Onto Innovation

?? Speaker announcement! ?? Get ready to hear from Mike Rosa, Chief Marketing Officer & SVP Strategy at Onto Innovation, at CS International Conference 2025! ? Mike’s presentation on 'High Sensitivity & Throughput Defect Inspection Technologies for SiC and GaN Power Technologies' is one you won’t want to miss! CS International spans two days and features over 30 presentations, focusing on five key themes of the compound semiconductor industry. ?? Secure your spot today: https://lnkd.in/e3GDQSP ?? 7th - 9th April 2025 ?? Brussels, Belgium #CSInternationalConference #CS #eventtech

?? Theme Focus: 'Optimising opportunities for SiC success'? As sales of electric vehicles stutter, SiC revenues could face some bumps in the road ahead. So, what’s the best approach to optimising returns in these uncertain times? ? We are thrilled to announce the confirmed speakers presenting under this theme at CS International Conference 2025!: ?? Alessandro Rossi - SCREEN SPE Germany Gmbh ?? Bernhard Hammerl - Siconnex ?? Dirk Johannes Kok - Malvern Panalytical ?? Frederic Falise - PVA TePla AG ?? Llew Vaughan-Edmunds - Navitas Semiconductor ?? Malte Müller - Lapmaster Wolters GmbH ?? Marius Fischer - Nanotronics ?? Michael Sch?ler, Dr.-Ing. - PVA TePla AG ?? Mike Rosa - Onto Innovation ?? Peter Friedrichs - Infineon Technologies ?? Yannick Schneider - TRUMPF ?? David Britz - Applied Materials Don't miss this opportunity to learn from the best in the industry! Register for Angel Tech 2025 now ?? https://lnkd.in/e3GDQSP #AngelTech #CSInternationalConference

As AI technologies continue to evolve, they demand increasingly stringent chip performance, which in turn relies on advanced chiplet technology. The key to enabling these chiplets is advanced packaging, with ultra high density fan out packaging and 2.5D/3D packaging being proposed as chiplet manufacturing solutions. To meet the requirements of these technologies, advanced IC substrates (AICS) must support larger packaging areas, higher I/O density, smaller ball pitches and an increased number of packaging layers. Extremely large exposure fields combined with fine resolution lithography are critical to achieving these goals. A large exposure field allows for the exposure of large areas without stitching, while fine resolution supports smaller line/space and finer ball pitch to achieve higher I/O density demands. However, this technology faces challenges, particularly regarding the tight overlay budgets required by the increasing number of layers and finer RDL pitches. One of the major contributors to overlay errors is alignment solution errors, which degrade overlay accuracy and yield. At this year’s International Conference on Electronics Packaging/iMAPS All Asia Conference, Onto Innovation’s John Chang will discuss a new technology solving this challenge: advanced post overlay compensation. To learn more about Onto’s lithography solutions, please visit: https://lnkd.in/enTe3kHJ. For more on the conference, please visit: https://lnkd.in/gXfyiJ4E.?

You may have heard that AI’s need for increased compute power is leading to larger AI chip sizes. If companies like TSMC and Intel are limited to 300mm round substrates for wafer level packaging, it will impact their per-wafer yield. That’s why there is a push to square panels. Recognizing this, our member ASE Global is setting up a test panel-level packaging production line.?Other members, including Fraunhofer IZM, ACM RESEARCH, INC., Yield Engineering Systems, Evatec AG, Onto Innovation, KLA are among those who have worked to develop PLP process, materials, and tools to make this possible. Read the full story in Dean Freeman’s latest post: https://lnkd.in/guUcJmHx

The 2025 Compound Semiconductor Magazine & CS International Conference is just a few weeks away in Brussels, Belgium, and Onto Innovation’s Mike Rosa will be on hand to deliver the presentation “High Sensitivity & Throughput Defect Inspection Technologies for SiC and GaN Power Technologies.” In his presentation Mike will address a few of the more fundamental challenges that can occur in the production of SiC- and GaN-based devices at larger wafer sizes. In addition, he will explore several solutions, including the Celero? PL, for critical process steps. The Celero PL system is designed to fulfill the need for subsurface defect inspection and classification capability for silicon carbide (SiC) and gallium nitride (GaN) based wafers and compound semiconductor materials. Available with a range of wafer handling options offering the ability to meet both R&D and high-volume production needs while providing best in class throughput and sensitivity at the lowest cost of ownership per pass. For more on the conference taking place April 7-9, please visit: https://lnkd.in/edYpw_sz. To learn more about the Celero PL, please visit: https://lnkd.in/evUdKcF8.

Onto Innovation is currently hiring for a Senior Manager, Sales, Inventory & Operations Planning. The Senior Manager will effectively own and drive the inventory reduction management process across business units by working with leaders across the enterprise to drive governance and accountability to target, execute the monthly management of the SI&OP process capturing the status and challenges in a monthly dashboard to cross functional stakeholders, and ensure standardized templates and data sources are developed and executed each month within the agreed calendar allowing issues and actions to be raised holistically to each department and business unit. To learn more about this position, please visit: https://lnkd.in/ebBGQtZp.

It is with profound sadness that we announce the passing of Paul F. McLaughlin, who served as chief executive officer of Rudolph Technologies from 1996 to 2015. Under Paul's leadership, Rudolph Technologies evolved into a leading supplier of process control equipment for the semiconductor industry. He played a pivotal role in the company's IPO in 1999 and was instrumental in the acquisition of August Technology in 2006, which laid the foundation for the company's future growth in process control. Paul's legacy is one of innovation, dedication, and transformative leadership. He will be deeply missed by all who had the privilege of knowing him. Our heartfelt condolences go out to his family, friends, and colleagues during this difficult time. https://lnkd.in/eaCCN29K

Better tools, automation, and analytics improve FA, but determining the cause of failure is still difficult. By Laura Peters. https://lnkd.in/gMCjb-nz #failureanalysis #semiconductor #yield #scandiagnosis Jayant D'Souza Samuel Lesko Trevan Landin Melvin L. Guy Cortez Bruker Thermo Fisher Scientific Onto Innovation Synopsys Inc Siemens Digital Industries Software Andras Vass-Varnai, Ph.D.

SEMICON China 2025 runs March 26-28 in Shanghai, and the Onto Innovation team will there at Booth 2177 to discuss our unique lineup of process control solutions enabling our customers to meet today’s challenges without sacrificing throughput. To learn more about Onto, please visit: https://lnkd.in/eWuWEgq8, For more on SEMICON China, please visit: https://lnkd.in/dVabxhB.

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