Sierra Circuits

6 common challenges in designing an #HDIPCB ?? The increased component density and multiple signal layers result in complex routing requirements within a limited space. This leads to routing congestion and increases the risk of crosstalk. ?? Traces of varying lengths due to a compact layout can lead to propagation delays and skew between signals. ?? Impedance mismatch in HDI due to insufficient trace widths and spacing causes signal reflections and signal degradation. ?? The compact layout can make it challenging to ensure low-impedance power distribution and effective decoupling, leading to voltage fluctuations. ?? For HDI designs operating at high frequencies, electromagnetic phenomena such as skin effects and dielectric losses become significant, leading to signal attenuation and distortion. ?? Miniaturized components, densely packed traces, high-speed signal switching, and component power dissipation can lead to localized heating, damaging ICs. ??Read the full blog to learn more: https://lnkd.in/g7vfSMah --> Reost for better reach. #highdensitypcb #pcbdesign #hardwareengineering #electricalengineering

8 must-have details in your #PCBassembly drawing <-- Swipe left ?? An assembly drawing displays all the components on the board in their assembled locations, along with their corresponding reference designators for identification. ?? Read the article to learn more: https://lnkd.in/gNNbyYYU --> Repost for better reach. #pcbdesigners #pcbmanufacturing #hardwareengineering #electricalengineering

Imagine if your #PCBdesign met #EMC compliance—every time. No unexpected #EMI issues, no costly redesigns, and no last-minute test failures. If you’ve ever struggled with?signal integrity challenges, crosstalk, or EMI?in high-speed designs, this #webinar is for you. Join Amit Bahl and Ignacio de Mendizábal ?? as they break down practical EMC design rules to help you create boards that perform reliably and pass compliance testing the first time. Here’s what you’ll learn: ? How to select PCB materials to improve EMC performance ? Stack-up and routing strategies to control impedance and reduce EMI ? Shielding techniques like Faraday cage and via stitching ? Best practices for #DFM to ensure EMC success in #PCBmanufacturing ? How to prepare for EMC compliance testing DENPAFLUX

UPDATE: Soooo apparently we won best poster? ?? Our PCB Guy Amit Bahl presented a poster on #DFM at #IPCAPEX yesterday, judged by Paul Cooke and Todd MacFadden. (Did we get the results?) Make sure to come for our paper presentation today at 4 PM! IPC #pcb #pcbmanufacturer #electronics #tradeshow

How to get your first #PCB manufactured ?? Evaluate potential fabricators based on cost, quality, and turnaround time to ensure they meet your project's specific needs. ?? Check if your design adheres to the manufacturer's capabilities (trace width, drill size, and stack-up feasibility). Run a DRC before submission. ?? Include all necessary files, such as Gerber files/IPC-2581/ODB++, BOM, netlist, and assembly drawings. Clearly specify fabrication notes and special instructions. ?? Engage with the CM's engineering team to optimize your design for manufacturability and address any potential issues. ??Read the full blog to learn more: https://lnkd.in/gw5jmC3F --> Repost for better reach. #pcbdesigners #pcbmanufacturing #prototypefabrication #electricalengineering

Amit and Lucy are at #IPCAPEX. Go say hi and get design guides at booth 1330!! Amit will present a poster on DFM today at 5PM in aisle 4100. See ya, designers and engineers!

There's still time to register for Karen Burnham's lecture series on MIL-STD-461 + #EMC!! Register for lecture #2 now and DM Lucy if you want to purchase a bundle with access to the recording of lecture #1. https://lnkd.in/gKG_msqM

DFM for flex and rigid-flex #PCBs employing SMT ?? Design for manufacturing guidelines resolve potential issues that can occur during the manufacturing and assembly of circuit boards. ?? DFM for flex and rigid-flex PCBs with SMT involves selecting application-specific circuit construction types, laminates, coating thickness, trace routing strategies, bending, and EMI capabilities. ?? Read the full blog to learn more: https://lnkd.in/g4vE2SSF --> Repost for better reach. #flexpcbs #pcbdesigners #pcbmanufacturing

The advantage of metal-core #PCBs A metal core printed circuit board (MCPCB) also known as thermal PCB, incorporates a metal material as its base as opposed to the traditional FR4, for the heat spreader fragment of the board. Heat builds up due to some electronic components during the operation of the board. The purpose of the metal is to divert this heat away from critical board components and towards less crucial areas such as the metal heatsink backing or metallic core. Hence, these PCBs are apt for thermal management. In a multilayer MCPCB, the layers will be evenly distributed on each side of the metal core. For instance, in a 12-layer board, the metal core will be at the center with 6 layers on the top and 6 layers at the bottom. MCPCBs are also referred to as insulated metallic substrate (IMS), insulated metal PCBs (IMPCB), thermal clad PCBs, and metal-clad PCBs. In this article, we will be using the abbreviation MCPCB to avoid ambiguity. The MCPCBs are made up of thermal insulating layers, metal plates, and metal copper foil. Watch here: https://lnkd.in/gZF_xC_2

Techniques to measure and avoid jitter in #PCBs ?? A signal's deflection from its ideal rising and falling edges is called jitter. ?? Jitter in clock signals can impact the timing synchronization and consequently disrupt the overall signal integrity of a system. ?? Clock signals with less jitter are essential to meet high-speed data communication. Read the full blog to learn: ??Sources of jitter in your PCBs. ??How to measure clock jitter using an eye diagram. ??Design techniques to eliminate jitter. ??Various types and sources of jitter in PCBs. ??https://lnkd.in/gf-ii4pA --> Repost for better reach. #signalintegrity #pcbdesigners #electricalengineering