ICYMI ??
Working with design and build professionals on solutions to increase adoption of more circular and regenerative practices.
Had an incredible time moderating at the AIA San Francisco Climate Tech Symposium last week where I had the privilege of guiding the discussion around ways we can prioritize reuse, recycling, and repurposing of building materials. Special thanks to my panelists Marcus Hopper (Gensler SF) and Frances Yang (Arup) for sharing insightful case studies and strategies, and to Garrett Benisch for a truly scene-stealing presentation on Bioforcetech Corporation’s technology and OurCarbon?—a fascinating example of how we can rethink "waste" as a resource. Many tools and strategies that enable designers to achieve low carbon design goals, support sustainable building certifications, and meet emerging code requirements were shared. Here are some of my takeaways from the day: ?? AI as a ‘brain partner’ – Mike Haley (SVP, Autodesk Research) highlighted how AI can take on complex calculations, freeing up designers for bigger-picture creative thinking. ?? The shocking scale of construction’s carbon footprint – Amar Singh (One Click LCA) reminded us that every 29 days, we add the equivalent of one New York City to the planet and how the impact of low-carbon buildings far outweighs lifestyle changes like driving less or recycling. ?? Circularity is messy but necessary – we won’t achieve a perfect system overnight, but imperfect steps still move us forward. ?? Last but not least- Chris Field (Stanford Woods Institute for the Environment) left us with a sobering reality check: the planet is heating up fast. The AEC industries must act now to cut carbon and embrace circular principles.? Grateful to AIASF for bringing together such a forward-thinking group of designers, engineers, and sustainability leaders! Thank you to *my* hosts Charlie Stott, co-chair of AIA-SF Committee on the Environment (COTE) and Argelia Barcena of Gensler, AIA SF Board director, and chair of Technology in Architecture Practice (TAP).