Onto Innovation

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The November/December issue of Chip Scale Review is out, and in it you'll find an article from Onto Innovation's Keith Best, "Accelerating the advanced packaging roadmap with multiple technological innovations." In the article Keith discusses the increasingly stringent line/space requirements of advanced IC substrates and the path forward for organic and glass substrates in meeting those requirements. For more, click on the link in the post below.

We're #hiring a new Staff Manufacturing Engineer in Milpitas, California. Apply today or share this post with your network.

“No matter what industrial environment you are in, manufacturers have numerous ways to approach how they employ digital twins,” Onto Innovation’s Sean King writes in our latest blog at Semiconductor Engineering. “Selecting the best path forward comes down to finding the simplest way to address business problems, clear the noise and ensure consistently trustworthy results. Developing digital twins in an industrial setting involves asking the right questions and continually making sure you are solving the right problem – and that you are not venturing too far away from that solution.” To learn more about digital twins, and what Sean else has to say, please visit: https://lnkd.in/e3bbDp_k. For more on Onto's software solutions, please visit: https://lnkd.in/eayCNdFH.

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The 26th Electronics Packaging Technology Conference (EPTC) is just a few weeks away, December 3-6, in Singapore. At the conference, Onto Innovation’s Sylvain Misat will discuss a process solution for 2.5 and 3D advanced packages that optimizes interconnect routes and enhances wafer yield while addressing two key heterogeneous integration challenges, multiple die-displacement and image stitching. To learn more about Onto Innovation’s line of lithography solutions, please visit: https://lnkd.in/enTe3kHJ. For more on EPTC, please visit: https://eptc-ieee.net/.

Onto Innovation is currently hiring for a Director Product Marketing, Inspection Products, in either our Wilmington, Massachusetts, or Milpitas, California, office. The position is responsible for: ? Go-to-market strategy, positioning and customer engagement for unpatterned and patterned inspection products. ? Identifing key inspection product applications/requirements across wafer and panel product lines. ? Meeting with customers and collecting customer inputs (VoC) on key product requirements for specific on wafer/panel applications. ? Working closely with strategic marketing in creation of inflection roadmaps application market(s). ? Product centric collateral including customer marketing and technical presentations. ? Identifying inspection segment gaps and opportunities making recommendations toward M&A on same. To apply for this position, please visit: https://lnkd.in/eWCw76et.

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The 26th Electronics Packaging Technology Conference (EPTC) is a next month in Singapore. At the conference, Onto Innovation’s Cheolkyu Kim will discuss how PULSE? technology can also be used for interconnect process control in advanced packaging. To learn more about PULSE, please visit: https://lnkd.in/gh-qJys5. For more on EPTC, please visit: https://eptc-ieee.net/.

Onto Innovation is currently seeking a Software Program Manager in its Wilmington, Massachusetts office. This is a temporary position. In the role of temporary Program Manager, you will supplement the Enterprise Software business to map out program delivery goals with a focus on project execution, cross-functional alignment and agile best practices. This role reports to Senior Operations Manager of the Enterprise Software Business Unit but will collaborate primarily with Software Engineering and Product Management. This role is best suited for someone who is organized and comfortable with assigning and seeking completion of tasks in a matrix organization. To learn more, please visit: https://lnkd.in/eFC_YmBv.