Siemens EDA (Siemens Digital Industries Software)

Moore's Law is pushing us to think beyond 2D. ?? 3D-IC technology opens incredible possibilities, but also introduces new verification challenges. Stacking dies creates complexities that traditional DRC, LVS, and PEX checks simply can't handle. That's where Calibre 3DSTACK steps in. This powerful solution provides the fast and accurate verification needed for today's intricate 2.5D and 3D-IC designs, helping designers pinpoint and resolve issues before physical assembly. Curious how it works? We've got you covered! Explore our latest blog post and video series via the link in our comments to understand how Calibre 3DSTACK ensures design reliability and enables seamless multi-die integration. #3DIC #AdvancedPackaging #ICDesign #VerificationTools #Semiconductor #Innovation

We're excited to share that we've been recognized once again for our commitment to innovation in electronic design automation: Catapult AI NN received the top prize in the Tools category at the Outstanding Innovation Awards held at embedded world Exhibition&Conference Europe. ?? The winning formula ?? Catapult AI NN provides an automated pathway from neural networks to customized AI accelerators. AI algorithms are highly compute-intensive, often requiring acceleration to be practical, especially at the edge. Customized accelerators can outperform standard off-the-shelf components or intellectual property by more than ten times, delivering enhanced performance while also improving efficiency. Catapult AI NN combines cutting-edge synthesis technology with advancements in AI frameworks and neural networks. It automatically quantizes the network to achieve optimal power, performance and area, thereby reducing size, cost and energy consumption. What was once a development effort across various technology domains is now an automated process, enabling system designers to more effectively make use of the advantages of AI for their embedded products, thanks to Catapult AI NN. #HLS #HighLevelSynthesis #Catapult #AI #ML #EmbeddedWorld #EDA

Uncover Siemens' vision for the future of semiconductor tech with 3D IC Fundamentals!?? John McMillan shares insights into... ? 3D IC Fundamentals: Grasp the core concepts and advantages of 3D integrated circuit (IC) design over 2D. ? Design Challenges: Explore complexities of 3D ICs, including thermal management, interconnect density, and fabrication. ? Siemens' Solutions: Learn how the company's advanced software and platforms address these challenges for efficient and reliable 3D IC design and manufacturing. ? Real-World Impact: Dive into case studies showcasing how Siemens' 3D IC technologies are driving innovation and performance improvements across industries. ? Future Trends: Gain insights into upcoming 3D IC advancements, focusing on automation and emerging tech shaping the semiconductor landscape. Where? Watch below... (and check the comments for a link to more information)

Some exciting news from our global universe of partners: our PAVE360 technology for software defined vehicle (SDV) development is now available on AMD Radeon? PRO V710 GPUs and AMD EPYC? CPUs running on Azure, Microsoft’s cloud and AI platform. “We're excited to collaborate with Microsoft and AMD. We recognize that our customers have a preference in cloud platforms and associated hardware resources when deploying development platforms for SDV,” said David Fritz, our vice president, Hybrid and Virtual Systems. “With PAVE360 recognized as key enabler for SDV development, extending our support to Microsoft Azure and AMD hardware gives our customers greater flexibility.” In many instances software, hardware and system defects are not found until late in the design cycle or, worse still, when the fleet is deployed resulting in costly recalls and potentially significant brand damage. A system-aware approach to SDV validation helps to uncover these defects early in the modelling and simulation phase at which point many thousands of virtual scenarios can be run to isolate corner cases that otherwise would be missed. With the support of industry leaders such as Microsoft and AMD, Siemens brings system-aware SDV validation to the forefront with PAVE360. Explore the comments for more details: AMD Microsoft Azure #EW25

Level up your EDA skills! ? We are excited to offer our users a chance to join in the day after User2User Silicon Valley and attend one or both of our live Technical Training Sessions on May 21, 2025. Why attend? ?Expert-led sessions by industry leaders ?Boost productivity with Siemens EDA tools ?Free full self-paced training course (valued at $2500!) with hands-on labs in our cloud environment ?Certification exam opportunities and digital badges Limited spots are available—check out the details via the link in our comments ?? #EDA #FunctionalVerification #DesignForTest

Register now for the 2025 Siemens EDA North America and Europe User2User Conference! ?? Join us for a full day packed with technical sessions, invaluable networking opportunities, visionary keynotes, hands-on labs, partner exhibits, and much more! Dive deep into cutting-edge technology tracks and sessions covering: ?3D IC/chiplet design ?AI/ML ?Aprisa digital IC implementation ?Calibre solutions driving customer success ?Cloud adoption ?Custom IC ?Functional design & verification ?Hardware-assisted verification ?High-level synthesis/power analysis ?Tessent test solutions Don't miss this incredible opportunity to connect with industry experts and peers - link is in the comments. We look forward to seeing you there! #EDA #Semiconductor #ChipDesign

We're thrilled to unveil a new automated and certified workflow for TSMC's InFO packaging technology, powered by Siemens' industry-leading advanced packaging integration solutions. ?? This collaboration addresses the growing challenges of design complexity and time-to-market, empowering our mutual customers to achieve remarkable innovations. As AJ Incorvaia, SVP of Electronic Board Systems at Siemens, puts it, "The combination of Siemens’ industry-leading Innovator3D IC driven semiconductor packaging solutions and TSMC’s leading-edge 3DFabric advanced packaging platforms such as InFO enable our many mutual customers to achieve truly remarkable and industry-disrupting innovations.” This workflow, featuring Xpedition Package Designer, HyperLynx DRC, and Calibre nmDRC, streamlines the design process for TSMC's InFO_oS and InFO_PoP technologies. It's a testament to our commitment to the TSMC Open Innovation Platform? (OIP) and our dedication to providing cutting-edge solutions for next-generation semiconductor designs. #Semiconductor #Innovation #ChipDesign

Why is silicon lifecycle management (SLM) so critical? Because it's the key to extending product lifecycles and maximizing performance! We spoke with Marc Hutner, Director of Product Management for Silicon Learning, about how Tessent is revolutionizing silicon lifecycle management (SLM). DFT is evolving beyond just test, becoming a functional subsystem, and SLM is extending product lifecycles by providing deep insights into system health. #SLM #DFT #Semiconductor #Innovation

?? We are excited to announce an exclusive OEM agreement between Siemens and Alphawave Semi, a leader in high-speed interconnect silicon IP to help us tackle the most complex connectivity challenges at the world’s leading advanced process nodes. This partnership represents a significant milestone, delivering a comprehensive range of PHY IP, Controller IP, and Subsystem platforms optimized for advanced technology nodes to reduce interconnect bottlenecks, enable faster data transmission, increase reliability, and lower power consumption. These solutions consist of complete silicon IP building blocks that our customers can license and integrate into advanced system-on-chip (SoC) designs, including implementations leveraging 3D-IC and chiplet technologies, critical for customers in AI, autonomous vehicles, data networking, hyperscaling and storage markets. “The addition of Alphawave Semi’s silicon IP introduces industry leading technology to our customers, empowering them to achieve unprecedented advances across diverse industries in dramatically shortened timescales," said Mike Ellow, CEO, Siemens EDA. “We look forward to collaborating with Alphawave Semi to deliver state-of-the-art IP that addresses the most complex connectivity challenges, at the world’s leading advanced process nodes.” “Siemens Digital Industries Software is a key and trusted partner for AI and hyperscaler developers, and our agreement simplifies and speeds the process of developing SoCs for these, and other leading-edge technologies, to incorporate Alphawave Semi’s IP,” said Tony Pialis, president and CEO, Alphawave Semi. “Our technologies play a critical role in reducing interconnect bottlenecks and this collaboration greatly expands our customer reach, allowing more companies to deliver next-level data processing.” To see all the details about this impactful announcement, please visit the comments below.

Struggling with long IC verification cycles? An emulation-optimized pattern validation engine for gate-level runs can be a game-changer. This video explains how it can accelerate your testing and get your product to market faster. #ICVerification #Emulation #Semiconductor