We're #hiring a new Director, Product Quality in Bloomington, Minnesota. Apply today or share this post with your network.
Onto Innovation
半导体制造业
Wilmington，Massachusetts 15,161 位关注者
Onto Innovation stands alone in process control with our unique perspective across the semiconductor value chain.
关于我们
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization. We are traded on the New York Stock Exchange under the symbol ONTO.
- 网站
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https://www.ontoinnovation.com
Onto Innovation的外部链接
- 所属行业
- 半导体制造业
- 规模
- 1,001-5,000 人
- 总部
- Wilmington，Massachusetts
- 类型
- 上市公司
- 创立
- 2019
地点
Onto Innovation员工
动态
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Onto Innovation is currently hiring for an Oracle CPQ Manager in our Bloomington, Minnesota office. The Oracle CPQ Manager (Configure, Price, Quote) is a critical hands-on people mananger role supporting global Oracle Cloud ERP implementation. The position will be our expert in understating and supporting CPQ functionality within Oracle Quote to Cash. To apply for this job, please visit: https://lnkd.in/eC3gxZTw.
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Onto Innovation is currently hiring for a Director, LBU Program Management, in our Wilmington, Massachusetts offices. The candidate will be responsible for leading the Lithography Business Unit, driving global, cross business unit strategic programs. In addition, the candidate will be a program management expert providing oversight from conception and planning to implementation, including strategies, processes and resources. To apply for this position, please visit: https://lnkd.in/eUiB_gzi.
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We're #hiring a new Director Program Management in Wilmington, Massachusetts. Apply today or share this post with your network.
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Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable challenge. By Gregory Haley. https://lnkd.in/gfdavCkt #semiconductor #FOPLP #advancedpackaging #fanoutpanellevelpackaging Doug Scott Amkor Technology, Inc. Chee Ping Lee Lam Research Lihong Cao ASE Global Wenkai Cheng Brewer Science Samsung Semiconductor TSMC Powertech Technology (Suzhou) Ltd. Dick Otte Promex Industries Inc. Keith Best Onto Innovation Eoin OToole Amkor Technology Portugal S.A John R Hoffman Nordson Test & Inspection Shawn Nikoukary Synopsys Inc Keith Lanier
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The 26th Electronics Packaging Technology Conference (EPTC) is next week in Singapore. At the conference, Onto Innovation’s Sylvain Misat will discuss a process solution for 2.5 and 3D advanced packages that optimizes interconnect routes and enhances wafer yield while addressing two key heterogeneous integration challenges, multiple die-displacement and image stitching. To learn more about Onto Innovation’s line of lithography solutions, please visit: https://lnkd.in/enTe3kHJ. For more on EPTC, please visit: https://eptc-ieee.net/.
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We're #hiring a new Commodity Business Senior Manager in Milpitas, California. Apply today or share this post with your network.
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We're #hiring a new SOX Auditor in Wilmington, Massachusetts. Apply today or share this post with your network.
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We're #hiring a new MES Specialist in Bloomington, Minnesota. Apply today or share this post with your network.
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The November/December issue of Chip Scale Review is out, and in it you'll find an article from Onto Innovation's Keith Best, "Accelerating the advanced packaging roadmap with multiple technological innovations." In the article Keith discusses the increasingly stringent line/space requirements of advanced IC substrates and the path forward for organic and glass substrates in meeting those requirements. For more, click on the link in the post below.
Chip Scale Review | New Issue | November December 2024 www.chipscalereview.com
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