FCT Solder转发了
FCT Solder's Tony Lentz recently presented his research Fill the Void VII: A Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints at IPC APEX 2024. But don't worry if you weren't there - we have the paper, the presentation AND the video on our website! https://lnkd.in/eTNMjiyP
