??Infraeo Wins Big at the 2025 Lightwave+BTR Innovation Reviews! ?? We’re thrilled to announce that Infraeo has been recognized in the 2025 Lightwave+BTR Innovation Reviews as one of the top innovators in the industry! The two awards we received reinforce our commitment to pushing the boundaries of high-performance interconnect solutions for AI clusters. ?? 1.6T OSFP Linear Equalized Active Copper Cable & Loopback Our OSFP 1.6T ACC enables low-latency, error-free data transmission up to 3 m by allowing the networking SERDES to treat the cable as passive copper interconnects to support error-free and robust data communication. Its enhanced case design minimizes signal integrity degradation at 70+°C, while a patent-pending copper+TIM heat spreader (10W/mK conductivity) and air-dynamic heatsink optimized thermal management. ?? 100G PAM4 Immersion Cooling MMF LPO Our 800G LPO series integrates advanced linear-driver technology with optimized thermal management and signal integrity, redefining linear direct drive multimode performance. Validated in single-phase and two-phase immersion cooling, it achieves sub 1E-8 BER on the Tomahawk 5 platform and supports IEEE 802.3 standards up to 100m on OM5 MMF. As the industry’s first reported LPO optical AOC/Pigtail for immersion cooling, it enables high-performance 100G PAM4 Ethernet applications in demanding environments. A huge thank you to Lightwave + BTR for this recognition! We remain committed to leading the industry with scalable, high-performance connectivity solutions that power the future. ?? Meet us at OFC 2025! Stop by our booth (3146) to see our latest innovations in action. #Infraeo #LightwaveBTR #OFC2025
Infraeo
计算机网络产品
Round Rock,Texas 226 位关注者
Optical and Copper Interconnects for 800G/1.6T AI Clusters Networking - High-Performance AOC/ACC/AEC/DAC/Transceivers
关于我们
Infraeo Inc. specializes in developing and manufacturing cutting-edge high-speed signaling and photonics technologies such as?DSP,?Redriver,?Retimer,?Photonic Integrated Circuits, and?Silicon Photonics?for?high-speed?optical and copper interconnects. We collaborate with technology partners and customers to launch reference designs, PDKs, RDKs, and products that may be quickly scaled for high-volume production and millions of units of shipment. We serve the AI/data center and enterprise networking markets by delivering low-power, low-latency, and reliable connectivity products with faster lead time, which are ultimately deployed at the most advanced AI clusters worldwide.
- 网站
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www.infraeo.com
Infraeo的外部链接
- 所属行业
- 计算机网络产品
- 规模
- 51-200 人
- 总部
- Round Rock,Texas
- 类型
- 私人持股
- 创立
- 2023
- 领域
- AI CLUSTERS CONNECTIVITY、InfiniBand 、Ethernet、Products on Nvidia/Mellanox Platforms、Cutting-Edge AI Cluster Test Bed、Proven Tier-1/Native OEM manufacturing products、200G/400G/800G optical modules and copper cables、low power and low latency technologies 、Better Performance、Interoperability and Compliance、Local Technical Service、50% Faster Lead Time than OEM、 Transceiver、Active Optical Cable、Direct Attached Cable、Active Copper Cable、Loopback、Data Center、Machine Learning和Super Computing
地点
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主要
US,Texas,Round Rock,78681
Infraeo员工
动态
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?? Key Takeaways from DesignCon 2025 ?? What an incredible week at DesignCon 2025! A huge thank you to everyone who visited our booth, engaged with our team, and joined us in discussions about the future of high-speed connectivity. Here is what we learned at DesignCon that will change the future of connectivity. ?? Infraeo is Leading the Charge in the Maturing 1.6T Market Infraeo is leading the charge in the rapidly expanding 1.6T ecosystem, driving the adoption of 1.6T interconnects as the first mover and active cable expert. As more suppliers enter the market, such as Marvell’s 1.6T AEC with Alaska A PAM4 DSP, we’re taking it to the next level at OFC 2025 with a live demo of our 1.6T ACC & AEC solutions—demonstrating our leadership in driving the adoption of 1.6T interconnects and shaping the industry's direction. ?? mSAP Technology Leading the Way to 224G per Lane & 1.6T As the first company to demonstrate 800G mSAP (Modified Semi-Additive Process) with our bare-die AEC, we are already paving the way for higher-bandwidth, next-gen solutions. We also saw a growing trend toward mSAP technology being crucial for achieving 224G per lane and 1.6T interconnects. Expect our next-gen products to integrate mSAP for even greater scalability! ?? 448G Per Lane and PAM6 – A Glimpse into the Future We were excited to see Keysight's 448G per lane PAM6 tester, highlighting the potential of PAM6 signaling for future connectivity. As data rates increase, PAM6 could be a key enabler of next-gen interconnects, and we are closely monitoring its development. ?? Immersion Cooling – A Game Changer for High-Density AI Computing With increasing data rates come greater thermal challenges, making efficient cooling solutions essential. Our products specifically designed for immersion cooling such as our OSFP SR8 800G AOC excel at managing thermals, and at OFC 2025, we will showcase our live immersion cooling demo, proving how advanced cooling solutions can enhance interconnect performance and reliability. ?? DeepSeek AI – Rethinking Efficiency in AI Compute The rise of DeepSeek AI highlights the power of algorithm-driven AI models and the effectiveness of distillation techniques. This suggests that while hardware scaling will continue to play a key role in the future, there are opportunities for optimization that can make AI models smarter and more cost-effective. As 1.6T drives the next generation of AI workloads, the demand for efficient 800G solutions remains strong. At Infraeo, we provide a complete 800G total solution, empowering AI clusters to scale intelligently while balancing cost, power efficiency, and performance. Thank you for being part of this journey with us. We look forward to continuing the conversation and shaping the future of high-speed interconnects together. Stay tuned for more updates, and we hope to see you at OFC 2025! #DesignCon2025 #AI #Hyperscaler
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? That’s a Wrap – Thank You, DesignCon 2025! ? A huge thank you to everyone who stopped by Booth 759 and attended our live demo showcasing 800G AEC, 1.6T ACC & Loopback, and our industry-first bare-die AEC technology! Your enthusiasm and engagement made this event a huge success. We’re also grateful to those who joined our technical session, where our VP of Business Development & Sales Engineering, Rehan Khan, shared insights from our newly published paper on bare-die AEC. The thought-provoking questions and discussions were incredible—so glad to exchange ideas with some of the brightest minds in the industry! As Rehan put it: "DesignCon in the Bay Area was a phenomenal gathering of brilliant minds of the interconnect world with inspiring innovation. As usual, this event fostered meaningful discussions and groundbreaking ideas that will shape the tech industry's future." This year was amazing, but next year will be even bigger and better! Stay tuned for our DesignCon wrap-up post, where we’ll share key takeaways and insights from the event. See you all next year! #DesignCon2025 #HighSpeedConnectivity #AIClusters
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?? Day 1 at DesignCon 2025: A Huge Success! ?? What an incredible first day at Booth #759! We had an amazing turnout for our live demo, showcasing 800G AEC, 1.6T ACC, 1.6T Loopback Tester, and 800G Bare-Die AEC. Thank you all for visiting us! Speaking of Bare-Die AEC, on Thursday at 8 AM in Ballroom D, our VP of Business Development & Sales Engineering, Rehan Khan, will speak on the technical innovations behind our industry-first production-ready Chip On Board AEC technology. We will also publish a paper co-authored with Wandtec and Alphawave Semi on the same topic. This innovation leverages Chip-On-Board and Modified Semi-Additive Process (mSAP) manufacturing techniques, eliminating traditional packaging to improve signal integrity, thermal dissipation, and power efficiency. These advancements significantly reduce signal loss and crosstalk while enabling forward compatibility with 224G and beyond, designed to meet Tier-1 customer needs for low power consumption and seamless integration. Don’t miss this deep dive into the future of connectivity! If you haven’t stopped by yet, come check out Booth #759 — we’re just getting started! #DesignCon2025 #HighSpeedConnectivity #800G #1.6T #Infraeo #AIClusters #HyperscaleNetworking
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?? One Week to DesignCon 2025! ?? We’re counting down the days to DesignCon 2025, and we can’t wait to showcase the groundbreaking advancements redefining connectivity! ? What to expect at Booth #759: > Discover our 10x faster cable production capabilities, supporting 200K units/month from global facilities in Mexico, South Asia, and China. > A live demo, featuring our 1.6T/800G products. > Insights into our industry-first KGD AEC – delivering unprecedented performance, lower power consumption, and seamless future compatibility. > Exclusive updates on our 1.6T cables and loopbacks built for next-gen AI and hyperscale demands. > A look at our leading ODMs and switch makers Approved Low-Power Multimode LPO. ?? Join us next week and see how Infraeo drives innovation in hyperscale and AI clusters 10x faster. Whether you're an industry expert or just exploring, we’re ready to connect and collaborate! ?? Let’s shape the future of connectivity together. See you at Booth #759! #DesignCon2025 #ConnectivityReimagined #800G #1.6T #BareDieInnovation #Infraeo #ImmersionCooling
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New Year, New Show! ?? We’re thrilled to kick off 2025 by showcasing our latest innovations at DesignCon in Santa Clara, from January 28-30! Come visit us at Booth #759 and get a firsthand look at our live demo of the groundbreaking 1.6T copper solution, designed to revolutionize data center connectivity with unmatched speed, performance, and reliability. Here’s why you don’t want to miss us: Innovative Solutions: Be the first to experience our cutting-edge DAC, ACC, and AEC products up to 1.6T. Proven Capacity: With over 1M+ units shipped last year, we’re setting benchmarks in the connectivity industry. Global Reach: Exciting plans for expanded manufacturing in Mexico and Vietnam to meet growing demands. Schedule a meeting: Book a meeting with our VP of Business Development & Sales Engineering, Rehan Khan ([email protected]), or Marketing & Sales Specialist, Bei Lin ([email protected]) to discuss how we can help take your projects to the next level. We’re ready to connect, innovate, and grow together. See you at DesignCon! #DesignCon #NetworkingSolutions #1.6T
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?? Cheers to New Year’s Eve! ?? As we close out 2024, it’s the perfect time to reflect on connections—both the personal ones we cherish and the seamless ones we enable. At Infraeo, we’ve spent the year ensuring that high-speed data flows smoothly, powering the future with every cable, transceiver, and connectivity solution we deliver. ?? Whether it’s transceivers, loopbacks, AOC, or copper solutions, our products have contributed to building the backbone of tomorrow’s technology—just as we hope your connections with loved ones will bring joy and inspiration into the new year. ?? Here’s to 2025 being as fast, flexible, and reliable as our cables (and a little less tangled)! Let’s continue building a world that’s better connected, one innovation at a time. #AI #2025 #Connectivity
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?? Hope You are having a Wonderful Holiday Break! ?? The holiday season is going strong, and our DAC Sale is going stronger! Take advantage of our top products' low lead times and unbeatable prices—perfect for kicking off 2025 with high-speed connectivity. ?? Why Choose Infraeo? ? Industry-leading lead time—just 2 days for shipping! ? Up to 50% off on featured DAC products. ? Prices up to 20% cheaper than other platforms. ?? Featured Deals: ? P-100N-O-2OR-020B – Now down to $183 ? P-100N-O-2OR-030B – Now down to $213 ? P-100N-O-4OR-020B – Now down to $282 ? P-100N-O-4OR-030B – Now down to $328 ? P-100N-O-O-020B – Now down to $145 ?? Don’t miss this opportunity to stock up on the best connectivity solutions for your AI and data center needs. Start the new year with quality, reliability, and speed—all at amazing prices! ?? Order now via our Digikey store: https://lnkd.in/gcxrzc6x #Networking #DAC #TechDeals #Infraeo #Connectivity #HolidaySale
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If AI could master one thing tomorrow, what would you choose? ?? Artificial Intelligence has already transformed how we work, live, and innovate—but its potential is far from fully realized. Imagine if AI could master one key challenge tomorrow: what would have the biggest impact on our world? From revolutionizing healthcare and solving climate change to perfecting autonomous driving or even something as simple as writing emails, the possibilities are endless. The question is, where should AI’s focus go next? At Infraeo, we’re proud to play a role in enabling the future of AI through our high-speed 800G and 1.6T connectivity solutions for data centers and AI clusters. By providing the infrastructure for these breakthroughs, we’re helping pave the way for AI’s most exciting applications. Vote below and share your thoughts in the comments! Let’s explore the future of AI together. #AI #Connectivity #Network
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?? Holiday Season Sale: 50% off on Our Best DAC Products! ?? The holidays are here, and so are the deals! We're excited to announce that some of our top DAC products are now up to 50% off in our holiday sale! Here are the featured products: ? P-100N-O-2OR-020B –Now down to 183$ ? P-100N-O-2OR-030B –Now down to 213$ ? P-100N-O-4OR-020B –Now down to 282$ ? P-100N-O-4OR-030B –Now down to 328$ ? P-100N-O-O-020B –Now down to 145$ ?? And that’s not all: These products are now up to 20% cheaper than other e-commerce platforms, with only a 2-day shipping time! ?? It’s the perfect time to stock up, save big, and upgrade your connectivity with unbeatable prices and quality. Don’t miss this limited-time offer—grab them before the year ends! ?? Visit our Digikey @ https://lnkd.in/gcxrzc6x to place your order today. #HolidayDeals #Networking #DAC #TechSales #Infraeo
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