Ensuring FPGA power integrity: How to optimize & verify PDN performance
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活动举办者 Siemens Electronic Systems Design & Manufacturing
2024 年 5 月 1 日 – 2024 年 5 月 1 日线上活动
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UPDATE: This event is rescheduled for May 1 at 11 a.m. ET. We apologize for the delay and look forward to seeing you tomorrow!
Ensuring adequate PCB decoupling for FPGA devices is a difficult problem, because FPGA power consumption is programming-dependent, and because FPGAs have substantial package and die-level decoupling capacitance that interact with PCB decoupling capacitance. In this webinar, we’ll show an overall methodology for determining the required power supply characteristics for AMD FPGAs, then use HyperLynx Power Integrity to determine if PCB-level decoupling is good enough to support reliable system operation. We’ll explore how package capacitance actually changes the characteristics of the PDB Power Delivery Network (PDN), and show how a PCB can be analyzed to improve decoupling behavior, potentially reducing board manufacturing cost and opening up routing channels on the board for additional signals.
In this live discussion, John Heslip and John Rinck of AMD and Siemens expert Zach Caprai will discuss the component-/system-level analysis processes and demonstrate how HyperLynx can be used to analyze and improve the PCB PDN. This live session will also include responses to questions from the audience. Designing AMD FPGAs into your next board? Don’t miss this discussion!