Join us at #IPCAPEXEXPO 2025 and discover unparalleled opportunities to learn, connect, and advance in the #electronics industry. Choose from a variety of registration packages designed to fit your needs and maximize your experience. Opt for the All-Access Package to unlock everything IPC APEX EXPO has to offer! Explore your options here: https://hubs.li/Q02ZxD2L0
关于我们
Since 1957, IPC has been guiding the electronics manufacturing industry through its dramatic changes. A global industry association dedicated to the competitive excellence and financial success of its more than 3,200 member companies, IPC represents all facets of the industry including design, printed board manufacturing, advanced packaging, and electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. With global headquarters based in Bannockburn, Illinois, USA, IPC maintains additional offices in Washington, D.C.; Atlanta, Ga.; Miami, Fla.; Mexico City, Mexico; Munich, Germany; Brussels, Belgium; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao (China headquarters), Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
- 网站
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https://www.ipc.org
IPC的外部链接
- 所属行业
- 非盈利组织
- 规模
- 51-200 人
- 总部
- Bannockburn，IL
- 类型
- 非营利机构
- 创立
- 1957
- 领域
- Industry Standards、Conferences and Trade Shows、Training、Market Research、Public Policy Advocacy、Envronment, Health and Safety、Electronics、manufacturing、advanced manufacturing、electronics manufacturing、electronics supply chain、education、industry intelligence、certification、events、government relations和standards development
地点
IPC员工
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D. Robert Erickson
Strategic. Futuristic. Maximizer. Learner. Arranger.
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Philippe Léonard
IPC Europe senior director - Founder, urbanwinddesign, Aeolta -
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Lyssa Bernstein
Senior Director Human Resources | Career Consultant | Resume Writer | NIHRC Director of Programs
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Edson Camilo
PCB DESIGNER SENIOR - IPC INSTRUCTOR
动态
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69 percent of #electronics #manufacturers agree that a broad understanding of AI is essential for the #workforce. Still, according to IPC’s November Sentiment Survey of the Global Electronics Manufacturing Supply Chain Report, current investment in AI skills development lags. Additional survey data show that the Labor Costs Index remained flat at its all-time low, but the Material Costs Index climbed to its highest level since June. Additional #IndustryIntel in the news release: https://hubs.li/Q02ZmC-c0
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October findings for the IPC North American #EMS Statistical Program show an increase in shipments for four consecutive months, with the total shipments in Oct. 2024 up 14.7 percent compared to Oct. 2023. The book-to-bill ratio stands at 1.25. #IndustryIntelligence News release: https://hubs.li/Q02Zk6l90
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“The October book-to-bill ratio for the North American PCB industry increased 3.1 percent compared to September, driven by strong bookings over the past three months and subdued shipments.” Shawn DuBravac, IPC chief economist, comments on the October findings from IPC’s North American Printed Circuit Board (PCB) Statistical Program. #IndustryIntelligence News release: https://hubs.li/Q02ZdhD70
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How do you ensure the cleaning products used throughout the #electronicsmanufacturing life cycle are safe and #sustainable? IPC and ChemFORWARD invite you to attend “Optimizing Cleaning Products in Electronics Manufacturing” on Dec. 10. This free webinar will provide information on: ? The utility of IPC-1402, “Standard for Green Cleaners Used in Electronics Manufacturing,” in defining cleaning products and processes, determining impacts on humans and the #environment, managing health, safety, and physical hazard requirements, and verifying and assessing relevant criteria. ? The new CleanScreen application and reporting tool. This app incorporates IPC-1402 criteria and allows you to rapidly screen cleaning formulations and create your product safety profile for B2B communications. ? Details on other tools, standards, and certification programs available to develop and market safer and more #sustainable cleaners for electronics manufacturing applications. To register: https://hubs.li/Q02ZcZfR0
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“I was overwhelmed by the idea that I might have to set up a training program to support my business independently. That’s when I heard about IPC’s apprenticeship program.” {{linkedin_mention(urn:li:person:CV7mDCFZKN|Allison Budvarson)}}, {{linkedin_mention(urn:li:organization:3359363|Out of the Box Manufacturing)}}, explains the importance of apprenticeships to building a trained, skilled workforce in the current issue of IPC Community magazine. #NationalApprenticeshipWeek #BuildElectronicsBetter Read more here: https://lnkd.in/g6kkgifg?
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Need help convincing your company’s leadership to attend #IPCAPEXEXPO 2025? Our Justification Toolkit has everything you need—clear cost breakdowns, key benefits, and compelling points to make your case. Show how attending this global gathering of experts, thought leaders, and innovators will drive value for your company. Download now: https://lnkd.in/gUfme5cr #ElectronicsManufacturing #MakeYourCase #BuildElectronicsBetter
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“Progress can only happen with effective communication.” IPC’s Sanjay Huprikar, president of Europe and South Asia Operations, spoke to Philip Stoten at #electronica2024 about how to reconcile the diverse needs of the #electronics industry by looking at challenges both regionally and globally and to boldly open a narrative of what the industry requires to move forward successfully. #BuildElectronicsBetter Watch interview: https://hubs.li/Q02Z94vd0
IPC at Electronica 24: Unifying the Electronics Industry with Sanjay Huprikar
https://www.youtube.com/
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IPC转发了
Have you subscribed to Global Insight yet?
When you open this week's Global Insight, you're just a scroll away from IPC's John W Mitchell's Top 3 Reads! This week, John shares about AI, Bill Gates, and this year's gadget gift guide. Check it out (and subscribe!) here: https://lnkd.in/gi8dzhiC
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IPC转发了
IPC and our team based in Europe are very pleased to have received this opportunity to collaborate with the European Space Agency - ESA on EMPS, especially as we look to broaden the manufacturing focused discussion to include other critical and high reliability verticals. As Stan Heltzel has pointed out, more details will be available in early 2025. But please mark your calendars today - we hope to see hundreds of you as attendees and potential presenters October 6-9. #BuildElectronicsBetter
It is our pleasure to announce that the ?????????????????????? ?????????????????????????? & ?????????????????? ?????????????????? (????????) will take place at ESA/ESTEC in Noordwijk, The Netherlands, from ?? ?????? ???? ?? ?????? ????????. The symposium is organised by the European Space Agency’s Materials, Manufacturing and Assembly section and EEE Components Technologies section, in partnership with IPC, the global electronics association. It aims to review the state-of-the-art and new developments in the fields of printed circuit boards, electronic assembly and packaging technologies. Besides space applications, the scope of the event is widened to include other high-rel market segments, such as defence, automotive, medical and data infrastructure, that are at the heart of Europe’s electronics manufacturing industry. Microprocessor chips and other EEE components do not function in isolation. Back-end packaging of chips as well as system level packaging, when assembling EEE parts on PCBs, make up the nerves and veins of the electronic system, connecting its brains – the chips – through signals and power. The packaging technologies provide the backbone and armour, as the sensitive EEE parts need protection from mechanical and thermal stress to operate reliably and in unison within the electronic system. EMPS will be hosting professional development and technology sessions for the following topics, and more: ????Materials & processes for electronics ????Assembly technologies, including lead-free, solderless, press-fit ????Advanced packaging, including heterogeneous integration, System-in Package, Wafer Level Packaging, 3D packaging ????(U)HDI PCBs, organic substrates ????Additive Manufactured Electronics ????Reliability and testing for harsh environments ????Model-based design for excellence ????Smart manufacturing, machine learning and digitalisation ????High power, high speed applications and photonics ????System integration, packaging and performance ????Supply chain resilience, European sovereignty https://emps.port.ac.uk/
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