Blue Cheetah Analog Design, Inc.的动态

Learn how Siemens emulation and silicon test solutions can work together to provide a smart DFT plug-and-play architecture for Veloce ICs from Ron Press, Sr. Director of Technology Enablement, Tessent and Robert Serphillips, Product Manager, Verification, Siemens EDA. With many customers, including those for emulation and IC test, facing challenges with scaling architectures, combining market-leading design-for-test (DFT) technologies with best-in-class netlist synthesis allows them to achieve DFT success more quickly. Agenda highlights include: > An introduction to Veloce DFT App and how it helps validate Tessent DFT logic/patterns > DFT Power Profiling and Fault grading using Veloce Power App > Applying SSN to solve the Veloce chip design challenges For more information and to reserve your free webinar place, visit: https://sie.ag/2wQU84 #Veloce #TessentStreamingScanNetwork #TessentSSN #chiplets #DFT #Tessent #DFTMarketLeader #SiemensEDA #3DIC #semiconductors

In this new Tessent webinar, Ron Press, Sr. Director of Technology Enablement, Tessent and Robert Serphillips, Product Manager, Verification, Siemens EDA, describe how Siemens emulation and silicon test solutions can work together to provide a smart DFT plug-and-play architecture for Veloce ICs. Key topics covered include: > Introduction to Veloce DFT App and how it helps validate Tessent DFT logic/patterns > DFT Power Profiling and Fault grading using Veloce Power App > Applying SSN to solve the Veloce chip design challenges Register today to discover how combining market-leading design-for-test (DFT) technologies with best-in-class netlist synthesis allows you to achieve DFT success more quickly. Learn more. https://sie.ag/5JfYJu #Veloce #TessentStreamingScanNetwork #TessentSSN #chiplets #DFT #Tessent #DFTMarketLeader #3DIC #semiconductors

There's still time to register and join Ron Press, Sr. Director of Technology Enablement, Tessent and Robert Serphillips, Product Manager, Verification, Siemens EDA, for their live Tessent webinar next week. As well as explaining how Siemens emulation and silicon test solutions can work together to provide a smart DFT plug-and-play architecture for Veloce ICs, they will cover. > An introduction to Veloce DFT App and how it helps validate Tessent DFT logic/patterns > DFT Power Profiling and Fault grading using Veloce Power App > Applying SSN to solve the Veloce chip design challenges To discover how combining market-leading design-for-test (DFT) technologies with best-in-class netlist synthesis allows you to achieve DFT success more quickly, register today. https://sie.ag/QUNNR #Veloce #TessentStreamingScanNetwork #TessentSSN #chiplets #DFT #Tessent #DFTMarketLeader #3DIC #semiconductors

If you are interested in learning more about DFT, don’t forget to register for tomorrow’s webinar on how to leverage Veloce Emulation to validate Tessent DFT patterns, while also accelerating Power Analysis and Fault testing????♀?

Check out this STMicroelectronics presentation, in which Fabien Chiantia, Test Engineer and Jean-Marcs Denollet, DFT Engineer, provide their expert insight into OST (Observable Scan Technology) and Test Point benchmarking inside an imaging chip. Observable Scan Technology (OST) is a feature that enables faster achievement of the targeted coverage with a different impact on the area. Fabien and Jean-Marcs presentation demonstrates the coverage differences between Test Points and OST, as well as the impact on the area for three different chips that they have in their division. Watch the full presentation that was delivered at the Siemens EDA User to User European summit earlier this year. https://sie.ag/6ZJmdE #3DIC #DFTmarketleader #Tessent #designfortest #OST #ObservableScanTechnology #Semiconductors #ATPG

Why consider heterogeneous integration to optimize your 3D IC designs? Problem: The method of fabricating a device on a single piece of silicon, known as monolithic semiconductor fabrication, is not affordable, expedient or low risk. As processing demands and the need for scalability rise, SoC is less likely a future solution. Solution: A homogenous SoC disaggregated into function-specific chiplets. Through heterogeneous integration using 3D IC packaging, chiplets can be mixed, matched, and merged for increased, diverse functionality. Watch this on-demand webinar to learn how heterogeneous integration improves IC design. https://sie.ag/2QmALA #eda

Why consider heterogeneous integration to optimize your 3D IC designs? Problem: The method of fabricating a device on a single piece of silicon, known as monolithic semiconductor fabrication, is not affordable, expedient or low risk. As processing demands and the need for scalability rise, SoC is less likely a future solution. Solution: A homogenous SoC disaggregated into function-specific chiplets. Through heterogeneous integration using 3D IC packaging, chiplets can be mixed, matched, and merged for increased, diverse functionality. Watch this on-demand webinar to learn how heterogeneous integration improves IC design. https://sie.ag/2QmALA #eda

Join Siemens DFT Manager, Itamar Tsachi, for an expert introduction to Tessent Multi-die and how it can support 3D IC design, while adhering to industry standards including IEEE 1149.1, IEEE 1500, IEEE 1687, and IEEE 1838. Key topics that will be explained include: > How Tessent Multi-die aids 3D IC design for test > What the IEEE 1838 standard is and how the Tessent solution can be used. > Use of the Tessent Streaming Scan Network (SSN) as a flexible parallel port (FPP) > How in a 2.5D device, boundary scan-based interconnect test can be performed with Tessent Multi-die As chiplets evolve, design for test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after assembly into 2.5D or 3D devices. Learn how Tessent Multi-die can help by reserving your free place today. https://sie.ag/7WjxiL #TessentMultidie #chiplets #DFT #Tessent #DFTMarketLeader #SiemensEDA #3DIC #semiconductors

Altair? Silicon Debug Tools? Simplifying Semiconductor Debugging with Intelligent Visualization Designing and debugging modern ICs is highly complex and exhaustive, requiring companies to assemble large design and verification teams to identify and resolve issues. Solutions that provide precision debugging and design accuracy enable companies to locate and fix problems before the manufacturing stage, saving time and costs. Altair Silicon Debug Tools provide high capacity and performance for rapid debugging of complex designs, significantly accelerating the development cycle. An industry leader in digital, analog, and mixed-signal design and debugging, Silicon Debug Tools handles an exceptional range of design abstractions from system, RTL, gate, and transistors commensurate with modern SoC platforms. Explore: https://lnkd.in/gw63UujZ #AICTE #Silicon #onlyforward

#Project_25: Redundant Adders In this project, we explore redundant adders, which improve arithmetic operations by using redundant number systems. These adders offer enhanced speed and efficiency by reducing carry propagation delay and enabling parallel processing. Redundant adders are widely used in high-performance computing systems to optimize addition tasks and ensure fault tolerance. #108_RTL_Projects #108rtlprojects