher than that of CC2640R2L, and in terms of Flash and RAM, EFR32BG22 has more resources.

EFR32BG22 supports Bluetooth 5.2 SoC, which is very suitable for low-cost applications. It is an ideal choice for applications such as consumer electronic remote controls, portable medical equipment, sports, fitness and health equipment, connected homes, building automation and security, etc.

CC2640R2L:

Microcontroller

• Powerful Arm? Cortex? -M3
• Up to 48 MHz clock speed
• 275 KB of nonvolatile memory including 128 KB of in-system programmable flash
• Up to 28 KB of system SRAM, of which 20 KB is ultra-low leakage SRAM
• 8 KB of SRAM for cache or system RAM use
• Supports over-the-air upgrade (OTA)

RoHS-compliant packages

• 5 mm × 5 mm RHB VQFN32 (15 GPIOs)
• 7 mm × 7 mm RGZ VQFN48 (31 GPIOs)

Peripherals

• All digital peripheral pins can be routed to any GPIO
• Four general-purpose timer modules (eight 16 bit or four 32 bit timers, PWM each)
• UART, IIC, and IIS
• Real-time clock (RTC)
• AES-128 security module
• Integrated temperature sensor

Low power

• Wide supply voltage range
• Normal operation: 1.8 V to 3.8 V
• External regulator mode: 1.7 V to 1.95 V

RF section

• 2.4-GHz RF transceiver compatible with Bluetooth low energy 5.1 and earlier LE
• specifications
• Excellent receiver sensitivity (–97 dBm for BLE), selectivity, and blocking performance
• Programmable output power up to +5 dBm
• Single-ended or differential RF interface

EFR32BG22:

Microcontroller

• 38.4 MHz ARM Cortex?-M33 core
• 352 KB Flash
• 32 KB RAM
• QFN32 package
• up to 0 dBm (2.4 GHz) maximum TX power
• Excellent receiver sensitivity -98.9 dBm
• Widely used in Bluetooth LE data transmission, location services and Bluetooth Mesh low-power node applications

• The wide selection of MCU peripherals
• Analogue to Digital Converter (ADC)
• Up to 18 General Purpose I/O pins with output state retention and asynchronous
• Interrupts
• 8 Channel DMA Controller
• 1 × Enhanced Universal Asynchronous Receiver/Transmitter (EUART)
• 2 × IIC interface with SMBus support
• Precision Low-Frequency RC Oscillator to replace 32 kHz sleep crystal
• RFSENSE with selective OOK mode
• Die temperature sensor with +/-1.5 degree C accuracy after single-point calibration

Wide Operating Range

• single power supply
• 1.71 V to 3.8 V
• -40 °C to 85 °C

RF-star has launched the CC2640R2L module, which has a lower cost and high performance. As early as January 21st, 2019, the Bluetooth SIG announced the Core specification 5.1, introducing the long-awaited AoA/AoD features. AoA/AoD is a positioning algorithm based on the angle of arrival angle/ angle of departure. The Bluetooth 5.1 device senses the arrival /departure direction of the transmitting node signal and calculates the relative position or angle between the arrival node and the departure node. Then use triangulation or other methods to calculate the location of the unknown node, which is very suitable for indoor positioning applications of the Internet of Things.

Now more and more manufacturers support the Bluetooth 5.1 which has many advantages in indoor positioning. The module with CC2640R2L chip has a lower cost and supports BLE 5.1, which can meet more needs of users. For example, the strong comprehensive performance RF-BM-4077B1L and RF-BM-4055B1L module launched by RF-star.

RF-star also launched the EFR32BG22 chip module RF-BM-BG22A, supporting the latest Bluetooth 5.2 LE Audio. Now it is on the market. With its powerful M33 core, RF-BM-BG22A will have excellent performance in low-cost IoT solutions with its rich chip resources.

RF-star has focused on the Bluetooth field for more than ten years and has rich experience in solution design. The Bluetooth modules of RF-star performed pretty well.

RF-star is a well-known and reputable wireless RF solution provider and low-power RF core device supplier. Its products include a wealth of TI series products, such as CC2640R2L, CC1310, CC2541, CC1352, CC2652, CC2640R2F. The professional technical support team provides professional customized services for every client. For more TI solutions, please contact me. Samples could be provided for evaluation.