Siemens EDA (Siemens Digital Industries Software)

Great #news! ?? Our continued collaboration with longtime customer Samsung Foundry has resulted in a set of new certifications for our new Solido SPICE software, which supports the verification of next-generation analog, mixed-signal, RF, memory, library IP and 3D-IC semiconductor designs. With these certifications, mutual customers using Solido SPICE (part of our Solido Simulation Suite software) will have access to the enhanced performance, power efficiency and scalability of Samsung Foundry’s leading edge process technologies, providing the tools required to innovate and thrive in multiple high-tech industries. "Siemens’ long and prolific collaboration with Samsung Foundry continues to help our joint customers deliver highly innovative and differentiated integrated circuits (ICs),” said Amit Gupta, our vice president and general manager, Custom IC. “Siemens is pleased to extend this cooperation with these recent certifications for Samsung’s newest and most advanced semiconductor process technologies." “Samsung Foundry is known for extending semiconductor physics to new heights with each technology transition,” said Hyung-Ock Kim, vice president and head of Foundry Design Technology Team, Samsung Electronics. “Our collaboration with Siemens plays a critical role in our ecosystem to help ensure EDA verification enablement is in lock-step throughout the innovation journey. I am pleased that Samsung Foundry has certified Siemens’ newly released Solido SPICE across a broad range of process technologies, empowering IC developers to robustly and accurately verify their complex ICs targeted for high-growth applications and markets.” For all the specific certification information, please check the comments for a link to the #newsroom! #SamsungFoundry #CustomIC #EdgeProcessing

Companies around the globe are constantly striving to work more efficiently in order to bring their products to their customers more quickly. As a trusted service provider to large enterprise customers such as Asus, Xiaomi, Murata and Epsom, PT Sat Nusapersada Tbk (PTSN), one of Indonesia's largest providers of electronics manufacturing services (EMS) understands this imperative very well. ?? The company has recently expanded its surface mount technology lines to 24, and this increase of production capacity called for a need to reduce manual work, particularly during the process of new product introduction. To help with that, Sat Nusapersada implemented our Process Preparation software, to help them keep assembly, test and inspection data up to date in a single environment for all stages of the surface mount technology (SMT) manufacturing process. This dramatically reduces the need for manual, error-prone updates, which can cause consistency and reliability issues. What has been the impact? ?? After implementation, Sat Nusapersada has benefited from a 70% reduction in time needed to gather all the incoming data for projects while improving line efficiency by 23%. Use of Siemens Process Preparation has also helped Sat Nusapersada reduce SMT programming tasks by 21% (line configuration setup, common feeder, data output/transfer, move existing product between lines of different equipment brands). The design time needed for solder stencils was reduced by 30% by leveraging the learning libraries that automatically set the correct aperture shape and size to new footprints. “We have achieved significant increases to our production capacity with the introduction of Siemens’ Process Preparation which, when combined with decreases in manual rework, we’re able to better serve our customers and bring them their critical electronics in the timescales that today’s industry demand,” said Stanly Rocky, Asst General Manager of Public Relations, Sat Nusapersada. “it’s great to see the benefits that Sat Nusapersada have gained from implementation of Siemens’ Process Preparation and how it is benefitting from improved efficiency in its SMT production lines,” said Alex Teo, our managing director and vice president, South East Asia. “Our success is the region is centered on enabling our customers to not only innovate their own products, but to scale up the production lines for an increased global demand for electronics.” To learn more about this announcement, check the comments for the link to our newsroom. ?? #efficiency #manufacturing #software

Systems design—spanning from IC design and manufacturing to IC packaging and board design to embedded software—has been constantly evolving over the past decades, and so have toolsets that serve these vital tenets of electronics. Siemens EDA’s next-generation electronic systems design software takes an integrated and multidisciplinary approach to cater to this changing landscape. It’s built on five pillars: ?Intuition ?AI ?Cloud ?Integration ?Security Check out the link in the comments for a closer look at the key building blocks of this unified solution and how it can help engineers to tackle challenges head-on.

Just announced ??: Another step forward to better enabling advanced capabilities for software-defined vehicles (SDVs) through our ongoing collaboration with Infineon Technologies, which will help automotive OEMs achieve production readiness to deliver the next generation of capabilities required by SDVs! How? We're combining our embedded automotive software platform (based on the AUTOSAR Classic platform R20-11) with Infineon's AURIX TC4x microcontroller. ?????? Why? The growing demand for autonomous driving, ADAS, electrification and passenger comfort and entertainment calls for more computational power, functional safety and cybersecurity, making more advanced microcontrollers like the AURIX TC4x (plus intelligent software platforms that fit into the system development flow) mission-critical And the work has already shown results. ?? ? Together, our embedded software team and Infineon worked with the lead customer, BMW, to achieve production-ready electronic control unit (ECU) software. ? Additionally, we at Siemens have also collaborated with the OEM to implement a cloud-based software development process for SDVs, using our advanced embedded software development tools. “Our collaboration with Infineon is long established and highly successful, providing leading automotive customers with advanced microcontrollers running AUTOSAR-based embedded software to help drive the future of the software defined vehicle industry,” said Frances Evans, our senior vice president, Lifecycle Collaboration Software. “The first production ready implementation of the AURIX TC4x demonstrates how a more consolidated, holistic approach helps the SDV industry to deliver the advanced features customers demand.” “Infineon has contributed to the AUTOSAR standard since 2004 and provides AUTOSAR solutions for its microcontroller portfolio like the AURIX TC4x,” said Thomas Schneid, Senior Director Software, Partnership and Ecosystem Management at Infineon. “Our collaboration with Siemens Digital Industries Software focuses on delivering advanced microcontrollers equipped with AUTOSAR-based embedded software to empower OEMs in driving the future of the software-defined vehicle." Our newsroom has more insight - check the comments for a direct link. #SDV #Automotive

We are thrilled to announce that the Call for Speakers program is now open for Siemens EDA User2User events! This is a unique opportunity to share your story. We are seeking highly technical presentations from like-minded engineers who are at the forefront of digital transformation. Join us to connect with fellow EDA experts and showcase your expertise. We invite you to submit your topic on a range of subjects, including: ? Functional Design & Verification ? Design Solutions & Power Integrity Analysis ? Hardware Assisted Verification ? High Level Synthesis ? Custom IC ? Low Power ? Digital IC ? AI/ML ? Functional Safety, Security, Trust & Assurance ? Cloud Adoption ? Test and Embedded Analytics Solutions ? PCB ? 3DIC/Chiplet Design Don't miss this chance to highlight your innovative work and contribute to the advancement of our industry. Submit your proposal today and be a part of an inspiring community of EDA professionals- link is in the comments!

We are so proud and excited to congratulate our own Karen Donlan, Paula Giglio and Erin Giese as they ring the closing bell at the #NASDAQ today along with Jodi Shelton, CEO of the Global Semiconductor Alliance (GSA), and founder of its Women’s Leadership Initiative (WLI). What a fantastic opportunity to celebrate the valuable efforts and contributions of women in semiconductors. Brava! ??????

Are you ready for the next generation AI-enhanced Electronic Systems Design software? We are! ?? The latest advancement in our electronic systems design portfolio is here to bring you a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design through an integrated and multidisciplinary approach. "We are thrilled to announce the release of our next-generation electronic systems design solution, tailored to meet the critical needs of today's electronics engineers and the wider engineering community," said AJ Incorvaia, our senior vice president, Electronic Board Systems. "This release represents our most thoroughly vetted solution to date, incorporating feedback from hundreds of participants. By unifying the Xpedition, HyperLynx, and PADS Pro environments and infusing this with AI, our customers will be ready to tackle their challenges head-on." Focused on providing highly intuitive tools to overcome talent shortages and enable engineers to quickly adapt with minimal learning curves, the next generation toolset adds predictive engineering and new support assistance using AI, enhancing engineers’ capabilities, streamlining, and optimizing their workflows. Cloud connectivity will facilitate collaboration across the value chain and provide access to specialized services and resources, enabling engineers to rapidly adapt to changing requirements, supply chain insights and easier collaboration with stakeholders, regardless of location. The next generation software also brings enhanced integration with Siemens’ Teamcenter software for product lifecycle management and NX software for product engineering, allowing for multi-BOM support and tighter collaboration between ECAD and MCAD domains. To prioritize security, it offers rigid data access restrictions that can be configured and geo-located, while adhering to the strictest industry protocols. Siemens maintains partnerships with industry-leading cloud providers to ensure robust security measures. The solution also includes design and verification requirements management for model-based systems engineering support. Additional details can be found in our newsroom -- here: https://sie.ag/8AA1W #News #AI #PCBDesign #Innovation

Today we're happy to announce the Innexis product suite, a complement to our industry leading Veloce hardware-assisted verification and validation system. Building on the success and rapid adoption of Veloce, Innexis delivers a set of products and capabilities to address customer demand for shift-left software in the early phases of IC development. These products include: ? a hardware/software development flow from virtual to hybrid to full RTL ? an architecture native virtual platform for early high-speed software development ? a simulation backplane that enables the development of digital twins in our PAVE360? software for software-defined vehicles and other complex systems. “The complexity of integrated circuits (#IC) is increasing exponentially, designers need more efficient methodologies to meet industry demands. Veloce has seen rapid adoption by industry leaders to help solve this critical bottleneck. The Innexis product suite extends workflow improvements from Veloce to help our customers shift left their IC development and debug cycle,” said Jean-Marie Brunet, our vice president and general manager, Hardware-Assisted Verification. “This enables IC design to begin months before final RTL, all while using a common software workload across the development process.” What are customers saying? ??“The implementation of Innexis Hybrid in our development process has significantly enhanced software and system validation performance, thereby improving the efficiency of our teams and projects. By enabling heterogeneous component modeling within virtual platforms, it allows us to create realistic high-speed models of System on Chips (SoCs),” said Ari Hautala, Principal System Architect, Nokia Mobile Networks. “Furthermore, the integration of these high-speed virtual platforms with RTL IP on Veloce emulators facilitates superior overall performance while still permitting precise cycle-accurate performance and power analysis on RTL model components. Additionally, the Innexis hybrid environment offers exceptional visibility and debuggability for the SoC design, along with the capability to integrate and execute a large number of complex test cases effectively.” Our newsroom has all the details - direct link in comments. #ICVerification #IntegratedCircuits #EDA

We are excited to introduce the new Tessent In-System Test software, a groundbreaking design-for-test (DFT) solution that enhances in-system test capabilities for next generation integrated circuits (ICs). “Tessent In-System Test is a major step forward in helping our customers achieve their Silicon Lifecycle Management goals,” said Ankur Gupta, our senior vice president and general manager, Digital Design Creation Platform. “Aging and environmental factors are impacting today’s designs at a greater rate. Tessent In-System Test delivers smart solutions that address these challenges, ultimately providing customers improved performance, security and productivity.” Highlights ?? ? Tessent In-System Test is the industry's first in-system test controller designed specifically to work with Siemens’ industry-leading Tessent Streaming Scan Network software, enabling customers to apply embedded deterministic test patterns in-system throughout a product's lifecycle, and keep their ICs and the applications they power reliable, secure and fully functional. ? Tessent In-System Test software is engineered to address critical challenges like aging and environmental factors, which can lead to Silent Data Corruption or Errors (SDC/SDE) ? Tessent In-System Test enables customers to reuse existing IJTAG- and SSN-based patterns for in-system applications while improving overall chip planning and reducing test time ?Tessent In-System Test allows for seamless integration of deterministic test patterns generated with Siemens' Tessent? TestKompress? software, and enables customers to embed deterministic test patterns generated using Tessent TestKompress with Tessent SSN directly to the in-system test controller via industry-standard APB or AXI bus interfaces, providing the highest level of test quality within a pre-defined test window, as well as the ability to change test content as devices mature or age through their lifecycle. In-system test with embedded deterministic patterns also supports re-use of existing test infrastructure. These capabilities are particularly key for industries focused on safety-critical applications such as the automotive, aerospace, and medical devices spaces. What users are saying ?? “Tessent In-System Test technology allows us to reuse our extensive test infrastructure and patterns already utilized in our manufacturing tests for our data center fleet,” said Dan Trock, senior DFT manager at Amazon Web Services (AWS). “This enables high-quality in-field testing of our data centers. Continuous monitoring of silicon devices throughout their lifecycle helps to ensure AWS customers benefit from infrastructure and services of the highest quality and reliability.” To learn more please visit our newsroom (link in comments). #IC #IntegratedCircuitDesign #Tessent

We're excited to announce our collaboration with CELUS to transform the PCB design landscape and empower engineers and small- and medium-sized businesses with intelligent, accessible tools. ???? Combining Siemens’ industry-leading PCB design expertise with CELUS' innovative #AI automation platform creates a powerful, user-friendly and cost-effective solution tailored to the real-world needs of engineers. The integration of CELUS’ AI-driven automation with Siemens’ next-generation PCB design solution aims to deliver a fully integrated design environment that accelerates design processes, minimizes errors and brings innovative products to market faster and more efficiently. "We are extremely excited to work with Siemens to bring our AI-driven automation to a wider audience," said Tobias Pohl, CEO of CELUS. "This collaboration is about empowering engineers by simplifying their workflows, reducing errors and making advanced PCB design more accessible. Together, we're leveling the playing field for SMBs and independent engineers." “At Siemens EDA, our mission is to enable innovation and make advanced design tools accessible to businesses of all sizes,” said AJ Incorvaia, our senior vice president, Electronic Board Systems. “Collaborating with CELUS allows us to combine our proven PCB design solutions with front-end, cutting-edge AI automation, providing engineers with the tools they need to innovate efficiently and compete effectively in today's fast-paced market." More details about this #News in our newsroom: https://sie.ag/3nUTgf ?? #PCBDesign #AI