Day One ? Great first day at #GOMACTech! Engaging discussions, cutting-edge microelectronics, and valuable connections. Proud to see Northrop Grumman driving innovation that powers both American defense and commercial advancements. Stop by Booth #700!! (And check out the pin!!) https://lnkd.in/gZEFpNbX Lesley Cheema
QuantumFlow, Inc.
航空防务制造业
Los Angeles,California 1,207 位关注者
Harnessing the power of the information age to communicate and deliver the latest data and components in RF and MmWave.
关于我们
Founded in 2015, QuantumFlow has established amazing partnerships with well known and respected suppliers in the fields of RF, Microwave, and Millimeter-wave active and passive components. Our team supports applications ranging from commercial, to aerospace and DoD. We strive to provide real-time world class customer service and engineering expertise from industry experts.
- 网站
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https://quantumflow.co
QuantumFlow, Inc.的外部链接
- 所属行业
- 航空防务制造业
- 规模
- 2-10 人
- 总部
- Los Angeles,California
- 类型
- 私人持股
- 创立
- 2015
- 领域
- account management、sales、technology 、RF、microwave、millimeter wave、internet of things、GaN、TWTs、Interconnect Solutions、5G、interconnect technologies、cable assemblies、program management、aerospace、space exploration、radio frequency 和supply chain
地点
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主要
US,California,Los Angeles,90027
QuantumFlow, Inc.员工
动态
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Northrop Grumman excellent booth at GOMAC ??
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Our microelectronics teams are out-innovating themselves everyday, while focusing on our people, communities and the environment. Many of our manufacturing processes, as well as the equipment in our labs and fabs, were implemented with sustainability in mind. I'm excited to watch these teams grow and thrive for years to come :) (See the callouts on page 40 and 44 of the 2024 Sustainability Report.) https://lnkd.in/gNAiagpG
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A solder ball, which ranges from 100 to 760 microns in diameter, is about the size of a grain of sand, similar in size to the circumference of a human hair. These solder balls are used to connect semiconductor chips to printed circuit boards, ensuring secure attachment and reliable electrical conductivity. This is an example of how Northrop Grumman’s Advanced Packaging is transforming the performance, efficiency and reliability of mission-critical microelectronics. Our cutting-edge techniques include 3D stacking, system-in-package (SiP), and wafer-level packaging, which allow for higher functionality and power in a smaller device. #NorthropGrumman #Microelectronics #GoMACTech #AdvancedPackaging #Defense
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The new and improved NGMC website looks great, nicely done. Rachael Tiehel thanks for the update.
I am becoming such a nerd for microelectronics ;) Check out our new and improved Northrop Grumman Microelectronics Center webpage!! All the praise to Victoria Prestianni, Nichelle Holmes, Leslie Zychowski and our brand team for taking our vision and making it a reality. https://lnkd.in/eqBctj2N
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Join us and the team this week at SATELLITE Conference & Exhibition #Space #SatelliteShow2025
SATELLITE Conference & Exhibition Day 1 the #Setup ????????????? #FollowMe
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Advanced Packaging is revolutionizing Mission-Critical Microelectronics by integrating multiple components into a single package, enhancing performance, and addressing Size, Weight, Power & Cost (SWaP-C) constraints. This innovation is vital for the U.S. defense sector, ensuring technological superiority and supply chain security. Northrop Grumman, building on its legacy of Microelectronics from Westinghouse and TRW, continues to lead in this field, contributing to advancements that support both military and commercial systems. More details of what NG is doing to scale Advanced Packaging: https://lnkd.in/ew6N6gPY #Microelectronics #Semiconductors #SemiconductorIndustry #NorthropGrumman
PR & Communications Pro ?? | Bringing Microelectronics to Life ????| Tech Storyteller & Innovation Leader ?? | Northrop Grumman
Is Advanced Packaging the next large leap for mission-critical microelectronics? You bet it is, and Northrop Grumman is leading the way. Read the article below to learn more about how we're driving the future of microelectronics innovation with Advanced Packaging. ?? Kudos to Rachael Tiehel, David Shahin, Lesley Cheema, Sean Dunphy and Matt Hicks for making this story come to life! https://lnkd.in/eav2AEMA
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Let's connect in DC next week at the SATELLITE Conference & Exhibition. We're looking forward to collaborating on #Space #Satellite #LEO #GEO
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Day 2 of the Device Packaging Conference is here! Yesterday was an incredibly busy and productive day, filled with great conversations and exciting insights. We’re thrilled to continue connecting with industry professionals and showcasing our mmWave packaging solutions. If you’re at the conference, we’d love for you to stop by our booth #510 to learn more about how our innovative solutions can help drive your next project forward. #Nuvotronics #DPC2025 #IMAPS #PolyStrata #DevicePackaging
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Nuvotronics booth 510 at International Microelectronics Assembly and Packaging Society (IMAPS) day 1 has been great so far. Tim Smith has been on ?? today, plus rocking that awesome bow tie ??. He definitely deserves a glass of water, great work! Stop by and check out all the cool stuff happening at Nuvotronics. #PolyStrata #mmWave #MMIC #Packages