6 principles that need to be followed in the heat dissipation of FPC

Heat dissipation is the ability of a part, whether a circuit or any other component, to take the heat that's being generated by a component or an element of the design and to distribute it, dissipate it, and make the heat go away, for lack of a better phrase. This prevents the temperature of the part from continuing to elevate as the device is operated.

With the continuous development of science and technology, the application of FPC?is also more and more widely, but the requirements for FPC are also getting higher and higher, so the heat dissipation of flexible circuit board becomes more and more important, let us talk about it in detail below.

FPC stands for?flexible circuit board with the simplest structure, which is mainly used for connection with other circuit boards. For flexible board, it can be divided into: single-sided board, double-sided board, multi-layer board, flexible board, rigid-flex board and special process board according to the structure and technology required by industrial production.

6 principles that need to be followed in the heat dissipation of FPC

1. Place the heat source as close to the cooling surface as possible.
2. In the direction of air flow, the components that are more sensitive to heat should be distributed in the "upstream" position.
3. In the case of forced air convection, the downstream high components should have a certain distance from the heat source.
4. In the case of forced air convection, the higher components should be distributed downstream of the heat source.
5. The components that generate heat farther apart are dispersed, so that the heat per unit area is smaller.
6. In the case of forced air convection, the tall and elongated elements should be aligned with the direction of air flow.

We see a number of flex circuit designs that have either high-temperature components that generate a lot of heat or are required to carry a high level of current, which in and of itself, has the opportunity of creating heat.

If you don't manage that heat, you can run into some significant reliability problems.

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