迈威迩的动态

We all know that HKMG is an innovation that fueled progress in the rapidly changing semiconductor world. Here's how SK hynix first applied High-K Metal Gate (HKMG) to mobile DRAM(the very first one in the world!), and what exactly it is. ???Find out more in the link below: How SK hynix Broke Barriers in Mobile DRAM Scaling With World-First HKMG Application https://lnkd.in/ef2E7shG

Dell’Oro raises its optical transceiver shipment forecast to reflect faster than expected adoption of ZR pluggable optics and increased demand on hyperscalers backbone bandwidth propelled by large AI clusters. #CoherentPluggables https://spr.ly/6046tZzsi

Upcoming Webinar: What Will the Next Decade of AI Hardware Look Like?: Friday 8 November 2024 - An outline of the ongoing development of specialized AI accelerators and the impact of ARM architectures on the CPU market for HPC; Trends and developments in memory and storage technologies for AI and HPC workloads and the advanced semiconductor packaging technologies to realize next-generation solutions; Examination of the growing role of silicon photonics in high-speed interconnects for HPC and how co-packaged optics will increase bandwidths whilst reducing power consumption; Discussion of the push towards liquid cooling in data centers, driven by increasing AI workloads; Insights from IDTechEx's ten-year forecasting for the HPC market https://dlvr.it/TG1WQt

Silicon photonics enables technology that can integrate hundreds of components into a single device, enabling higher density, lower power and scale. While deployed for years in coherent optical modules to connect telecom networks over extended geographic areas, silicon photonics is now making its way inside data centers to enhance their economics and capabilities. In this blog, we explore how Marvell is using silicon photonics to develop the accelerated infrastructure required for the AI era: https://mrvl.co/3XeCraW

Press Release - At IEDM 2024, imec demonstrates the three critical building blocks of a superconducting digital circuit: NbTiN-based interconnects, Josephson junctions, and MIM capacitors. The devices outperform state-of-the-art superconducting technology and meet the target specifications for superconducting digital systems designed to revolutionize the roadmaps for AI and HPC. Scalable and compatible with CMOS, this breakthrough bridges the gap from lab-scale research to industrial fabrication. Superconducting digital systems promise up to 100x better power efficiency and 10-100x improved performance compared to 7nm CMOS processors. ? Read the full press release: https://lnkd.in/eRKK5AAT

.....and innovation is still pushing Moore's Law Vertically-stacked complementary field-effect transistors (CFETs) are poised to emerge as the natural successor to gate-all-around (GAA) architectures, offering a pathway to continued technology scaling in an era where traditional approaches face diminishing returns. By leveraging the vertical dimension to stack n-type and p-type transistors, CFETs significantly enhance density without the need for additional silicon real estate, enabling the integration of more complex circuits within a shrinking footprint. As the semiconductor industry pushes the boundaries of Moore’s Law, CFETs are positioned to meet the insatiable demand for performance and power efficiency, representing the next frontier in transistor evolution. #mooreslaw #GAAFET #CFET #Transistors

""" "While maintaining highly efficient electro-optical performance, we also generated soliton microcomb on this platform," says Chengli Wang, the study's first author. "These SOLITON microCOMBS feature a large number of coherent frequencies and, when combined with ELECTRO-OPTIC modulation capabilities, are particularly suitable for applications such as PARALLEL coherent LiDAR and PHOTONIC COMPUTING." The lithium tantalate PIC's reduced birefringence (the dependence of refractive index on light polarization and propagation direction) allows dense circuit configurations and ensures broad operational capabilities across all telecommunication bands. The work paves the way for scalable, cost-effective manufacturing of advanced electro-optical PICs """ _______ This is the plan... Chris McGinty Joshua Brewer Luiz von Paumgartten Nicky Clarke ?? This is what I was talking about in our chat earlier.. help me get endorsement so I can submit papers to arxiv and prove it

UCIe 64Gbps will not only power the next generation of chiplets, but also custom HBM4 implementations, to unleash unprecedented bandwidth that is paramount for AI hardware systems. #UCIe #customHBM #AI

The rapid advancement in photonic integrated circuits (PICs), which combine multiple optical devices and functionalities on a single chip, has revolutionized optical communications and computing systems.