#AppliedMaterials is hosting a reception and panel discussion on Dec. 10 during #IEDM in San Francisco. Join us and hear leading technologists from AMD, Intel Corporation, Cadence and Applied explore the future of advanced packaging and answer the question: 3D is Here, Now What? Moderated by prominent industry analyst and YouTube educator Dr. Ian Cutress of More than Moore, the expert panel will debate what it will take for the industry to move “beyond 3D” chip packaging and tap the true potential of AI. This event will fill up fast, so register now for what’s sure to be an entertaining and thought-provoking discussion. We look forward to seeing you there! https://bit.ly/4g01s0l
?Interesting event! The future of advanced packaging and AI is definitely a hot topic, and with experts from AMD, Intel, and Applied Materials, it’s sure to be an insightful discussion.
Ph.D. Candidate I Graduate Research Assistant | Department of Engineering Science & Mechanics | The Pennsylvania State University | Research Interests: Permafrost, Polymer, Electrical Characterization of Materials.
4 个月Interesting event!