5G Antenna PCB Design Specifications

With the advent of the 5G era, new frequency spectrums are constantly being introduced to meet capacity requirements, but the antenna resources are limited, requiring higher antenna integration and more arrays. From the perspective of antenna evolution, in the 5G era, sectorization is still the main form of macro base station antenna coverage. The PCB is the main carrier of the mobile antenna veneer. The PCB size of the 5G large-scale array antenna is large and requires high performance stability. It is necessary to use a hydrocarbon resin system material with high hardness and good dimensional stability. To prevent failures and haloing precautions and recommended practices:

1) There is a direct correspondence between the vertical chemical degumming and the halo size of the 5G antenna PCB material of the hydrocarbon system. The greater the degree of degumming, the larger the halo. In addition, vertical chemical degumming has a certain influence on the heat resistance of hydrocarbon system materials. Excessive degumming will lead to the phenomenon of copper foil bubbling. It is recommended that vertical chemical debonding be avoided as much as possible during PCB processing.

2) From the halo data with different hole numbers, there is no obvious correspondence between the PCB halo and the number of holes, indicating that within 2000 holes, the number of holes is not the key factor affecting the quality of the PCB processing of the hydrocarbon material system antenna. The drill wear picture provided by the drill manufacturer also shows that the hydrocarbon antenna PCB in the 2000 hole has little wear on the drill.

3) The heat resistance of the samples made in board factory A this time is significantly lower than that of the samples made in board factory B. Comparing the difference between the two, it is believed that the residence time after drilling is different.

4) Plasma has a significant impact on the roughness of the hole wall of the antenna PCB. When the plasma is excessive, the roughness of the hole wall will be too large and the hole copper will be bent. Therefore, it is necessary to explore the plasma parameters to match the processing requirements of the hydrocarbon antenna PCB.

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