It's always a thrilling moment to connect with partners in person, just as we did with Martin Keenan from Analog Devices. Thank you for stopping by our booth at electronicaFair to catch up! We're excited to see what 2025 has in store. #Partnership #AnalogDevices #electronica #TeamDigiKey
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Alliance Memory, Inc. is excited to exhibit at electronica India and productronica India 2024 at Messe Muenchen in Munich, Germany! Join us to explore our latest memory solutions for cutting-edge applications. Don’t miss out on the chance to connect with industry leaders and discover what’s next in memory technology! #TechInnovation #MemorySolutions #Munich #electronicsnews #technologynews
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Extending the life of your devices is the future of #ConsumerElectronics. Learn more at our #CES2025 booth! #CircularEconomy #TechInnovation #BatteryTechnology #DeviceLifeExtension
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?? 3PEAK's first monthly newsletter is here! ?? ?? This is the first edition of 3PEAK’s Devices To Design newsletter, where we highlight our top IC innovations! ?? We are excited to detail how our performance devices support your application-specific needs and can take your design specs to the next level ?? ?? CHECK IT OUT BELOW #chips #innovation #analog
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Hi folks! ?? Renesas just unveiled two new IO-Link devices for Industry 4.0 applications, boosting efficiency and connectivity. Here’s what stands out: ? ?? ?????????????? ???????????? ????: Supports four IO-Link channels with up to 500 mA per channel, reducing PCB size, energy use, and design costs. Built-in overvoltage/overcurrent protection ensures robust operation. ? ??? ???????????????? ???????????? ?????????????????????? ????: Handles dual-sensor input with high precision, offering digital compensation for offset, sensitivity, temperature drift, and non-linearity. Includes a built-in IO-Link stack, eliminating the need for an additional MCU. How do you see these advancing smart factory capabilities? Read the full news below ??: https://lnkd.in/gsug95Yn #IOLink #SmartManufacturing
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From HMI excellence to low-power innovation, Renesas Electronics' RA8 series is shaping sustainable tech. Dive into their tools, partners, and solutions, and see how Future Electronics brings these innovations to you. Mark Britton talked with Valeria Lacatena and Otto Aureliano Rolloff at Electronica '24. Check out the full discussion now! Discover the RA family of MCUs: https://lnkd.in/eYMxV-Yu #FutureElectronics #RA8 #HMI
Driving sustainability with the RA8 advanced MCUs from Renesas
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EPDT’s Products of the Year Candidates (Sponsored by Cree LED) Product: AHV85000/AHV85040 gate drivers Company: Allegro MicroSystems Announced: Early 2024 Supporting GaN-based FETs, Allegro’s AHV85000/AHV85040 isolated gate driver chipset helps to streamline power system designs. The low total common-mode (CM) capacitance exhibited means that electro-magnetic interference (EMI) is kept to a minimum. This chipset can be used in conjunction with external transformers to boost efficiency levels. Propagation delay is kept to <50ns. 7V to 13.2V supply voltages are accommodated.? More information: https://lnkd.in/e8vDGXiT Carsten Himmele Stefan Steyerl Susan Backhaus Anja-Maria Hastenrath Karsten Düchting Bernard Gouverneur Ram Sathappan Vijay Mangtani
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#Smart_Ticketing Market is estimated to grow at a high CAGR >> https://lnkd.in/d_ezdiyN #Smart ticketing is a #ticketing system where a ticket is #stored in a #microchip electronically. This microchip is #embedded on a #card which is known as a #smart card. A smart ticketing #system enables #users and #sellers to provide their #personalized or #customized ticket, which further can be used as #e #ticket for #traveling. ACT Group Atsukè Cammax Conduent Confidex Corethree Cubic Corporation Flowbird Group Giesecke+Devrient HID Global - Formally Lumidigm Hitachi Rail IDEMIA Indra Infineon Technologies INIT Group LIT Transit Ltd. Masabi NXP Semiconductors #smartticketing #ticketingsystem #microchip #electronics #smartcard #eticket #informationtechnology #softwaredevelopment
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In today's rapidly evolving electronics industry, the demand for efficient, compact, and reliable power management solutions is increasing. To meet this demand, Analog Devices has introduced the LTM4644IY chip, a highly integrated DC-DC converter that demonstrates exceptional performance in consumer electronics, medical equipment, communication and networking devices, automotive electronics, and more. For more information, please click:https://lnkd.in/gzTBKpAC
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Last week the 28th Automobil-Elektronik Kongress brought many exciting thoughts around SDV Challenge and potential innovations. Here below my personal highlights and thoughts: - Top OEMs like #BMW, #Renault and #Stellantis?shared common concerns: HW complexity is exponentially growing, security measures are increasing with it as well - Only a fraction of today’s SW platform is standardized, making integration effort a very hard challenge. - Open-Source SW is not for free and majority of the integration and qualification effort is repeated. - There is a clear need to generate a Safe SW platform driven by clear Stack Maintainers. - Francis Chow gave a great speech about how Open Source can help to face the aforementioned challenges and talked about Red Hat effort towards Safety. - SW will define the HW:?OEMs need to define early in advance what to isolate and where to place it in the E/E architecture (safety and power constraints) #Semiconductors vendors highlights: - As NXP Semiconductors we shared our view on how the SDV efforts should be spent on brand differentiation, building strong partnership and enriching the ecosystem to accelerate development time. Great presentation Ray! - Qualcomm brought the challenge of fusing Infotainment and ADAS domain, highlighting the importance to implement the “freedom from interference” principle into their design. - Infineon presented the crucial role of power semiconductors in SDV, showing how the new?E/E are only possible with safe & secure computing and high speed networsk. - Another key aspect for SDV is networking capability, indeed Rosenberg highlighted new options beyond copper wiring, presenting the advantages to build vehicle networking backbone based on glass optical-fiber. Last but not least, it was very interesting to see both #AppliedEV, T-System and #AuroraLabs demos based on both NXP Semiconductors S32G and i.MX devices! It was a pleasure for me to learn from key expert and understand how much work there is still ahead of us to concretely shape the future of #SDV !
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?? MIC Electronics: Innovating for the Future As a key player in LED and smart electronics, MIC Electronics is positioned for long-term growth in the tech sector. ?? Share Price Targets: ? 2025: Expanding its product range and market presence ? 2030: Establishing itself in international markets ?? ? 2035: Pioneering innovation in smart tech ? 2040: Dominating the electronics market with cutting-edge solutions ?? Get the full analysis: https://lnkd.in/gw9_Bf76 ?? Why MIC Electronics? Focused on tech innovation Expanding global footprint Long-term industry potential #MICElectronics #TechInvestments #StockMarketGrowth #Tradewatch360 #MICElectronics #SmartInvesting
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Principal Channel Marketing Manager EMEA at ? Analog Devices
3 个月Well done Martin Keenan