Semiconductor Engineering

News this week: https://lnkd.in/gSGGdy-3 (Good one to share) Infineon’s 300mm power GaN wafer; SIA’s state of the industry report; India’s IC buzz; mandatory AI reporting; defect challenges at the wafer’s edge; AI chip bottlenecks; PPA’s value; secure space chips; V-NAND and more. #semiconductor #GaN #powersemiconductor #VNAND #AI #UCIe Semiconductor Industry Association Samsung Electronics Hyperion Technologies Polymatech Electronics ECM Group Ltd. SOITEC Move2THz Brooks Instrument SEMI NXP Semiconductors Apple #aihwedgeaisummit SiMa.ai Applied Brain Research Enfabrica Positron AI Synopsys Inc Rambus #HBM4 Bruker Nano Surfaces & Metrology Arteris Movellus Inc. Axiomise Xiphera Ltd. Infineon Technologies Sarbartha Banerjee Johannes Haring Roderick Bloem Mohammad Javad A. Sebastian H. Faller Tobias Handirk Julia Hesse Amin Sarihi Aliro The University of Texas at Austin IBM Research New Mexico State University Quantinuum

Power, performance, and area/cost have been the three optimization targets for decades, but are they relevant in today’s complex systems? By Brian Bailey. https://lnkd.in/dJR6buJe #PPA #lowpower #semiconductor Paul Karazuba Ahmed Hamza Rob Knoth Andy Nightingale Manoj Chacko Ninad Huilgol Kinjal Dave Preeti Gupta Jim Schultz Marc Swinnen Siemens Digital Industries Software Cadence Design Systems Arteris Arm Ansys Synopsys Inc Innergy Systems Expedera Inc.

IEEE P2427 is poised to be the cornerstone in the testing and validation of AMS designs; full industry support is still developing. By Gregory Haley. https://lnkd.in/gVHJDSac #semiconductor #AMS #analogmixedsignal #DFT #IEEEP2427 Ken Butler Advantest DR YIELD Dieter Rathei Anne Meixner Mayukh Bhattacharya Synopsys Inc Steve Sunter Siemens EDA (Siemens Digital Industries Software) Amit Bajaj Cadence Design Systems Anthony Coyette onsemi #analog #faultmodels #testcoverage #semiconductortest

Special Report: Defect Challenges Grow At The Wafer Edge https://lnkd.in/ea9Pjnkd Better measurement of edge defects can enable higher yield while preventing catastrophic wafer breakage, but the number of possible defects is increasing. By Laura Peters. #semiconductor #waferdefects #advancedpackaging #3DNAND #inspection #opticalinspection #hybridbonding John Wall Bruker Nano Surfaces & Metrology Dieter Rathei DR YIELD Tomasz Brozek PDF Solutions Onto Innovation Burhan Ali Vidya V. Nordson Corporation Nordson TEST & INSPECTION

Photonics Could Reduce The Cost Of Lidar: https://lnkd.in/gM-inFqv Known as the workhorse technology for long-haul communications, photonics now plays a very different kind of role. By Karen Heyman. #photonics #lidar #PICs #MEMS #radar #adas #FMCW #opticalcommunications Gilles Lamant Cadence Design Systems Twan Korthorst Synopsys Inc Pierre Duthon Tom Daspit Siemens Digital Industries Software Tesla Sudip Nag AMD NVIDIA Trung Pham Yole Group RoboSense Florian Petit Hesai Technology Mehdi Asghari SiLC Technologies, Inc Frédéric Bernardin Michèle COLOMB Mehran M. William Jiang Sashank Jujjavarapu Mehdi Sajjadi

New technical papers recently added to Semiconductor Engineering’s?library: https://lnkd.in/ggwtn5Ge #semiconductor #GPUs #neuromorphic #hardwaresecurity #processors #quantum University of California, Berkeley Ruohan Yan Sophia Shao Sapienza Università di Roma Vrije Universiteit Amsterdam (VU Amsterdam) Daniele De Sensi, Lorenzo Pichetti Korea University KAIST Daehyeon Lee imec CSIC Universidad de Sevilla Mauricio Velázquez López Bernabé Linares-Barranco Synopsys Inc Yinghua Hu Hari Cherupalli University of Illinois Urbana-Champaign Microsoft Yuqi Xue UNSW Diraq Sandia National Laboratories Leibniz-Institut für Kristallzüchtung (IKZ) Tuomo Tanttu Wee Han Lim University of Arizona Yuchao Liao, Tosiron Adegbija Roman Lysecky Physikalisch-Technische Bundesanstalt, PTB Thermo Fisher Scientific Dr. Richard Ciesielski , Janusz Bogdanowicz, Roger Loo

Chip Industry Week In Review: https://lnkd.in/gzEHazP6 Adani and Tower fab in India; U.S. and Dutch export updates; Russian weapons with U.S. ICs; new panel-level package center; global semi sales; Europe's Chips Act 2.0; Nvidia and Microsoft lawsuit; Hot Chips AI processors architectures; Intel’s 18A; Phil Kaufman winner; apprenticeships. https://lnkd.in/gzEHazP6 #semiconductor #fabs #lithography #exportcontrols Analog Devices AMD Intel Corporation Texas Instruments U.S. Department of Commerce ASML Tower Semiconductor Adani Group Onto Innovation Semiconductor Industry Association SEMI European Semiconductor Industry Association (ESIA) Xockets, Inc. NVIDIA NXP Semiconductors Vanguard International Semiconductor Company TSMC ASE Global AGC Group Dover Corporation Safe Superintelligence Inc. BigEndian Semiconductors NY CREATES Rambus Keysight Technologies Qualcomm PQShield ACM RESEARCH, INC. Fraunhofer IIS Element Six Daniel Twitchen Fraunhofer IIS Benjamin Lilienthal-Uhlig Absolics Inc. Jason Cong UCLA

Balancing Programmability And Performance In Cars https://lnkd.in/gBSeMuFF Customization and adaptability are essential for software-defined vehicles, but there’s a price to pay for that flexibility. By Ann Mutschler. #SDV #ECUs #FPGA #ADAS #automotive Robert Day Arm David Fritz Rehan T. AMD Jayson Bethurem Flex Logix Technologies, Inc. Cadence Design Systems Rich Goldman Ansys Steve Roddy Quadric Bosch DENSO Aptiv Siemens Digital Industries Software

New AI Processors Architectures Balance Speed With Efficiency https://lnkd.in/g-N4cC6b By Ed Sperling. Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator. #processors #AI #AImodels #HotChips #DPU #GPU #LLMs Hot Chips Symposium NVIDIA Raymond Wong Arm IBM Christopher Berry Intel Corporation Roman Kaplan AMD Alan Smith Arik Gihon Qualcomm TSMC Gerard Williams III FuriosaAI June Paik

Defining The Chiplet Socket: https://lnkd.in/e9ZbV2GY The industry may have started with the wrong approach for enabling a third-party chiplet ecosystem, but who will step in and fix it? By Brian Bailey. https://lnkd.in/e9ZbV2GY 5 Experts Panel: The semiconductor industry has been buzzing with the possibilities surrounding chiplets, but so far this packaging technology has been confined to large semiconductor companies that are vertically integrated. The industry has been attempting to open this up to a broader group of people. To work out what this means for chiplets, and what standardization will be required, Semiconductor Engineering sat down with Elad Alon, CEO Blue Cheetah Analog Design, Inc.; Mark Kuemerle, vice president of technology at Marvell Technology; Kevin Yee, senior director of IP and ecosystem marketing at Samsung Semiconductor; Sailesh Kumar, CEO of Baya Systems; and Tanuja Rao, executive director, business development at?Synopsys Inc. Held at the Design Automation Conference. #chiplets #semiconductor #advancedpackaging #heterogeneousintegration #BOW #UCIe #PHY