Promex Industries Inc.

Glass substrates are emerging as an alternative that surpasses the limits of traditional substrates. Glass offers new opportunities for high-performance, compact, and energy-efficient electronics, but comes with unique packaging and assembly challenges. How will the industry address these hurdles, and what’s next for glass in semiconductor packaging? Check out Dick Otte's latest blog post to explore how glass could shape the future of semiconductor packaging and high-frequency, high-density applications: https://hubs.li/Q03bMyMr0 #SemiconductorPackaging #GlassSubstrates #TechInnovation #ChipDesign #microelectronics #semiconductors #advancedpackaging

Happy 10th anniversary to NextFlex! Our team will be at Innovation Days 2025 next week. If you’re attending, be sure to stop by our exhibition to explore our advanced packaging and assembly capabilities! #Innovationdays2025 #hybridelectronics #manufacturing #microelectronics #advancedpackaging

Last month, we hosted UC Berkeley College of Engineering students for a tour of the factory and a roundtable session with CEO Dick Otte, COO Dave Fromm, SVP Rosie Medina and Sr. Process Engineer Justin Weltmer. We thoroughly enjoyed the group's engagement and curiosity, and we had a great time answering their questions on topics ranging from manufacturing processes and semiconductor history to employee hiring practices for entry-level engineers and lean manufacturing principles. We’re excited to continue connecting with and mentoring the next generation of engineers and designers! #semiconductors #microelectronics #engineering #manufacturing

What obstacles are standing in the way of 3D-ICs and 3.5D packaging innovation? In part two of this Semiconductor Engineering roundtable, our CEO Dick Otte and fellow packaging experts Michael Kelly, William Chen, and Sander Roosendaal discuss the complexities and breakthroughs of packaging technologies, including: ·? Approaches to thermal management, especially how to deal with thermal gradients ·? How to share and leverage industry knowledge ·??Applying past advancements to medical & optical applications ·??The role of organic interposers in the current landscape Explore the full article to hear what the experts have to say about the future of 3D-ICs and next-gen chip technologies: https://lnkd.in/grwMQmay #ThermalManagement #Semiconductor #advancedpackaging #ChipDesign

We’re here at #DPC2025 with QP Technologies . Stop by booth #309, meet our team, and discover our packaging solutions for medtech, biotech, mil-aero, LiDAR, and more! Don’t forget to check out our poster presentation, “Heterogeneous Integration Enables New Functionality in Medical and Biotech Devices,” today from 5:30 – 7:30 p.m. And join us for our presentation at the co-located Medical Microelectronics Workshop on March 7 at 11 a.m., where we'll explore “The Flexibility of Wearables and Small Form-Factor Devices: The Art and Science of Integrating Chips into Flexible Components.” #DPC2025 #MedicalDevices #MedicalMicroelectronics #HealthcareTech #semiconductors #advancedpackaging

From injectable pressure sensors to self-propelled pill cams, MEMS and sensors are powering breakthrough technologies across industries like healthcare, aerospace, and automotive. But with this innovation comes a set of unique challenges in integration and manufacturing. Our CEO Dick Otte explored these challenges in an article for Chip Scale Review and discussed the following key points: ? The complex assembly of MEMS and sensor chips requires precision to avoid damaging sensitive components. ? Designers must also consider cost efficiency and maintaining a long shelf life. ? Heterogeneous integration (HI) is pushing sensor performance and reliability to new heights. Check out the full article on page 31 for examples illustrating how the integration of semiconductor chips and MEMS is revolutionizing sensor technology: https://lnkd.in/gzBGBjVC #SensorTech #MEMS #Innovation #advancedpackaging #Semiconductors #medicaldevices

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As chips become more advanced with stacked, heterogeneous designs and complex materials, engineers face new, unpredictable sources of variation. Achieving precision now requires a comprehensive consideration of how all components and processes interact, and the ability to adapt to unexpected variations. For instance, maintaining alignment during bonding demands exceptional precision to avoid misalignment, void formation, and interconnect failure. In this Semiconductor Engineering article, CEO Dick Otte and COO Dave Fromm share their expert insights on how Promex ensures precision during bonding and effectively manages warpage control. Don’t miss their valuable perspective—read the full article here: https://hubs.li/Q036Z0Ds0 #promexindustries #microelectronics #semiconductors #advancedpackaging

Next month, alongside iMAPS Device Packaging Conference, we’ll be presenting at the co-located Advanced Packaging for Medical Microelectronics Workshop! Join us on March 7 for our session on The Flexibility of Wearables and Small Form-Factor Devices: The Art and Science of Adding Chips to Components That Flex. Don’t miss it! #DPC2025 #MedicalDevices #MedicalMicroelectronics #HealthcareTech #semiconductors #advancedpackaging

Our team is at #MDMWest this week at booth 2393! We also had a great time hosting our Keck Graduate Institute students at the show! As MD&M is celebrating 40 years of manufacturing excellence, Promex is proudly marking our 50th anniversary this year. Learn about our journey and transformation in this company story: https://hubs.li/Q035mPtv0 #medtech #microelectronics #semiconductors #advancedpackaging