Yield Engineering Systems

Building HBM Stacks for AI Chipsets Adoption of Generative AI is growing every day. There are a growing number of silicon providers coming to the market with chipset solutions for training of AI models. Most of these solutions today are a combination of ASICs/GPUs and large stacks of HBMs, all packaged together. Training for these models typically requires a large dataset that undergoes billions of iterations between ASIC/GPU and Memory. Having ASIC/GPU very close to Memory in a package using 2.5D or 3D construction, improves the performance of the solution. Along with GPU/ASIC, HBM memory stack is a key building block of AI solutions. There could be as many as 8 to12 stacks of HBMs in an AI solution. This webinar investigates the complexities of manufacturing a high quality, reliable HBM stack that meets the performance and technology requirements of today’s AI chipsets. Industry Analyst, Dean Freeman, will set the stage with a presentation on the current HBM market, and the predictions for the HBM Roadmap. Micron’s Bret Street will update us on HBM technology trends. Zia Karim, YES, will wrap up the discussion with a look at processes and technologies/tools in development to support next generation HBM. https://lnkd.in/gzrMFGKX

Ramakanth Alapati, Chairman and CEO, YES, and Managing Director/Partner KCK US Inc., congratulates Semiconductor Research Corporation for the CHIPS Act award. “We look forward to partnering with SRC to enable the SMART USA Digital Twin initiative. This is an important step for US Semiconductor industry in enabling use of AI to accelerate yield improvement in manufacturing, shorten time and cost of chip production and establish a lead in global manufacturing technology”, said Ramakanth Alapati. https://lnkd.in/ejKDVk8y

Ramakanth Alapati, Chairman and CEO, YES, and Managing Director/Partner KCK US Inc., congratulates Semiconductor Research Corporation for the CHIPS Act award. “We look forward to partnering with SRC to enable the SMART USA Digital Twin initiative. This is an important step for US Semiconductor industry in enabling use of AI to accelerate yield improvement in manufacturing, shorten time and cost of chip production and establish a lead in global manufacturing technology”, said Ramakanth Alapati. https://lnkd.in/ejKDVk8y

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Ramakanth Alapati, YES CEO and Managing Director/partner at KCK, recently attended a USIBC - US India Business Council hosted industry roundtable in Palo Alto, CA. Hon'ble Minister Lokesh Nara, Minister of Information Technology, Electronics and Communications in the Government of Andhra Pradesh, laid out the vision for each part of his state. He also emphasized the sense of urgency of bringing varied businesses to Andhra Pradesh and have them scale up quickly.

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