QP Technologies

Come see us at the MEMS & Imaging Sensors Summit, adjacent to Semicon Europa and Electronica in Munich, Germany! #QPTechnologies #MEMSANDImagingSensorsSummit #SemiconEuropa #Electronica

As chips and their components grow smaller, the role of packaging becomes increasingly important. The majority of die still use traditional packages, such as quad flat no-lead packages (QFNs), ball grid arrays (BGAs), dual in-line packages (DIPs), and small-outline ICs (SOICs). QFNs are particularly common due to the low cost of the equipment to build, test and assemble them. In a recent interview with Mark LaPedus of Semiecosystem blog, QP Technologies CEO Dick Otte discussed our broad catalog, from mature package types to emerging packages such as those for chiplets. Glean more of his insights on packaging trends and how QP Technologies meets market demands by reading the full Q&A article here: https://lnkd.in/gtnD3xaZ #QPTechnologies #chiplets #microelectronics #advancedpackaging

We’re looking forward to connecting with you next week at the MEMS & Imagining Sensors Summit, Nov. 14 in Munich, Germany! Join us at booth #1 to learn more about our experience in the MEMS and Sensors market. You can also DM us to schedule a time for a meeting! #QPTechnologies #microelectronics #advancedpackaging #MEMS #Sensors

Power semiconductor devices are in high demand for their efficiency in handling high power and voltages, benefiting markets like automotive, consumer electronics, and renewable energy. Silicon carbide (SiC) and gallium nitride (GaN) have emerged as alternatives to silicon that offer higher efficiency and reduced power loss. QP Technologies has proven expertise in precise thinning, polishing, and dicing SiC or GaN-on-silicon wafers while protecting these delicate compound semiconductor materials from damage. Learn more about our power semiconductor capabilities on our website: https://lnkd.in/eUHfdr9H #QPTechnologies #microelectronics #advancedpackaging #powersemiconductor

Have you subscribed to our quarterly newsletter? The next issue will be coming out soon! Catch up on the latest QP news and get a sneak peek at our upcoming events. Sign up on our website to receive the newsletter in your inbox: https://lnkd.in/em62FDwg #QPTechnologies #microelectronics #advancedpackaging

QP Technologies offers wafer preparation both as a part of packaging and assembly projects and as a stand-alone service. We handle wafers up to 300mm using advanced equipment and in-house processing, delivering exceptional quality in as little as one day. Our wafer preparation services include wafer washing, backgrinding, thinning, dicing, and more. Explore our wide range of wafer capabilities on our website: https://lnkd.in/edHwyU_g #QPTechnologies #microelectronics #advancedpackaging

Last week, at the European Microwave Conference, we connected with attendees and showcased how our packaging solutions cater to their millimeter-wave needs. We gained some great insights from the show! #QPTechnologies #EuMW2024 #EuMW24 #Microwave #RF #AdvancedPackaging

Substrates provide mechanical strength and electrical connectivity in microelectronics, and custom substrates are increasingly necessary to serve the unique challenges of emerging applications. QP’s custom substrate expertise has helped many companies to manage complex designs while meeting time-to-market objectives. To learn more about our custom substrate capabilities with real-world examples, please read our latest blog article: https://lnkd.in/eQXhxqtj #QPTechnologies #microelectronics #advancedpackaging #substrates

We hope to see you soon at the iMAPS Symposium, Oct. 1-2 in Boston! Our team will be at booth 202, ready to learn about your microelectronics projects and show you how our packaging and assembly services can meet your needs. #QPTechnologies #microelectronics #advancedpackaging

We hope to see you soon at the iMAPS Symposium, Oct. 1-2 in Boston! Our team will be at booth 202, ready to learn about your microelectronics projects and show you how our packaging and assembly services can meet your needs. #QPTechnologies #microelectronics #advancedpackaging