IEEE Power Electronics Society的动态

While studying for my Measurements and Instrumentation Course from Book The Art of Electronics, I found an interesting note explaining why ICs can suddenly become discontinued. Here are some main reasons: Obsolescence: Newer, better components make older versions unnecessary. Low Demand: Some ICs don’t sell enough, so they’re discontinued for the manufacturer’s convenience. Lost Schematics: Sometimes, manufacturers lose track of the chip's design, halting production! Production Line Upgrades: New test equipment may delay availability if it's not yet compatible. Manufacturer Closure: When companies go out of business, their ICs disappear with them. This reinforces the need for adaptability in design to handle sudden changes in component availability!

IIRW 2024 welcomes our invited speaker Andreas Martin delivering talk on "Detection and qualification of well charging originating from plasma processing induced charging damage - PID" About Speaker: Andreas Martin received his master′s degree in electronic and electrical engineering from the Technical University of Darmstadt, Germany. He worked in Tyndall Research Institute in Cork, Ireland for several years with a focus on MOS gate oxide reliability, before he started 1998 in the corporate reliability department with Infineon Technologies AG in Munich, Germany. Since then he develops methodologies for fast wafer level reliability (fWLR) monitoring and is in the lead for plasma processing induced charging damage (PID) reliability qualification for all technology nodes in-house and foundry business. He has published several papers and presented tutorials on PID characterization methodologies in recent years. Mr. Martin has served in the JEDEC 14.2 committee for over 25 years, where he currently moderates three task groups: TG142_10 on the definition of a standard for measuring and analyzing PID well charging, TG142_3 for the development of a standard on a reliability stress method for PID gate antennas and TG142_2 on the definition of a guideline on fWLR Monitoring. Abstract: Charging of isolated wells in complex, large integrated circuits during plasma processing has been shown to cause product fails and consequently reduce product yield. A PID failure mode, which is known for over ten years, is now in focus of semiconductor manufacturers aiming for the development of adequate design rules: on one hand checking in parallel all isolated wells, all MOS transistors at the interfaces of isolated wells, metal antennas and the relevant discharging paths, on the other hand keeping the rule set simple that the layout of complex, large integrated circuits can be checked a 100%. In a first step, the understanding, the detection and qualification procedure of the well charging failure mode is vital and the essential basis for the definition of any design rule. These aspects will be described in this work accounting for the findings from literature. Test structures, stress and measurement sequence, protection methods are discussed in detail. Subsequently, the various reported approaches for a comprehensive qualification and design rules demand a general standardization for well charging, which is currently ongoing in a JEDEC 14.2 task group (TG142_10). #iirw #ieee #reliability #conference #workshop #system #device #circuit

Technical Session Digest Submission site opening June 12, 2025 APEC is pleased to announce that Technical Session digest submissions will open in one week for APEC 2025, which will take place March 16-20, 2025, at the Georgia World Congress Center in Atlanta, GA. APEC 2025 continues the long-standing tradition of addressing immediate and long-term interest issues to the practicing power electronics engineering community. Outstanding technical content is provided at one of the lowest registration costs of any IEEE conference. To be considered as a Technical Session paper for APEC 2025, it is advised that your digest/paper should address the following: The challenge to be addressed by the paper. The major results. How does this differ from the most relevant existing literature? https://lnkd.in/eFWcCVrN... https://apec-conf.org/ Sponsors PSMA, IAS, PELS https://www.psma.com/ https://ias.ieee.org/ https://www.ieee-pels.org/

The latest issue of CIE (Components in Electronics) is now available to read online. This month's hot topics include: #medicalelectronics #displaytechnology #humanmachineinterface #EDA #switches - a supplement on #semiconductors plus much more. We hope you enjoy reading it! https://lnkd.in/ddYZwsEJ

This blog explores the 3rd and 4th generation semiconductor substrate materials, which are essential for high-performance power semiconductor devices. The presence of certain elements, even as ultra-trace impurities or dopants, can significantly impact these materials by influencing electron mobility, lattice matching, and optimizing direct bandgap characteristics. Therefore, understanding the ultra-trace elemental composition is very crucial. Glow Discharge Mass Spectrometry (#GDMS) is a highly sensitive analytical technique capable of both qualitative and quantitative analysis of elements at levels as low as parts per billion (ppb). Eurofins EAG Materials Science offers a wide range of services to the semiconductor industry, including advanced microscopy, failure analysis, material characterization, trace elemental analysis, FIB circuit editing, and much more. For further details, read and follow this blog. #EurofinsEAG #GDMS #SemiconductorMaterials #PowerElectronics #FailureAnalysis #TraceElementAnalysis #MaterialCharacterization #HighPerformanceDevices #Eurofins | EAG Laboratories Shanghai

In automotive power modules, two critical metrics are current processing capability (amperes per dollar) and reliability (miles per dollar). Both metrics are closely tied to the current sharing characteristics among parallel-connected IGBT chips. In our recent publication, we present a cost-effective method to enhance current sharing among these chips by introducing slots into the DBC (Direct Bonded Copper) substrate circuit. This approach addresses the stringent requirements of real-world automotive engineering, where both high performance and low cost are paramount. Additionally, our study highlights that the current sharing characteristics of anti-parallel freewheeling diodes (FRDs) are crucial under certain operating conditions. For further details, please refer to our paper: "Guiqin Chang, Cheng Peng, Yuanjian Liu, Erping Deng, Xiang Li, Qiang Xiao, Yongzhang Huang, ‘Optimization and Validation of Current Sharing in IGBT Modules with Multi-chips in Parallel,’ IEEE Transactions on Power Electronics, Volume 39, Issue 12, pp. 15672-15681, Dec 2024," available at

Pins components insertion by machine, help increasing production efficiency, Reduces defect rates. ETS odd-form components insertion machine, your best choose ?? Should you would like to know more, welcome contact and visit us. website: www.ets-dip.com #ETS #EMS #SMT #THT #DIP #Insertionmachine #screenprinter #solderpasteprinter #SPI #AOI #oddformcomponentinsertionmahcine #pnp #pickandplace #ems #smt #pcbmanufacturing #electronicsmanufacturing #electronicsassembly #pcbassembly #pcbmanufacturing #electronicsindustry #electonics #GDK #HTGD

The Mimes R&D team are proud to inform that the new Multi Output RadioHub is ready and prototypes are now ordering. The specs are: - Three high power outputs at max 1.2A, these outputs are designed to power sounders, beacons and gas/flame detectors - Three 4-25mA analogue inputs, and one analogue input for dry contacts - Bluetooth for configuration and wireless provisioning - Several wireless protocols possible (ISA100/WirelessHART/LoRa) - Magnetic activation of Bluetooth configuration Each output is supervised and short circuit protected, both electronically and by PTC, so no fuses to replace. All seven I/O's are designed to be certified according to SIL2 (IEC 61508), when communicating wireless via the ISA100 protocol, tunneling PROFIsafe. The PCB can be powered by a 24VDC power supply, or by a local 24V battery pack. When using the battery solution, the PCB can be operated for months (when the I/O's are inactive), when activated the high power I/O's will consume power from the battery. The whole design follows IEC 60079-7 (Ex ec for zone 2). Please visit the www.mimestech.no link to see our existing (and coming) products! And again, please wait for it..... Soon a new product will be presented!!

With the increasing density of electronic components, particularly with controllers and sensors in high-stress environments, the need for robust protection measures grows. The use of conformal coating is becoming more essential to protect the assembly from its operating environment and ensure reliable performance in harsh conditions. The emergence of sulfide “creep” corrosion as a significant factor creates a need for advanced protection solutions. Don’t miss our paper presentation at the SMTA Harsh Environments Conference where Phil Kinner, Global Technical Director, presents "Conformal Coating Protection vs. Flower of Sulfur Testing; The Natural Evolution of Surface Insulation Resistance Testing" on Thursday, May 16 at 3:15 PM. This exploratory paper breaks new ground by presenting early data from Surface Insulation Resistance (SIR) testing in a Flowers of Sulfur (FoS) environment. This innovative approach provides an alternative viewpoint on evaluating coating effectiveness. Learn more about how to safeguard electronic devices beyond traditional high temperature and high humidity environments. For more information about our other presentations at this event, click here: https://lnkd.in/eWRH6csY

Alhamdulillah, I am thrilled to share that my paper, "Performance Analysis of Thickness Dependency of Control Coefficients of CNTFET," has been published at the 2024 6th International Conference on Electrical Engineering and Information & Communication Technology (ICEEICT). This research dives into how varying thickness affects the control coefficients in CNTFET, potentially leading to significant advancements in their performance and application. For a detail read visit: https://lnkd.in/gdWmDZcU #ieee #ICEEICT2024 #CNTFET #research #innovation #engineering