2024 DRAM market keep booming

A few days ago, I saw a message on the Internet saying that there is a forecast that global DRAM revenue will surge to US$98 billion in 2024, with a year-on-year growth of up to 88%, or about 90%.

As we all know, as a highly concentrated market, the DRAM market share is mainly concentrated in Samsung Electronics, SK Hynix Hynix, and Micron Micron Technology.

Global Storage Observation Analysis pointed out that from the performance of the global DRAM market over the years, the TOP6 manufacturers accounted for more than 80% of the global DRAM market share, including Samsung Electronics, SK Hynix Hynix, Micron Technology, Nanya Technology (Nanya), Winbond, and Powerchip Semiconductor° (PSMC).

According to data analyzed by previous industry institutions, the global dynamic random access memory° (DRAM) market sales reached US$76.8 billion in 2023, and it is expected to reach US$145.54 billion in 2030, with a compound annual growth rate (CAGR) of 9.7% from 2024 to 2030.

Specifically, in the DRAM market in 2023, Samsung and SK Hynix account for about 67% of the market share, Micron Technology accounts for 28.5%, and the remaining less than 10% of the market share is occupied by Nanya Technology (Nanya), Winbond ° (Winbond), Powerchip Semiconductor (PSMC) and other manufacturers.

Perhaps, many people are not too familiar with Powerchip Semiconductor. Powerchip Semiconductor Manufacturing Co., Ltd. (PSMC) is a semiconductor manufacturer engaged in wafer foundry in Taiwan, China. Its business scope covers dynamic random access memory (DRAM), non-volatile memory (Flash) manufacturing and wafer foundry.

Perhaps, many people are not too familiar with Powerchip Semiconductor. Powerchip Semiconductor Manufacturing Co., Ltd. (PSMC) is a semiconductor manufacturer engaged in wafer foundry in Taiwan, China. Its business scope covers dynamic random access memory (memory), non-volatile memory (flash) manufacturing and wafer foundry.

The head office is located in Hsinchu Science and Industrial Park, Hsinchu City, Taiwan Province, China. The founder is Huang Chongren and the current general manager is Xie Zaiju. Powerchip currently has three 12-hour wafer fabs (P1, P2, and P3) and two 8-hour wafer fabs. The 12-hour wafer fab is currently the largest memory chip manufacturing company in Taiwan.

As a very representative DRAM manufacturer in Taiwan, Nanya Technology Co., Ltd. was established on March 4, 1995. It is committed to the research and development, design, manufacturing and sales of DRAM (dynamic random access memory), and has established marketing points in the United States, Europe, Japan, and the mainland. Its largest shareholder is Nanya Plastics Co., Ltd. of Formosa Plastics Group. Nanya Technology has become a world-class supplier of memory and related product manufacturing services. Although its market ranking is still behind Micron Technology, Samsung Electronics, and SK Hynix, it has already possessed a certain global status.

Winbond Electronics Co., Ltd. was founded in Hsinchu Science Park in September 1987, and was officially listed on the Taiwan Stock Exchange in 1995. In July 2008, its headquarters moved to the Central Taiwan Science Park, with the 12-hour wafer factory as the main research and development and production base. The product process technology covers a wide range, including 0.11um~70nm products.

Winbond Electronics' main DRAM products include Specialty DRAM, as well as Mobile SRAM and Low Power SDRAM RAM series products can be widely used in four major fields, including consumer, communication, computer peripherals, and automobile electronics. There are also high-end DRAM-GDDR products that target application markets such as personal computers, game consoles, and multimedia.

In addition to the two representative companies in Taiwan, Nanya Technology and Winbond Electronics, there are also Changxin Storage, Fujian Jinhua, Beijing Ingenic, and Unigroup Guoxin in mainland China that focus on the DRAM field.

Founded in 2016, Changxin Storage is the largest DRAM memory chip manufacturer in mainland China. The company is headquartered in Hefei and has R&D and production bases in Beijing, Shanghai, Shenzhen and other places. Changxin Storage's products are widely used in computers, servers, mobile devices and other fields.

Changxin Storage focuses on the research and development, production and sales of dynamic random access memory chips (DRAM). Its self-developed DDR4 memory chips fill the gap in the domestic DRAM industry. Blanks

Founded in 2016, Fujian Jinhua is one of the largest DRAM memory chip manufacturers in mainland China. The company is headquartered in Fuzhou and has R&D and production bases in Beijing, Shanghai, Shenzhen and other places. Fujian Jinhua's products are widely used in computers, servers, mobile devices and other fields.

Fujian Jinhua actively deploys in the field of memory chips and is committed to the research and development and production of DRAM chips. Despite some challenges, Jinhua continues to work hard in technological innovation and industrial cooperation.

Beijing Junzheng's memory chip products include SRAM, DRAM and Flash. It has unique technical advantages in the field of embedded memory chips.

For example, in the fields of smart wearables and smart homes, Beijing Junzheng's memory chips provide guarantees for the efficient operation of equipment.

Unigroup Guoxin has deep technical accumulation in the field of memory chips, and its products include special DRAM, NAND Flash, etc. It has played an important role in the promotion and application of domestic memory chips.

In this sense, the global DRAM market is mainly concentrated in the "Big Three" Samsung Electronics, SK Hynix and Micron Technology. Although China's DRAM manufacturers have developed rapidly in recent years, there is still a big gap compared with the Big Three.

Among them, there is a packaging substrate manufacturer of HOREXS in mainland China. The factory has started to manufacture packaging substrates for various types of memory, including DRAM, in 2009, which has also accumulated rich manufacturing experience for HOREXS. In 2024, in order to cope with the growing market demand, HOREXS DRAM plans to build a second mSAP (Modified Semi-Additive Process) production line in 2025. mSAP technology is an advanced packaging process that can improve production efficiency and product performance. The establishment of the second mSAP production line will significantly enhance HOREXS's DRAM packaging substrate production capacity, ensuring that it can meet the growing market demand. This will not only help improve the company's competitiveness in the market, but also provide customers with more stable supply guarantees. Through technological upgrades, HOREXS DRAM will be able to provide higher performance and more reliable products to meet customer needs for high-end applications. The capacity expansion plan is not only aimed at meeting market demand, but also reflects HOREXS's support and commitment to customers with DRAM substrate needs. By improving production capacity and technology, HOREXS's DRAM packaging substrate can better support customers' business development and help customers maintain high competitiveness in the fierce market competition.

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