Adeia的动态

Exciting applications for #tunable light sources in #semicon. Read more in the white paper!

Today's action-packed newsletter (BAM! ZING!) spotlights #semiconductors, #MMICs, and #RFICs, starting off with our own John Oncea's look at ... well ... semiconductors, MMICs, and RFICs. Marki Microwave breaks down surface-mount packaging parasitic sources and solutions to combat these undesirable parasitics; Rohde & Schwarz explains why new semiconductor technologies and processes need to be commercialized to support technologies that are expanding into sub-THz frequencies in the D band and beyond; and Qorvo, Inc. lays out the advantages of the Qorvo SiC FET versus Sic MOSFETs. https://lnkd.in/errE6RNT

In preparation for MEMS & Sensors Technical Congress 2024 at UCLA May 1-2, MSIG will be sharing the most popular presentations from MSTC 2023 on the MSIG Youtube channel. ? Before you watch the latest video, MEMS Test Equipment Standardization: Towards Multi-Technology, Multi-Application Solutions, check out this conversation Paul Carey had with the speaker, Luca Fanelli, SPEA America President and GM:?https://lnkd.in/dCaFxPYy ? Paul: At MSTC 2023, you presented a new paradigm for standardization of MEMS test equipment. Is SPEA seeing the adoption from MEMS customers of its standardized test solutions?? Luca: Yes, we are. The standardization of test equipment has empowered our customers to significantly reduce the cost of test for consumer, industrial, military, and automotive MEMS sensors. I would go as far as to say that the test equipment standardization has become a fundamental?architectural cornerstone for modern MEMS testing. Paul: Which market or application do you believe will mostly benefit for standardized test equipment? How will this impact consumers? Luca: The consumer market has historically been (and it still is) the most eager to benefit from YoY Cost of Test reduction. The automotive sector is also showing mild signs of gross margin erosion. In both cases, the test equipment standardization that SPEA brings to the front with our own equipment, will continue to provide consumers with better and smarter products in?their?everyday life. Paul: A fast sports car or a full weekend with your 3 sister-in-laws? Which do you?prefer and why? Luca: At my age? Definitely my sister-in-laws. At least when I fall asleep, they have someone to talk to and I wont?die. ? With that in mind, please enjoy this video of Luca’s talk from MSTC 2023 and plan to attend MSTC 2024 - https://lnkd.in/gwBZdV85

Excited for European Test Symposium! We have?Andrea Matteucci presenting our research With Luca Moriconi from?ELES SEMICONDUCTOR EQUIPMENT on "In-chip Monitoring for Extended #Reliability #Testing and Mission Profile Monitoring Feedback Loop" and?Nir Sever discussing our paper on #Chiplet Interconnect Testing using #InChip monitoring See you in The Hauge! IEEE #IEEE #ETS #EuropeanTestSymposium #ATE #Test #HeterogeneousIntegration #AdvancedPackaging

With critical metal pitches soon dropping below 20nm, the traditional Cu dual-damascene approach for back-end-of-line (BEOL) processing faces tremendous performance and cost challenges. Imec proposes semi-damascene as an alternative integration scheme to continue scaling interconnects. In this article, imec’s Zsolt Tokei guides you through the value proposition, challenges and state-of-the-art of Ru-based semi-damascene. Delve into the topic and learn how the semiconductor community can help clear the path towards industrial adoption. Read more: https://lnkd.in/eXagg-kx

If you are in the semi-industry, read this blog about our Smart Diffractometer for Crystal Orientation Measurement system. It can measure from 2 to 300 mm in just a few seconds. Have a look!

Good abstract on Semiconductor packaging. With the potential to increase the throughput to 1100 UPH from 300 UPH.

With critical metal pitches soon dropping below 20nm, the traditional Cu dual-damascene approach for back-end-of-line (BEOL) processing faces tremendous performance and cost challenges. Imec proposes semi-damascene as an alternative integration scheme to continue scaling interconnects. In this article, imec’s Zsolt Tokei guides you through the value proposition, challenges and state-of-the-art of Ru-based semi-damascene. Delve into the topic and learn how the semiconductor community can help clear the path towards industrial adoption. Read more: https://lnkd.in/eXagg-kx

This research dives deep into optimizing Modular Multilevel Converter (MMC) technology, reducing module capacitance by over 50% while?cutting semiconductor losses by 8%-18%. This innovative multiobjective optimization scheme promises to enhance power density and slash costs. Read the full article in IEEE Access: https://lnkd.in/ena-J2St