2000c dry film circuit shift

2000c dry film circuit shift

This article:

With the rapid development of dense circuit board 3mil / 3mil, 4mil, 4mil line thick/line/design already is the mainstream clearance in products such as mobile phone board, high-grade game card board, etc, in the process of making these dense circuit board, to play a key role in the dry film process, will lead to careless operation namely open/short circuit scrap, and often the manufacturer will exist some never seen "new" problem. This paper is the factory appeared line dry film offset the cause of the problem are discussed, hereinafter referred to as "sling dry film" phenomenon.

Second, to jilt dry film "sling description: dry film" is in fact a line of a section of dry film and copper surface separation, deviation to another line, cause as picture shows the general.

1. On board plane bending.

2. All in straight lines in dense.

3. Dry film after displacement place did not leave attached with a trace.

4. Dry film line not broken.

5. Jilt dry film area is small, the general only 1-2 line to jilt dry film.

6. Bending parts color and other part consistent color.

7. Don"t usually happen. Infiltration plating

Three, may cause analysis:

As is known to all, the most direct reason jilt dry film for dry film and copper surface adhesion outside factors by low or loose to dry film, so each equipment designedly follow-up work parameters, such as grinding plate, state trigger to wait, but avoid were not found working parameters have offset, proof in the present each work parameters under normal conditions still appear afore-mentioned problems, therefore we do the following abnormal condition analysis:

1. Roll board, dry film underneath have copper grains.

2. Roll board before after the process of rush board wipe loose dry film.

3. Dry film in blunt board process by foreign bodies. Wipe loose

4. Grinding plate high-pressure pump leaking oil.

5. Grinding plate board isn"t ideal. Before treatment

Four, follow-up test:

To further certify that the above jilt dry film with a certain equipment whether the inevitable contact, we hereby do the following each equipment cross test:

1. Test: in different grinding respectively trigger, roll triggers, blunt trigger simulation test.

Conclusion: all found a jilt dry film phenomenon, and a higher percentage, reason to jilt dry film has nothing to do with fixed machine generated.

2. Improve roll plate bar, no pressure to 45,000 batch sex sling dry film phenomenon, but there were few jilt dry film phenomenon.

Five, the simulation experiment:

1. Roll board, dry film underneath have copper grains

Due to production board face different copper for validation, clean surface to jilt dry film copper grain of influence, we do as follows test:

Methods: take size differ copper grain on the board - roll plate - the normal process to hold leak board.

Results: test are 2pnl jilt dry film phenomenon.

Sling dry film phenomenon description: dry film after displacement at both ends of the left in place by copper traces attached with a grain jacked up the dry film color hair white.

Conclusion: the such reasons.

2. Roll board, blunt board after the process before wipe loose dry film

Because the difficult to control, artificial homework to verify whether the jilt dry film for artificial homework, test as follows: paster caused by different slab, after the strength and Angle and wipe dry film, knock the normal process to hold leak board.

Results: test are 3pnl jilt dry film phenomenon.

Sling dry film phenomenon description: can see have obvious rub marks and dry film after displacement impressions left, dry film lines have fracture.

Conclusion: the such reasons.

3. Dry film in blunt board process by foreign body loose and wipe dry film rejection

Methods: take production board lots, blunt board before to ensure there is no check carefully wipe respectively in different flowers, then rush board, all rush trigger holding leak board.

Results: jilt dry film had not been found.

Conclusion: blunt board process causelessness wipe loose dry membrane surface foreign leads to jilt dry film.

4. High-pressure pump leaking oil

Because oil cleave to board, it will affect the dry film and copper surface adhesion, lead to dry film loose and send directly, therefore we jilt dry film take high-pressure pump oil and anointed surface and in normal do on board to hold leak board.

Results: test are 2pnl jilt dry film phenomenon.

Phenomenon description: large area to jilt ganmo, dry film vertical panels, but different degree the jilt dry film.

Conclusion: high-pressure pump oil caused by clinging to board jilt dry film, not the jilt dry film reasons. Meanwhile check grinding machine high-pressure back to circle WuYouJi in cylinder and water. (high-pressure pump oil will have this phenomenon)

5. Grinding surface processing bad trigger

Grinding plate nozzles, nozzle and line roll are raised with different degrees of oily shape scale, washing section on the scale on the lower surface caused by dry film adhesion jilt dry film.

Methods: take the scale on a surface, wipe to normal process to avoid board - holding leak board.

Results: test are 12pnl jilt dry film phenomenon.

Phenomenon description: dry film and current jilt same characteristics.

Conclusion: scale is the one of the reasons why jilt dry film.

The follow up the current # 1, # 2 and # 3 grinding machine, all found their washing section there are different levels of black spots, dirt, therefore we respectively with HCl in (5%) will the above three machines, nozzles, trip roll to wipe it, and nozzle spray cleaning, until the clean water urn annex. In addition, in order to prevent the scale problems occur again, us to formulate methods. Supervise production departments to achieve 1 times/month above maintenance, not seen since then, and then the rejection of the above phenomenon dry film appear.

Six, last word:

Grind the scale is the trigger the real reason jilt dry film, scale problems could easily, so strict maintenance manufacturers ignore body and accessories, grinding plate to improve dry film processes to jilt dry film problem great help, hope this can some enlightens to related counterparts.

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