New protocols and technology will spur a whole new wave of chips, but those designs will be significantly more complicated. By Karen Heyman. https://lnkd.in/ggN2_jXV #wireless #WiFi #latency #IoT #WiFi7 #Matter #LiFi Sivaram Trikutam Infineon Technologies Matt Commens Ansys Wi-Fi Alliance Keysight Technologies National Institute of Standards and Technology (NIST) Gilles Lamant Cadence Design Systems David Plets Ghent University Brad Jolly
Semiconductor Engineering
在线音视频媒体
Silicon Valley,CA 86,749 位关注者
Deep insights for the tech industry
关于我们
Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations and standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors, as well as insights into the market dynamics that make it all possible. The goal of this site is to provide useful, independently developed content through targeted monthly newsletters, weekly updates, timely news alerts, videos, independent research, and a portal that serves as a forum for exchanging ideas and answering questions.
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https://semiengineering.com
Semiconductor Engineering的外部链接
- 所属行业
- 在线音视频媒体
- 规模
- 2-10 人
- 总部
- Silicon Valley,CA
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- 自有
- 创立
- 2013
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主要
US,CA,Silicon Valley
Semiconductor Engineering员工
动态
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Managing Legacy In Automotive https://lnkd.in/g7uXEmxc As vehicle technology evolves, carmakers must decide which technologies move forward and what gets left behind. Part 1 of experts roundtable. By Ann Mutschler. With Wayne Lyons, senior director for the automotive market at AMD; Judy Curran, CTO for automotive at?Ansys; Amit Sharma, product management director for Cadence Design Systems’s Compute Solutions Group; Adiel Bahrouch, director of business development for silicon IP at?Rambus; and Marc Serughetti, vice president, product management and applications engineering at?Synopsys Inc. #automotive #ADAS #autonomousvehicles #ISO26262 #SDV
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New technical papers recently added to Semiconductor Engineering’s library https://lnkd.in/g46rxsjx #lowpower #semiconductor #HardwareSecruity #2Dmaterials #tunnelFETs #ferroelectric #neuromorphiccomputing Rice University University of California, Berkeley Georgia Institute of Technology TSMC Intel Corporation Harvard University University of Chicago Argonne National Laboratory Stanford University The University of Texas at Austin Politecnico di Milano STMicroelectronics Global TCAD Solutions, Igor Sikorsky Kyiv Polytechnic Institute, INSA Lyon - Institut National des Sciences Appliquées de Lyon NaMLab Ramamoorthy Ramesh Sayeef Salahuddin Suman Datta Anish Saxena Walter W., and Alexandros Daglis Ankit Kumar, Lin Xu, Arnab Pal, Kunjesh Agashiwala Chloe Isabella T. Haihui Pu Junhong Chen Murat Can I??k Jonathan Naoukin I. Can DIKMEN, PhD. Sara Ghomi Christian Martella Mischa Thesberg Tetiana Obukhova Damien Deleruyelle
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Latest news: Auto chiplet consortium; critical IC materials risk; TIMs; more nuke plants for AI; Foxconn in Mexico; ML in auto MCUs; 3nm PHY chiplet; chip health monitoring; AI test. https://lnkd.in/gcqNpAEG #chiplets #semiconductor #automotive imec Arm ASE Global Tenstorrent Valeo Center for Strategic and International Studies (CSIS) Gracelin Baskaran, PhD Meredith Schwartz Dow Carbice NVIDIA Foxconn GlobalWafers Co., Ltd. Yole Group McKinsey & Company TSMC Edwards Vacuum Eliyan Corporation proteanTecs Keysight Technologies Cadence Design Systems Infineon Technologies AMD Driver PhotonDelta Analog Devices Texas Instruments MIPI Alliance Atomera Oak Ridge National Laboratory Martí Checa Nualart Rama Vasudevan Natcast.org D2S, Inc. University of Florida Nitin Varshney SiliconAuto India MediaTek Tata Technologies Altair
Chip Industry Week In Review
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Engineering teams are turning to the cloud to process and store increasing amounts of EDA data, but while the compute resources in hyperscale data centers are virtually unlimited, the move can add costs, slow access to data, and raise new concerns about sustainability. https://lnkd.in/gHuuYeYp By Adam Kovac. #EDA #datastorage #sustainability #datacenter #AImodels Rob Knoth Dean Drako Jim Schultz Bill Mullen Tim Thornton Arm Cadence Design Systems IC Manage Synopsys Inc Ansys
The Cost Of EDA Data Storage And Processing Efficiency
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Data Routing In Heterogeneous Chip Designs https://lnkd.in/dXEx5mup This recent SemiEngineering Tech Talk discusses challenges and solutions for working with multiple chiplets. #chiplets #advancedpackaging #heterogeneousintegration #NoC #networkonchip #signalintegrity #semiconductor Ronen Perets Cadence Design Systems
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SemiEngineering's latest eBook: Memory Fundamentals For Engineers https://lnkd.in/gmQkUWPb Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what’s changing, which memories are successful and which ones might be in the future; and what are the limitations of each memory type. 73 pages. By Bryon Moyer, SE Technology Editor, plus numerous articles by Semiconductor Engineering staff writers. #DRAM?#SRAM?#HBM?#CXL?#3DNAND?#RRAM?#computermemory?#semiconductor?#VLSI
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The discovery of ferroelectricity in materials that are compatible with integrated circuit manufacturing has sparked a wave of interest in ferroelectric devices. By Katherine Derbyshire. https://lnkd.in/gAjEX6DE #FeFETs #ferroelectric #DRAM #HZO #FeRAM Minhyun Jung KAIST Chinese Academy of Sciences Beijing Institute of Technology Fudan University Guan Feng
Preparing For Ferroelectric Devices
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Special Report: Nations vie for a piece of the semiconductor pie with offers of cash, subsidies, tax breaks, and other approaches. First of a series of articles. By Elizabeth Allan. https://lnkd.in/gbKVjXNu #semiconductor #semiconductormanufacturing #funding U.S. Department of Commerce Semiconductor Research Corporation (SRC) GlobalFoundries ASM ASML TSMC Bosch Infineon Technologies Todd Younkin Intel Corporation Amkor Technology, Inc. International Technology Security and Innovation (ITSI) Ajit Manocha SEMI NVIDIA #GaN Natcast.org Purdue University Arm CMC Microsystems Chips Joint Undertaking India Semiconductor Mission National Quantum Mission INDIAai #CHIPSAct
Government Chip Funding Spreads Globally
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What comes after HBM, and why that matters for future designs. SemiEngineering's latest Tech Talk. The usual method of migrating to the next process node to cram more features onto a piece of silicon no longer works. It’s too expensive, and too limited for most applications. The path forward is now heterogeneous chiplets targeted at specific markets, and while logic will continue to scale, other features are being separated out into chiplets developed using different process technologies. This already is happening with high-bandwidth memory, and the next target is I/O. Letizia Giuliano, vice president of IP product marketing and management at Alphawave Semi, talks about the challenges of developing and integrating chiplets, where the likely problems arise, and how this differs from a homogeneous SoC. #chiplets #heterogeneousintegration #semiconductor https://lnkd.in/gNBPwqbp
Working With Chiplets
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