Integra Technologies Inc.

Don’t miss the latest #microelectronic and #semiconductor news from Micross! Read our February issue today, and register now for our monthly newsletter! ? Designers looking to increase performance and functionality are turning to chiplets, but why? Chiplet methodology enables the integration of multiple devices/functions in a single package, utilizing standardized protocols providing ease of integration, and enabling SWaP optimization. Keep up-to-date on the latest chiplet developments, and save the date for our upcoming webinar on “Chiplets - Optimized Device Integration, SWaP Performance & Time-to-Market”. Also included in this issue, a complete guide on preparing bare die & wafer for packaging, to realize maximum yield and cost savings! Meet with our product experts & executives to discuss your hi-rel requirements in person, visit the conferences where we will be exhibiting at in March. #chiplets #dieinspection #microelectronics #semiconductor #semiconductorindustry #HiRel #HighReliability

We had an amazing week at GOMACTech!?John Lannon, General Manager of Micross Advanced Interconnect Technologies, presented at the Onshoring Advanced Packaging Capabilities Workshop, where he shared the state of advanced packaging capabilities in the US along with the latest developments.?Highlighting the latest capabilities and advancements resulting from the US Department of Defense (DoD) onshoring initiatives, John included an update on the IBAS Cornerstone RESHAPE program award Micross received in 2023 through the DoD to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP)?solutions.? This is an exciting time for high-reliability advanced packaging in the US, and we are very proud to be an instrumental part of this historic manufacturing renaissance in America. We look forward to continuing the great discussions from this week in serving the high-reliability microelectronics needs of the DoD. Micross specializes in life-cycle management of critical microelectronic solutions, effectively mitigating risks and ensuring continuity of supply across the entire microelectronics supply chain. Our recent acquisition of Integra Technologies has significantly enhanced our capabilities, positioning us to offer even greater support through our fully U.S.-owned and operated secure facilities. ? #GOMACTech #DoD #electronicssupplychain #DeptofDefense #semiconductorsupplychain #usmicroelectronics #ussupplychain #defenseElectronics #300mm #WaferProcessing #AdvancedPackaging #3DHI #WLP #chiplets #chipscale #advancedpackaging #HiRel #HighReliability #microelectronics #semiconductor #semiconductorindustry

We're excited to be presenting at #GOMACTech, this week in Pasadena, CA! Join Integra as they present: 'Design, Packaging, Test and Qualification for SoC based Obsolescence Mitigation,' with Booz Allen Hamilton on March 19th and a poster presentation with ED2 Corporation on '28GHz Phased Array Module System-in-Package' on March 20th. Integra Technologies, booth 422 and Micross, booth 522

Just as pi is fundamental to mathematics, semiconductors are vital to the advancement of technology. Celebrating National Pi Day is not only about indulging in delicious pie but also appreciating the intricate and fascinating world of mathematics and technology that shapes our future.

Meet us at AUSA Global Force Symposium & Exposition, March 25 - 27 in Huntsville, Alabama! We will be showcasing our latest DC-DC power converters, Diodes, MIL-STD-1553, RF, memory, and logic products, coupled with the most comprehensive end-to-end portfolio of hi-rel microelectronic packaging, modification, testing and qualification services. Our product experts & executives will be onsite to support your program and technical needs, and look forward to meeting with you! Schedule a meeting: https://bit.ly/3FrTe3s #microelectronics #semiconductor #semiconductorindustry #HiRel #HighReliability #DefenseElectronics #radhard #powerelectronics #DCDCconverters #MILSTD1553 #RF #microwave

Integra's MARCH FAQ: DICING & DIE PREP Semiconductor dicing and die preparation are essential and intricate steps in the semiconductor fabrication process.A well-executed dicing and die preparation phase can lead to higher quality and more efficient semiconductor products. Find straightforward answers to the most frequently asked questions from our community. https://hubs.ly/Q03byxxt0 #Semiconductors #WaferProcessing #SemiconductorIndustry #WaferThinning

We're excited to be presenting at GOMACTech, March 17-20 in Pasadena, CA! Join the Integra Team as they present: 'Design, Packaging, Test and Qualification for SoC based Obsolescence Mitigation' on March 19th and'28GHz Phased Array Module System-in-Package' on March 20th. https://hubs.ly/Q039x47n0 Integra Booth #422 and Micross Components Booth #522 #Semiconductor #SemiconductorIndustry #GOMACTech #AdvancedPackaging

Congratulations to the winners of the 2025 3D InCites Awards, sponsored by EV Group and KLA The five recipients of the Technology Enablement Award identified and solved critical challenges in the commercialization and manufacturing of heterogeneous integration (HI), 3D HI, and chiplet architectures, driving the industry forward through cutting-edge solutions and advancements. They are: ACM RESEARCH, INC. Saras Micro Devices NHanced Semiconductors, Inc. Siemens Digital Industries Software and MacDermid Alpha Electronics Solutions A special Consortium Award is presented to Resonac for the progress it made with the JOINT2 and new US JOINT consortiums. This year’s Engineer of the Year Award recipient is Rex Anderson of Micross Components for his work with the RESHAPE program, as well as his ongoing engagement with peers through industry organizations, teaching and mentoring the next generation of engineers. The Best Place to Work Award, decided by an online vote, goes to Saras Micro Devices for its inclusive, dynamic, and thriving environment that fosters continuous learning, professional development, and employee well-being. Please join us in congratulating this year’s winners. Awards will be presented on March 4, at the International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference. Find more details in this blog by Fran?oise von Trapp https://lnkd.in/guHGaiNy

Semiconductor die inspection is crucial for maintaining quality, reducing costs, and ensuring the reliability of modern electronic devices. As semiconductor technology advances, the need for precise and efficient inspection methods will continue to grow, playing a key role in the success of semiconductor manufacturers. Take a look at some of our most frequently asked questions: https://hubs.ly/Q036vHsc0

This Valentine's Day, let's celebrate our passion for semiconductors, the tiny yet powerful components that drive the technology we love and rely on every day.