关于我们
Scaling AI
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www.mixxtech.io
Mixx Technologies Inc的外部链接
- 所属行业
- 半导体制造业
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- 11-50 人
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- San Jose，California
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主要
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2055 Gateway Pl
Suite 670
US，California，San Jose，95110
Mixx Technologies Inc员工
动态
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??Exciting announcement: Our Co-Founder and CTO, Dr. Rebecca Schaevitz, will be featured as a panelist at DesignCon 2025! ?? ??? Panel Topic: *The Need for Speed & Sustainability in Datacenters for AI: Can CPO Take Us There?* ?? Date: Wednesday, January 29, 2025 ? Time: 4:00 PM - 5:15 PM PT ??? Location: Ballroom B, Santa Clara Convention Center, Santa Clara, CA. Dr. Schaevitz’s deep expertise in Co-Packaged Optics (CPO) and unwavering commitment to innovation make her a standout voice in the industry. She’ll join an incredible lineup of leaders to discuss how CPO is driving AI infrastructure towards greater speed, efficiency, and sustainability. ? Rebecca’s insights promise to ignite engaging discussions about the future of AI and its foundational technologies. Learn more about the panel and what’s in store: https://bit.ly/42h7a9O We’re proud to see Rebecca representing *Mixx Technologies* and contributing to shaping the path forward for AI innovation. Don’t miss this must-attend session! Register here: https://bit.ly/3BZr0Mk #Leadership #Innovation #TechPanel #WomenInTech #ProudMoment #designcon2025 #AI
Tech Tip Tuesday with Ansys Optics: Co-Packaged Optics—Revolutionizing Data Centers Did you know that co-packaged optics (CPO) can dramatically improve data center efficiency and performance? By integrating optical transceivers directly with chip packaging, CPO eliminates the long electrical paths found in traditional designs. The result? Reduced latency, enhanced bandwidth, lower power consumption, and scalable architectures—key factors in meeting the growing demands of today’s data-intensive applications. ?? Key Advantages of Co-Packaged Optics: ? Reduced Latency: Shorter electrical paths mean faster data transmission. ? Enhanced Bandwidth: Supports increasing data demands with ease. ? Lower Power Consumption: Optical connections drastically cut energy usage. ? Increased Scalability: Simplified designs for seamless future growth. Learn how Ansys Optics is driving the future of data centers! With its cutting-edge simulation tools, Ansys Optics is leading the charge in enabling precision modeling, performance optimization, and accelerated development of CPO technologies. These tools help designers overcome challenges like thermal management, optical coupling, and seamless integration of optical and electrical components. Check out our recent Application Gallery Article: Signal Integrity Analysis in a Co-packaged Optics System using RaptorX-Spectre-INTERCONNECT Interop https://ansys.me/4j7uTzg Join the Conversation! Discover how CPO is paving the way for sustainable and high-performance data centers at DesignCon 2025: ?? Wednesday, January 29, 2025 | ? 4:00 PM - 5:15 PM PT I ??? Ballroom B https://ansys.me/4j8oW5j Panel Topic: The Need for Speed & Sustainability in Datacenters for AI: Can CPO Take Us There? Don’t miss this panel featuring photonics industry experts tackling CPO’s challenges, including packaging, thermal management, and optical coupling, while exploring its vast potential. #DataCenters #CoPackagedOptics #OpticalSimulation #DesignCon2025 #Sustainability
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Happy Holidays from Mixx Technologies! ??? May the holidays shine bright and illuminate the path to innovation and success in the new year! Cheers to a fantastic 2025! #HappyHolidays #Innovation #Gratitude #MixxTechnologies
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?? Congratulations to Dr. Rebecca Schaevitz! ?? We’re thrilled to share that our very own Chief Product Officer, Dr. Rebecca Schaevitz, has been recognized as one of the Top 100 people in Photonics by Photonics 100! ?? Her passion, dedication, and vision continue to drive groundbreaking advancements in the field and inspire everyone at Mixx and beyond. Here’s to many more milestones and much more brilliance ahead! ??? #Photonics100 #ProudTeam #Innovation #WomenInTech
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"Mindset: What we have done in the past will not work in the future!" says Dr Rebecca Schaevitz, at the PECC Summit, at Sunnyvale, CA by Optica and Advanced Photonics Coalition #OutOfTheBox #IntoTheEcosystem #innovation #technology #AI
"How do we connect more chips together? Optics can. We are here today because we believe this. How can we scale up? Transceivers today are not meeting the requirements. We have to change our focus and mind set. 'What we have done in the past will work in the future' is Not the mind set. We need to have a paradigm shift." Rebecca Schaevitz of Mixx Technologies Inc at the PECC Summit in Sunnyvale, CA by Optica and Advanced Photonics Coalition #technology #innovation #future #fiberoptics #management
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?? Exciting Announcement! ?? We are thrilled to share that our Chief Product Officer, Dr. Rebecca Schaevitz will present at the Optica Photonic-Enabled Cloud Computing Industry Summit in Sunnyvale, California. Dr. Schaevitz has been at the forefront of innovation in photonics and advanced manufacturing for data centers, and we're proud to have her represent Mixx Technologies at this prestigious event. Her presentation is set to be a thought-provoking dive into the crucial topic: how to sustainably scale optics for the future of artificial intelligence. Save the date: 22nd-23rd Oct 2024 Rebecca’s presentation: Wednesday, 23rd Oct, 2024 Time:? 8:40 - 9:55 am (PT) For registration: https://lnkd.in/gt3YVC2X #OpticaSummit #Photonics #CloudComputing #PECC #Innovation #Leadership #Networking #DrRebeccaSchaevitz
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AI network architecture’s new spineless approach. #AInetwork #largeAIclusters #Networkarchitecture Rebecca Schaevitz Vivek Raghuraman
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SemiCon India 2024 The recent Semicon India event in Greater Noida, sent ripples through the semiconductor world, extending far beyond India to everyone with an eye on India’s dynamic ecosystem. What made this event so noteworthy? Apart from the fact that India’s Prime Minister Modi inaugurated it, his inspiring speech resonated with a vision for India’s future as a global hub for manufacturing and innovations. For India to be positioned as a key contributor to the next wave of technological progress thereby inspiring confidence and excitement among stakeholders worldwide. “When the chips are down, you can bet on India,” Prime Minister Modi assured attendees that the country is well-positioned for success. He announced significant financial support for establishing semiconductor manufacturing, emphasizing the importance of developing a skilled workforce through training to pave the way for a bright future in this critical sector. Notably, the India Semiconductor Mission (ISM) has already facilitated investments of over USD $17 billion in semiconductor manufacturing projects across the country. Key Highlights from SEMICON India 2024 Strategic Partnerships: The event served as a platform for fostering partnerships between local and international stakeholders. Industry leaders from companies like Intel, TSMC, and Qualcomm participated, sharing insights on innovations and trends shaping the future of semiconductor technology. Focus on Sustainability: Discussions emphasized sustainability in semiconductor production, addressing energy efficiency and environmental impact. This focus aligns with global trends towards greener manufacturing processes. Talent Development: The government is investing to foster a skilled workforce for the semiconductor industry with plans to train around 85,000 technicians and engineers. This investment on human capital is crucial for sustaining growth in the high-tech sector. Emerging Technologies: The event highlighted advancements in next-generation technologies such as AI chipsets, sustainable architectures, and quantum computing. These innovations are essential for positioning India at the forefront of global technology trends. SEMICON India 2024 was not just an exhibition, it was a declaration of India's ambitions in the semiconductor space. With its rich pool of talent, a burgeoning startup culture, and supportive government policies, India is poised to not only meet its own semiconductor needs but also export to international markets. The possibilities are vast, and the visionary path laid out at the event will have lasting implications for the future of technology, both in India and across the globe. #semiconindia2024 #semiconductorindustry #india #technology #AI
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Thank you Samarth Shyam for your insightful thoughts on Vivek Raghuraman's talk about siliconization of interconnects for sustainable AI!
Hot take (kinda) of the day: Mass AI adoption is gated by hardware challenges! I just wrapped up an insightful session at Penang with BC Ooi from Broadcom and Vivek Raghuraman from Mixx Technologies Inc. The biggest takeaway? Mass AI adoption is gated by hardware challenges—especially in optical integration. Sharing some of my thoughts/insights from the session: 1) Optical integration is a cornerstone for advancing high-performance computing, yet it's hindered by significant challenges in manufacturability, interconnects, and heat dissipation. These obstacles are particularly evident in the development of co-packaged optics (CPO) and ASICs, where the complexity of combining multiple chiplets onto a single substrate creates further difficulties. 2) Fragmentation in EDA tools is a significant problem. While we knew this was an issue in the broader semiconductor space, it was eye-opening to realize its impact on the design of systems like CPOs and ASICs. This insight validated, again, why we're developing AI-based EDA solutions at Niyam AI. We need more integrated tools that streamline the design process and make these sophisticated technologies more accessible and efficient. It won't come from giants like Cadence and Synopsys, but through the new age mom-and-pop EDA solution providers. 3) One possible answer to the issues Vivek highlighted with optical integration: Substrate CPOs. Broadcom deserves credit here because they were among the first to successfully implement substrate CPOs at scale. While it's a promising solution, they don’t fully resolve broader issues such as optical integration complexity, heat dissipation in high-density packages, and manufacturability at scale. Additionally, design flexibility and the lack of standardization across the industry remain significant hurdles. Promising, but lots of development and refinement yet to come. 4) Tencent has been piloting advanced packaging with optical integration, achieving significant milestones in reducing costs and improving energy efficiency. I think the industry buzz is that the early results show that they’ve managed to cut optics costs by nearly 50% and achieve power savings of around 70%. The potential of integrating optics into semiconductor packaging is massive. Looking ahead, it's clear that innovation in both hardware and software is vital to meet the demands of mass adoption in AI. The road is challenging, but companies like Mixx Technologies Inc are driving the necessary changes. Snapshot below of the session and a quick snippet of the MVP we've been building for optimizing SIC MOSFETS for EV Inverters.
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