We're excited to be AUSA Global Force in Huntsville, Alabama this week! Come visit us at booth 2429 Schedule a meeting: https://bit.ly/3FrTe3s #microelectronics #semiconductor #semiconductorindustry #HiRel #HighReliability #DefenseElectronics #radhard #powerelectronics #DCDCconverters #MILSTD1553 #RF #microwave #ausa
Micross Components
半导体制造业
Apopka，FL 11,597 位关注者
The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions!
关于我们
Micross is the most complete provider of advanced microelectronic services and component, die and wafer solutions. With the broadest authorized access to die & wafer suppliers, and the most comprehensive advanced packaging, assembly, modification and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical, energy, communications, and industrial markets. Micross is the leading global one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. For more than 40 years, our extensive hi-reliability capabilities have served the global Aerospace & Defense, Space, Energy, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle. www.micross.com Micross' Advanced Test Facility, Silicon Turnkey Solutions (STS), located in Milpitas, CA is an industry-recognized collaborative partner that integrates design, engineering, manufacturing and qualification processes with operational expertise to provide leading edge technology and test services that enable customers to meet demanding time-to-market pressure, cost and technical challenges. Micross STS possesses more than 25 years of electronic test expertise.
- 网站
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https://www.micross.com/
Micross Components的外部链接
- 所属行业
- 半导体制造业
- 规模
- 501-1,000 人
- 总部
- Apopka，FL
- 类型
- 私人持股
- 创立
- 1978
- 领域
- Bare Die、Die & Wafer Processing、Component Modification、Custom Packaging、MIL-SPEC Connectors、PEM-Quals、Robotic Hot Solder Dipping、Custom Packaging、Chip Scale Packaging、Engineering & Analytical Services、Full Turnkey Test Services、CGA、Counterfeit Mitigation、Advanced Interconnect Technology、Wafer Level Packaging、Flip Chip/MCM、Electrical & Environmental Test、Lead Attach、Wafer Bumping、BGA Reballing、RF Testing、Assembly Services、Die Attach、SMD/5962 Hi-Rel Products、Hi-Rel Memory、COTS、Wafer Probe、Hi-rel Microelectronic Components、Column Attach、Device Characterization Testing、ASIC Design、MIL-STD-1553 Data Bus Couplers、Data Bus Products、High-Reliability Microelectronics、Hi-Rel Microelectronics、Hi-Rel Power Supplies、Hi-Rel Diodes、Diodes、Upscreening、ASIC、FPGA、Radiation Tolerant、Radiation Hardened、Rad-Hard、Space-Grade、MIL-PRF-19500、JAN、JANTX、JANS、Component Modification Services、Robotic Hot Solder Dip、MIL-PRF-38534、MIL-PRF-38535、DMEA Trusted Source、DLA Certified、ANSI/ESD S20.20、NADCAP和JOSCAR Registered
地点
Micross Components员工
动态
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We had an amazing week at GOMACTech!?John Lannon, General Manager of Micross Advanced Interconnect Technologies, presented at the Onshoring Advanced Packaging Capabilities Workshop, where he shared the state of advanced packaging capabilities in the US along with the latest developments.?Highlighting the latest capabilities and advancements resulting from the US Department of Defense (DoD) onshoring initiatives, John included an update on the IBAS Cornerstone RESHAPE program award Micross received in 2023 through the DoD to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP)?solutions.? This is an exciting time for high-reliability advanced packaging in the US, and we are very proud to be an instrumental part of this historic manufacturing renaissance in America. We look forward to continuing the great discussions from this week in serving the high-reliability microelectronics needs of the DoD. Micross specializes in life-cycle management of critical microelectronic solutions, effectively mitigating risks and ensuring continuity of supply across the entire microelectronics supply chain. Our recent acquisition of Integra Technologies has significantly enhanced our capabilities, positioning us to offer even greater support through our fully U.S.-owned and operated secure facilities. ? #GOMACTech #DoD #electronicssupplychain #DeptofDefense #semiconductorsupplychain #usmicroelectronics #ussupplychain #defenseElectronics #300mm #WaferProcessing #AdvancedPackaging #3DHI #WLP #chiplets #chipscale #advancedpackaging #HiRel #HighReliability #microelectronics #semiconductor #semiconductorindustry
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We're excited to be presenting at #GOMACTech, this week in Pasadena, CA! Join Integra as they present: 'Design, Packaging, Test and Qualification for SoC based Obsolescence Mitigation,' with Booz Allen Hamilton on March 19th and a poster presentation with ED2 Corporation on '28GHz Phased Array Module System-in-Package' on March 20th. Integra Technologies, booth 422 and Micross, booth 522
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We’re excited to announce the grand opening of our Hi-Rel Power Solutions facility in Ballerup, Denmark! A ribbon cutting was held Tuesday, March 11th commemorating the launch of our new center-of-excellence for the design and manufacture of high-reliability PCB based power solutions. The AS9100 and ISO9001 facility is the 4th Micross microelectronics manufacturing facility in Europe, and our 17th globally within the Micross ecosystem of end-to-end high-reliability microelectronics products and services. This new facility in Ballerup is a major upgrade from our former site, housing a 9,000 sq/ft design center and test lab, including a dedicated setup for EMC testing;?and our new 7,500 sq/ft manufacturing operations, outfitted with the latest and most advanced production equipment, providing engineering designers in the space, defense, medical, energy and other high-reliability markets, with world-class manufacturing capabilities to create optimized high-reliability PCB based power solutions, that most-efficiently and reliably serve their specific requirements. "Without exception, the installation of the Micross Center of Excellence for the Design and Manufacture of High-Reliability PCB Based Power Solutions here in Ballerup Denmark, was by far the fastest and most efficient deployment I had ever witnessed. The team transformed the new facility quickly and it was fully operational within 10 months!?Many thanks to the entire team in Ballerup that delivered this world-class facility in record time!” - Vince Buffa, Micross CEO Pictured left to right: Graham Jefferies (Managing Director), Lass S?lver Pedersen (GM Hi-Rel Power Solutions, Denmark), Dusty Kramer (Sr. VP, Hi-Rel Power Solutions) #PowerElectronics #SpaceElectronics #spaceradiation #microelectronics #semiconductor #semiconductorindustry #HiRel #HighReliability #radhard #powerelectronics #DCDCconverters #RF #microwave #Defense
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Just completed a great week exhibiting at the Satellite 2025 conference in Washington, DC, and the number of attendees and exhibitors eclipsed 2024 by a wide margin.?It was clearly evident that the expansion of the satellite market is accelerating, and we enjoyed making many new connections, supporting our current customers and partners in attendance, and sharing our new offering of cost-efficient space-grade microelectronics solutions for "New Space". Thank you to all who visited the Micross booth, we look forward to working with you!
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Meet us at AUSA Global Force Symposium & Exposition, March 25 - 27 in Huntsville, Alabama! We will be showcasing our latest DC-DC power converters, Diodes, MIL-STD-1553, RF, memory, and logic products, coupled with the most comprehensive end-to-end portfolio of hi-rel microelectronic packaging, modification, testing and qualification services. Our product experts & executives will be onsite to support your program and technical needs, and look forward to meeting with you! Schedule a meeting: https://bit.ly/3FrTe3s #microelectronics #semiconductor #semiconductorindustry #HiRel #HighReliability #DefenseElectronics #radhard #powerelectronics #DCDCconverters #MILSTD1553 #RF #microwave
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Our third speaker for the upcoming IDEA Summit is Anthony Mestre, General Manager of the Counterfeit Mitigation Division at Micross Components. We are greatly looking forward to learning more about advanced inspection and new techniques!
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Meet us at?GOMACTech, March 17-20 in Pasadena, CA! We will be showcasing our 2.5/3D advanced packaging capabilities, along with our complete portfolio of hi-rel microelectronics and services! Our product experts & executives will be onsite to support your program and technical needs, and look forward to meeting with you! Schedule a meeting: https://bit.ly/41nNG16 #GOMACTech #DoD #electronicssupplychain #DeptofDefense #semiconductorsupplychain #usmicroelectronics #ussupplychain #defenseElectronics #300mm #WaferProcessing #AdvancedPackaging #3DHI #WLP #chiplets #chipscale #advancedpackaging #HiRel #HighReliability #microelectronics #semiconductor #semiconductorindustry
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Congratulations to the winners of the 2025 3D InCites Awards, sponsored by EV Group and KLA The five recipients of the Technology Enablement Award identified and solved critical challenges in the commercialization and manufacturing of heterogeneous integration (HI), 3D HI, and chiplet architectures, driving the industry forward through cutting-edge solutions and advancements. They are: ACM RESEARCH, INC. Saras Micro Devices NHanced Semiconductors, Inc. Siemens Digital Industries Software and MacDermid Alpha Electronics Solutions A special Consortium Award is presented to Resonac for the progress it made with the JOINT2 and new US JOINT consortiums. This year’s Engineer of the Year Award recipient is Rex Anderson of Micross Components for his work with the RESHAPE program, as well as his ongoing engagement with peers through industry organizations, teaching and mentoring the next generation of engineers. The Best Place to Work Award, decided by an online vote, goes to Saras Micro Devices for its inclusive, dynamic, and thriving environment that fosters continuous learning, professional development, and employee well-being. Please join us in congratulating this year’s winners. Awards will be presented on March 4, at the International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference. Find more details in this blog by Fran?oise von Trapp https://lnkd.in/guHGaiNy
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