IEEE Solid-State Circuits Society的动态

IEEE Solid-State Circuits Magazine (SSC-M): The article by K. Herman et al. introduces a first European open-source process design kit. Supported open-source tools and workflow are also discussed. The risk posed by electrostatic discharge (ESD) to the yield and reliability of semiconductor devices was acknowledged as early as 1970. This article provides an overview of the historical advancements in ESD protection and explores the future trajectory amid continuous integration. https://bit.ly/4dN5fwD

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