中国在第一代半导体领域与全球存在较大差异，在第二代半导体材料领域已有一些突破迹象，而在第三代半导体领域，由于第三代半导体发明和应用的时间尚短，各国的研究水平相差不远，业界专家一致认为国内存在弯道超车的良机。
二十一世纪以来，以碳化硅（SiC）、氮化镓（GaN）为代表的第三代半导体材料开始崭露头角，之后随着中国“十四五”规划的提出、以及全球科技产业对于“碳达峰、碳中和”的目标达成共识，第三代半导体新材料凭借高击穿电场、高热导率、高电子饱和速率以及抗强辐射能力等优异特性，成为了支撑5G基建、新能源产业、特高压、轨道交通等领域的核心技术。在新基建的风口下，第三代半导体行业迎来黄金发展期。
After entering the 21st century, the third-generation semiconductor materials, led by silicon carbide(SiC) and gallium nitride (GaN), have begun to bloom. Thanks to the proposal for the 14th Five-Year Plan and the consensus achieved by the global tech industry to peak carbon dioxide emissions and achieve carbon neutrality, such materials have become the core technologies supporting 5G infrastructure, new energy industry, ultra-high voltage and rail transit, relying on its high breakdown electric field, high thermal conductivity, high electron saturation rate, strong radiation resistance and other excellent characteristics. Riding the opportunities brought by the new infrastructure initiatives, the third-generation semiconductor industry ushers in a golden development period.
自贸易战以来，中美关系一直处于微妙状态，在传统的一、二代半导体行业，美国拥有绝对优势的技术、专利、市场份额，可以在多个环节打压中国，以华为为代表的企业从海外采购零部件和芯片制造技术正面临越来越多的困难。自主可控一直是当下内循环最重要的逻辑。同时，随着物联网、大数据和人工智能驱动的新计算时代的发展，对半导体器件的需求日益增长，对器件可靠性与性能指标的要求也更加严苛。以碳化硅和氮化镓为代表的第三代半导体开始逐渐受到市场的重视，国际上已形成完整的覆盖材料、器件、模块和应用等环节的产业链，全球新一轮的产业升级已经开始。中国在第一代半导体领域与全球存在较大差异，在第二代半导体材料领域已有一些突破迹象，而在第三代半导体领域，由于第三代半导体发明和应用的时间尚短，各国的研究水平相差不远，业界专家一致认为国内存在弯道超车的良机。
Since the onset of trade war, China-US relations have poised to be delicate. In the traditional first- and second-generation semiconductor industries, the US overtook China in various fields by virtue of its absolute advantages in technology, patent, and market share. The enterprises exemplified by Huawei are facing mounting difficulties in purchasing spare parts and chip manufacturing technologies from other countries. As such, developing autonomous and controllable technology constitutes the most important logic behind the current internal circulation. Along with the advance of new computing era bolstered by IOT, big data and AI, the demand for semiconductor devices is increasing, and the requirements for device liability and performance indicators tend to be more stringent. In this context, the third-generation semiconductors, notably SiC and GaN, have gradually been recognized in the market. Internationally, a complete industry chain spanning material, devices, modules and applications has been formed, and a new round of industrial upgrade has kicked off. In fact, China lagged behind the global leaders in the development of first-generation semiconductors, but some breakthroughs were made in the second-generation of semiconductors. The industry experts agree that the development of third-generation semiconductors gives China a rare chance to become a leader given that all countries stand at a similar research level because the invention and application are still in the early stage.
随着行业继续发展和应用不断落地，各国在第三代半导体领域的部署情况如何？国内外发展差距是否会快速缩小？第三代半导体核心应用场景的切换将呈现怎样的路径？价格会呈现怎样的变化趋势以及对渗透率将产生什么影响？各细分应用领域的市场规模及增速如何？氮化镓器件行业以及国内头部企业当前是怎样的发展现状？诸多关键问题都将在本次报告中逐一解读。
What is the deployment of different countries in the field of third-generation semiconductor as the industry develops and the applications are implemented? Will the development gap at home and abroad narrow at a fast pace? What path will the third-generation semiconductor core application scenarios change take? What is the price change trend and how will it impact on the penetration rate? What is the market size and growth of each application segment? What is the current development status of GaN industry and domestic leading enterprises? In this report, those questions will be answered in a detailed manner.
凯盛研究TMT组2022年1月出版《新基建系列报告四：中国第三代半导体行业研究（GaN篇）》，本报告内容主要分为四个部分：第三代半导体行业概览、氮化镓行业分析、氮化镓企业分析以及研究总结。其中行业部分通过大量的案头研究和专家访谈，对行业发展、性能对比、技术壁垒、产业链、应用市场结构、全球部署情况、价格变动趋势、竞争格局、市场规模及增速、行业展望等进行了全面的分析。企业分析部分，本报告主要从各企业的主营业务、发展历程、团队建设、公司结构及分子公司业务情况、产品分析、产能分析、研发投入与技术水平、经营模式、经营情况、供应链分析、核心竞争力、未来发展规划等方面等出发，与业内资深专家进行深度交流，同时结合大量一手调研、案头研究以及历次项目研究的经验撰写而成。除目录外，正文内容约55页，适合需要了解及研究中国第三代半导体行业的现状及未来展望的客户参考。
In Jan 2022, Capvision TMT Team will release the New Infrastructure Series Report IV: Research on China’s Third-Generation Semiconductor Industry (GaN). The report is comprised of four parts: overview of the third-generation semiconductor industry, analysis of GaN industry, analysis of GaN enterprises, and research conclusion. The industry part serves to provide a comprehensive analysis of industry development, performance comparison, technology barriers, industry chain, application market structure, global deployment situation, price changes, competitive landscape, market size and growth, and industry prospect by utilizing desktop research and interviews with experts. The enterprise part elaborates on the main business, development history, team establishment, company structure and business of subsidiaries, product analysis, production capacity analysis, R&D investment as well as technical level, business model, business status, supply chain analysis, core competencies, and future development plan, based on first-hand research, desktop research and in-depth exchanges with senior industry experts. Besides the contents section, this report totals 55 pages, which will be most beneficial to clients interested in studying and understanding the status quo and future prospect of China’s third-generation semiconductor industry.
◆??报告目录 Contents
1. 第三代半导体概览 Overview of the Third-Generation Semiconductors
???第三代半导体产业链 Industrial Chain
???半导体材料综合对比 Comprehensive Comparison of Semiconductor Materials
???性能分析 Performance Analysis
???应用分析 Application Analysis
???国内外发展分析 Analysis of the Development at Home and Abroad
???行业发展现状 Industry Development Status
???第三代半导体应用发展路径 Application Development Path
???第三代半导体应用市场结构 Application Market Structure
???第三代半导体各国部署情况 Deployment of Different Countries
???价格变动趋势及渗透率变化 Changes in Price and Penetration Rate
???全球及国内市场规模预测 Forecast on the Domestic and Global Market Size
???行业发展趋势展望 Industry Development Trend and Prospect
2. 氮化镓行业分析 Analysis of GaN Industry
???氮化镓行业发展历程 Development History
???氮化镓结构特性及制备 Structure Properties and Manufacturing
???氮化镓分类、特性及应用 Classification, Features and Application
???氮化镓产业链及代表厂商 Industrial Chain and Representative Manufacturers
???驱动因素分析：政策支持 Driving Factor Analysis: Policy Support
???驱动因素分析：应用市场发展 Driving Factor Analysis: Application Market Development
???应用市场：消费电子 Application Market: Consumer Electronics
领英推荐
???应用市场：5G新基建 Application Market: 5G New Infrastructure
3. 氮化镓企业分析 Analysis of GaN Enterprises
??3.1 英诺赛科 Innoscience
???公司概况 Company Profile
???管理层及团队建设 Management and Team Establishment
???产品分析 Analysis of Products
???制造工艺 Manufacturing Process
???实验室建设 Laboratory Construction
???公司结构及子公司业务分析 Analysis of Corporate Structure and Subsidiaries’ Business
???产能分析 Analysis of Production Capacity
???经营情况分析 Analysis of Business Status
???市场占有率及影响力 Market Share and Influence
???外部合作 External Cooperation
???竞争优势 Competitive Advantages
???未来发展规划 Future Development Plan
??3.2 三安集成 SAIC
???公司概况 Company Profile
???组织架构及产业链覆盖情况 Organizational Structure and Industrial Chain Coverage
???管理层及团队建设 Management and Team Establishment
???产品分析 Analysis of Products
???研发投入及技术水平 R&D Investment and Technical Level
???产能分析 Analysis of Production Capacity
???经营情况分析 Analysis of Business Status
???供应链分析 Analysis of Supply Chain
???行业地位 Industry Competitive Status
???竞争优势 Competitive Advantages
???未来发展规划 Future Development Plan
4. 研究总结 Research Conclusion
???第三代半导体行业发展 Development of the Third-Generation Semiconductor Industry
???国内氮化镓企业发展 Development of Domestic GaN Enterprises