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Communications Director @ Intel | Media Relations, Communications Planning for Intel Foundry

For those who are curious what we mean by #advancedpackaging in the context of #foundry, listen to this interview between EE Times Nitin Dahad and Intel Foundry's Mark Gardner. Mark does an excellent job breaking down what it is and why it matters - and importantly why Intel's approach is a winner. Great 10 minute conversation. Have a listen.

Santharam K V

IC assembly- Sales/ Business Development(System In Package, MCM, HMC)

8 个月

Another major aspect missing is that the people who take these to the market (sales/BD) should be knowing these technologies at a superficial level so they can be well utilized in market and serve their purpose. Unfortunately we are seeing only the big picture without focusing on the small big things in packaging in India…there is no point in jumping to the advanced level without understanding the basic level advantages that packaging can bring for the industry…

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Rao Tummala

Advisor to Government of India | Emeritus Professor, Georgia Tech /Industry and Academic Pioneer

8 个月

Thanks Mark. I like the system foundry concept a lot. I proposed this concept for India last year. Glad Intel believes in it too.

Max Stepan

IC Substrates in EU // Advanced Packaging // Microelectronics

8 个月

Nice interview with valuable insights! Good to see Intel Corporation ?opening“ up! Wishing the IFS team great success @ Mark Gardner

Felipe Curcio

North America Communications Manager @ Intel Corporation | Social Communications, Public Relations | A citizen of the world in the making crafting technologies stories

8 个月

Nice one!

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