Nuvotronics的动态

Last but certainly not least: Francesca Chiappini will be one of the presenters in the final session of the ESTC Conference in Berlin on Friday September 13. In session AP9_Power Electronics, she will discuss additive fan-out panel-level processing for power #MOSFET devices. So, do not go home just yet, but join this session from 13:45 hrs - 15:00 hrs. #powerpackaging #acccesstoinnovation

Watch the video from Electropages: Electronics News, featuring NOVOSENSE solutions in automotive and industrial applications!

#SouthKorean Semiconductor #Equipment Firms Thrive Amid Rising Demand for #TCBonders The demand for thermal compression (#TC) bonders produced by South Korean semiconductor equipment companies is surging, driven by #Samsung Electronics and #SKHynix increasing their high-bandwidth memory (#HBM) production. TC bonders, essential for HBM production, use thermal compression to bond and stack chips on processed wafers, significantly enhancing #HBM yield. According to industry sources, Samsung Electronics’ subsidiary #SEMES has delivered nearly 100 TC bonders within the past year. Meanwhile, #SKHynix recently signed a 150 billion won (approximately $107.98 million) contract with #HANMI Semiconductor, which holds a 65% market share in TC bonders. The cumulative order value for HBM TC bonders from HANMI Semiconductor to SK Hynix has reached 358.7 billion won, with each unit priced at around 2 billion won. Samsung sources TC bonders from Japan’s #Toray and #Sinkawa, and its subsidiary #SEMES, while #SKHynix obtains its equipment from Singapore’s #ASMPT, #HANMI Semiconductor, and #Hanhwa Precision Machinery. Both companies have been intensifying their #localization efforts since last year to reduce reliance on foreign equipment. SEMES produces TC bonders optimized for the #TC-NCF process, a stacking method for HBM involving the application of a film material each time a chip is stacked. #SEMES recently set a target to achieve over 250 billion won in TC bonder sales, a significant increase from around 100 billion won last year. #HANMI Semiconductor, which co-developed TC bonders with #SKHynix in 2017, supplies equipment for SK Hynix’s #MR-MUF process, which uses an adhesive-like material to bond DRAM chips. Although #HANMI Semiconductor has TC bonders compatible with both #TC-NCF and #MR-MUF processes, it currently supplies them only to SK Hynix and Micron. Market research firm #TrendForce reports that #Samsung plans to produce approximately 130,000 HBM units by the end of this year, nearly #tripling its #production capacity from 45,000 units last year. Similarly, #SKHynix aims to #increase its #HBM production capacity to 120,000-125,000 units by year-end, also nearly tripling from 45,000 units last year. Reference: https://lnkd.in/dMwd9pJx

Have you seen the new PFC w/ 650V GaN HEMT Power Stage IC design with ROHM Semiconductor Americas??

Quick Bytes : #Hanwha Precision Machinery secured a contract to provide #SKHynix with thermal compression (#TC) bonders for #HBM memory chip production, as reported by The Elec. This deal ends the near-monopoly of Hanmi Semiconductor, the previous main supplier of this equipment. Additionally, #ASMPT, partly owned by #ASM International (25%), has also committed to developing a #TC bonder for #SKHynix. Hanwha is scheduled to deliver two #TC bonders by June 10 for testing. The report notes that “SK Hynix was deeply involved in the development of Hanwha’s TC bonder from the beginning.” #TC #bonders use thermal compression to bond and stack chips on wafers that have finished processing. They are used in the production of HBM and 3D packaging which requires lots of bonding during their production. Reference: https://lnkd.in/gJW8F4pP Pic Reference: Wiley Online Library

IEEE Solid-State Circuits Magazine (SSC-M): The article by K. Herman et al. introduces a first European open-source process design kit. Supported open-source tools and workflow are also discussed. The risk posed by electrostatic discharge (ESD) to the yield and reliability of semiconductor devices was acknowledged as early as 1970. This article provides an overview of the historical advancements in ESD protection and explores the future trajectory amid continuous integration. https://bit.ly/4dN5fwD

Have you seen the new PFC w/ 650V GaN HEMT Power Stage IC design with ROHM Semiconductor Americas??

Thermally Robust Photorelays for Semiconductor Testers Requiring just a 1.6V operating voltage, the TLP3412SRLA photorelay from Toshiba Electronics Europe GmbH is highly optimised for use in semiconductor test systems - which are now typical controlled by 1.8V programmable logic hardware. This 1-Form-A (NO) contact type unit has 500Vrms isolation capabilities. The elevated operational temperature capabilities supported (reaching 125°C) mean that it is well aligned with the need for the device under test (DUT) to have high temperatures applied to it - thereby ensuring adequate temperature margin within the equipment. The compactness of this optoelectronics component (with its 1.45mm × 2.0mm × 1.4mm form factor) is another valuable attribute. This allows the demands for densely packed probe cards to be addressed. Its on-state current... READ MORE https://lnkd.in/eZDYMfAw Michelle Shrimpton Natalia Selezneva Birgit Schoeniger Armin Derpmanns Ian Wilson Axel Klein

TSHA2101 demo design is available at Beny-devices for everyone You might notice one of my latest demos in the series "EASY with". Now, all evaluation designs are available. Leveraging its Anisotropic Magnetoresistive (AMR) technology, the TSHA2101 from Taiwan Semiconductor position sensor excels in measuring rotational movements. Having explored various inductive sensors and magnetic switches, I sought a sensor with a faster response to magnetic field changes. The recent release of the TSHA2101 proved to be particularly timely. The sensor's ease of integration significantly streamlined the demo construction. The convenient package format facilitated a straightforward soldering process. ?? Order at Beny-devices under the following link https://lnkd.in/e3H2S9aB ?? If you like my work and would like to transform your ideas into an actual product, ???????? ???????? ???? ???????? ???? ?? ?????????????? here on LinkedIn or ???? ??-???????? to the address in the profile?? ???? ?????? ???????? ???? ?????? ???????? ?????????? ???????? ????? ?? Ring it on my Profile #showyourwork #hwidvorakinfo #whoisjohngalt

#Embedded #Industrial ? In this episode of Chalk Talk, Amelia Dalton and Alex Bahm from Infineon investigate the benefits of Infineon’s SEMPER NOR Flash and how the reliability, long-term data retention, and functional safety compliance make this memory solution a great choice for a variety of mission critical applications. They also examine how SEMPER NOR Flash has … Read More → "Designing for Functional Safety with Infineon Memory — Infineon and Mouser Electronics" https://lnkd.in/gWZjY5xA